Patents by Inventor Yu-Ting Liu

Yu-Ting Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240166874
    Abstract: A resin composition including a modified maleimide resin is provided. The modified maleimide resin is formed from a dicyclopentadiene (DCPD)-based resin having an amino group and a maleic anhydride by a condensation polymerization. The dicyclopentadiene-based resin having an amino group is formed by nitration reaction and hydrogenation reaction of dicyclopentadiene phenolic resin.
    Type: Application
    Filed: April 13, 2023
    Publication date: May 23, 2024
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Yu-Ting Liu, Hung-Yi Chang, Chia-Lin Liu, Wei-Ru Huang
  • Publication number: 20240166788
    Abstract: A modified dicyclopentadiene-based resin is provided. The modified dicyclopentadiene-based resin is formed from a dicyclopentadiene-based resin having an amino group, a phenol and a polyoxymethylene by a cyclization reaction. The dicyclopentadiene-based resin having an amino group is formed by nitration reaction and hydrogenation reaction of dicyclopentadiene phenolic resin.
    Type: Application
    Filed: March 6, 2023
    Publication date: May 23, 2024
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Hung-Yi Chang, Yu-Ting Liu
  • Publication number: 20240166781
    Abstract: A modified dicyclopentadiene-based resin and a preparation method thereof are provided. The preparation method of the modified dicyclopentadiene-based resin includes sequentially performing nitration reaction and hydrogenation reaction of a dicyclopentadiene phenolic resin to form a modified dicyclopentadiene-based resin for which the structure has at least two amino groups. The hydrogenation reaction is performed in a solvent at a temperature of 50° C. to 120° C.
    Type: Application
    Filed: December 16, 2022
    Publication date: May 23, 2024
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Yu-Ting Liu, Hung-Yi Chang
  • Publication number: 20240166817
    Abstract: A resin composition including a modified maleimide resin is provided. The modified maleimide resin is formed from a dicyclopentadiene (DCPD)-based resin having an amino group and a maleic anhydride by a condensation polymerization. The dicyclopentadiene-based resin having an amino group is formed by nitration reaction and hydrogenation reaction of dicyclopentadiene phenolic resin.
    Type: Application
    Filed: April 11, 2023
    Publication date: May 23, 2024
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Yu-Ting Liu, Hung-Yi Chang, Chia-Lin Liu, Wei-Ru Huang
  • Publication number: 20240149057
    Abstract: A device for treating a user's skin using plasma is provided. The device comprises a plasma generation assembly and a power supply. The plasma generation assembly comprises a discharge electrode including a first surface; a first dielectric material layer provided on the first surface of the discharge electrode and the first surface, a ground electrode surrounding the discharge electrode, and an insulation member spacing around the discharge electrode from the ground electrode. The power supply configured to apply power to the plasma generation assembly so that plasma is generated from the first surface of the discharge electrode to the ground electrode and between the first dielectric material layer and the user's skin.
    Type: Application
    Filed: November 4, 2022
    Publication date: May 9, 2024
    Inventors: HUI-FANG LI, YU-TING LIN, CHUN-HAO CHANG, CHIH-TUNG LIU, CHUN-PING HSIAO, YU-PIN CHENG
  • Patent number: 11972956
    Abstract: A lid attach process includes dipping a periphery of a lid in a dipping tank of adhesive material such that the adhesive material attaches to the periphery of the lid. The lid attach process further includes positioning the lid over a die attached to a substrate using a lid carrier, wherein the periphery of the lid is aligned with a periphery of the lid carrier. The lid attach process further includes attaching the lid to the substrate with the adhesive material forming an interface with the substrate. The lid attach process further includes contacting a thermal interface material (TIM) on the die with the lid.
    Type: Grant
    Filed: May 22, 2020
    Date of Patent: April 30, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chin-Liang Chen, Wei-Ting Lin, Yu-Chih Liu, Kuan-Lin Ho, Jason Shen
  • Publication number: 20240124163
    Abstract: A magnetic multi-pole propulsion array system is applied to at least one external cathode and includes a plurality of magnetic multi-pole thrusters connected adjacent to each other. Each magnetic multi-pole thruster includes a propellant provider, a discharge chamber, an anode and a plurality of magnetic components. The propellant provider outputs propellant. The discharge chamber is connected with the propellant provider to accommodate the propellant. The anode is disposed inside the discharge chamber to generate an electric field. The plurality of magnetic components is respectively disposed on several sides of the discharge chamber. One of the several sides of the discharge chamber of the magnetic multi-pole thruster is applied for one side of a discharge chamber of another magnetic multi-pole thruster.
