Patents by Inventor Yuting Ji

Yuting Ji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11948983
    Abstract: A SiC ohmic contact preparation method is provided and includes: selecting a SiC substrate; preparing a graphene/SiC structure by forming a graphene on a Si-face of the SiC substrate; depositing an Au film on the graphene of the graphene/SiC structure; forming a first transfer electrode pattern on the Au film by a first photolithography; etching the Au film uncovered by the first transfer electrode pattern through a wet etching; etching the graphene uncovered by the Au film through a plasma etching after the wet etching; forming a second transfer electrode pattern on the SiC substrate by a second photolithography; depositing an Au material on the Au film exposed by the second transfer electrode pattern and forming an Au electrode and then annealing. The graphene reduces potential barrier associated with the SiC interface, specific contact resistance of ohmic contact reaches the order of 10?7˜10?8 ?·cm2, and the method has high repeatability.
    Type: Grant
    Filed: October 11, 2021
    Date of Patent: April 2, 2024
    Assignee: XIDIAN UNIVERSITY
    Inventors: Yanfei Hu, Hui Guo, Yuming Zhang, Jiabo Liang, Yanjing He, Hao Yuan, Yuting Ji
  • Publication number: 20220037480
    Abstract: A SiC ohmic contact preparation method is provided and includes: selecting a SiC substrate; preparing a graphene/SiC structure by forming a graphene on a Si-face of the SiC substrate; depositing an Au film on the graphene of the graphene/SiC structure; forming a first transfer electrode pattern on the Au film by a first photolithography; etching the Au film uncovered by the first transfer electrode pattern through a wet etching; etching the graphene uncovered by the Au film through a plasma etching after the wet etching; forming a second transfer electrode pattern on the SiC substrate by a second photolithography; depositing an Au material on the Au film exposed by the second transfer electrode pattern and forming an Au electrode and then annealing. The graphene reduces potential barrier associated with the SiC interface, specific contact resistance of ohmic contact reaches the order of 10?7˜10?8 ?·cm2, and the method has high repeatability.
    Type: Application
    Filed: October 11, 2021
    Publication date: February 3, 2022
    Inventors: Yanfei Hu, Hui Guo, Yuming Zhang, Jiabo Liang, Yanjing He, Hao Yuan, Yuting Ji
  • Patent number: 9916183
    Abstract: There is provided a method, a system and a computer program product for improving performance and fairness in sharing a cluster of dynamically available computing resources among multiple jobs. The system collects at least one parameter associated with availability of a plurality of computing resources. The system calculates, based on the collected parameter, an effective processing time each computing resource can provide to each job. The system allocates, based on the calculated effective processing time, the computing resources to the multiple jobs, whereby the multiple jobs are completed at a same time or an approximate time.
    Type: Grant
    Filed: September 2, 2016
    Date of Patent: March 13, 2018
    Assignee: International Business Machines Corporation
    Inventors: Ting He, Kang-Won Lee, Jian Tan, Yuting Ji
  • Publication number: 20160371126
    Abstract: There is provided a method, a system and a computer program product for improving performance and fairness in sharing a cluster of dynamically available computing resources among multiple jobs. The system collects at least one parameter associated with availability of a plurality of computing resources. The system calculates, based on the collected parameter, an effective processing time each computing resource can provide to each job. The system allocates, based on the calculated effective processing time, the computing resources to the multiple jobs, whereby the multiple jobs are completed at a same time or an approximate time.
    Type: Application
    Filed: September 2, 2016
    Publication date: December 22, 2016
    Inventors: Ting He, Kang-Won Lee, Jian Tan, Yuting Ji
  • Patent number: 9471390
    Abstract: There is provided a method, a system and a computer program product for improving performance and fairness in sharing a cluster of dynamically available computing resources among multiple jobs. The system collects at least one parameter associated with availability of a plurality of computing resources. The system calculates, based on the collected parameter, an effective processing time each computing resource can provide to each job. The system allocates, based on the calculated effective processing time, the computing resources to the multiple jobs, whereby the multiple jobs are completed at a same time or an approximate time.
    Type: Grant
    Filed: January 16, 2013
    Date of Patent: October 18, 2016
    Assignee: International Business Machines Corporation
    Inventors: Ting He, Kang-Won Lee, Jian Tan, Yuting Ji
  • Publication number: 20140201753
    Abstract: There is provided a method, a system and a computer program product for improving performance and fairness in sharing a cluster of dynamically available computing resources among multiple jobs. The system collects at least one parameter associated with availability of a plurality of computing resources. The system calculates, based on the collected parameter, an effective processing time each computing resource can provide to each job. The system allocates, based on the calculated effective processing time, the computing resources to the multiple jobs, whereby the multiple jobs are completed at a same time or an approximate time.
    Type: Application
    Filed: January 16, 2013
    Publication date: July 17, 2014
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Ting He, Kang-Won Lee, Jian Tan, Yuting Ji