    Type: Application
    Filed: December 19, 2022
    Publication date: April 18, 2024
    Applicant: National Cheng Kung University
    Inventors: Yueh-Heng Li, Yu-Ting Wu, Chao-Wei Huang, Wei-Cheng Lo, Hsun-Chen Hsieh, Ping-Han Huang, Yi-Long Huang, Sheng-Wen Liu, Wei-Cheng Lien
  • Publication number: 20240108230
    Abstract: The embodiments of the disclosure provide a method for evaluating a health condition indicator of a subject, a host, and a computer readable storage medium. The method includes: obtaining a reference heart rate of the subject and determining a heart rate indicator of the subject according to the reference heart rate; determining a fitness indicator of the subject based on physiological information of the subject; determining an age indicator of the subject based on an age of the subject; and determining the health condition indicator of the subject at least based on the heart rate indicator, the fitness indicator, and the age indicator.
    Type: Application
    Filed: September 30, 2022
    Publication date: April 4, 2024
    Applicant: BOMDIC INC.
    Inventors: Yao Shiao, Shao Wen Tou, Yu-Ting Liu, Amy Pei-Ling Chiu
  • Publication number: 20240114810
    Abstract: A semiconductor structure includes: an etch-stop dielectric layer overlying a substrate and including a first opening therethrough; a silicon oxide plate overlying the etch-stop dielectric layer and including a second opening therethrough; a first conductive structure including a first electrode and extending through the second opening and the first opening; a memory film contacting a top surface of the first conductive structure and including a material that provides at least two resistive states having different electrical resistivity; and a second conductive structure including a second electrode and contacting a top surface of the memory film.
    Type: Application
    Filed: April 20, 2023
    Publication date: April 4, 2024
    Inventors: Fu-Ting Sung, Jhih-Bin Chen, Hung-Shu Huang, Hong Ming Liu, Hsia-Wei Chen, Yu-Wen Liao, Wen-Ting Chu
  • Publication number: 20240096781
    Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.
    Type: Application
    Filed: March 20, 2023
    Publication date: March 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Ti Lu, Hao-Yi Tsai, Chia-Hung Liu, Yu-Hsiang Hu, Hsiu-Jen Lin, Tzuan-Horng Liu, Chih-Hao Chang, Bo-Jiun Lin, Shih-Wei Chen, Hung-Chun Cho, Pei-Rong Ni, Hsin-Wei Huang, Zheng-Gang Tsai, Tai-You Liu, Po-Chang Shih, Yu-Ting Huang
  • Publication number: 20240094902
    Abstract: A method for selecting an application and associated operational guidance to utilize on a mobile device is disclosed. In one embodiment, such a method identifies a selected environment of interest. Within the selected environment, the method identifies one or more applications that are commonly utilized by users within the selected environment and documents the one or more applications. The method detects physical entry of a particular user into the selected environment and, in response to detecting the entry, automatically notifies the particular user of the one or more applications that are commonly utilized within the selected environment. In certain embodiments, the method enables the user to quickly launch the one or more applications and/or provides operational guidance to the user with regard to using the one or more applications. A corresponding system and computer program product are also disclosed.
    Type: Application
    Filed: September 20, 2022
    Publication date: March 21, 2024
    Applicant: International Business Machines Corporation
    Inventors: Xiang Wei Li, Dong Chen, Ye Chuan Wang, Ting Ting Zhan, Ju Ling Liu, Yu An, Wei Yan
  • Publication number: 20240087947
    Abstract: A semiconductor device and method of manufacture are provided. In some embodiments isolation regions are formed by modifying a dielectric material of a dielectric layer such that a first portion of the dielectric layer is more readily removed by an etching process than a second portion of the dielectric layer. The modifying of the dielectric material facilitates subsequent processing steps that allow for the tuning of a profile of the isolation regions to a desired geometry based on the different material properties of the modified dielectric material.
    Type: Application
    Filed: January 10, 2023
    Publication date: March 14, 2024
    Inventors: Chung-Ting Ko, Yu-Cheng Shiau, Li-Jung Kuo, Sung-En Lin, Kuo-Chin Liu
  • Publication number: 20240067746
    Abstract: Disclosed herein are humanized antibodies, antigen-binding fragments thereof, and antibody conjugates, that are capable of specifically binding to certain biantennary Lewis antigens, which antigens are expressed in a variety of cancers. The presently disclosed antibodies are useful to target antigen-expressing cells for treatment or detection of disease, including various cancers. Also provided are polynucleotides, vectors, and host cells for producing the disclosed antibodies and antigen-binding fragments thereof. Pharmaceutical compositions, methods of treatment and detection, and uses of the antibodies, antigen-binding fragments, antibody conjugates, and compositions are also provided.
    Type: Application
    Filed: February 28, 2023
    Publication date: February 29, 2024
    Inventors: Tong-Hsuan CHANG, Mei-Chun YANG, Liahng-Yirn LIU, Jerry TING, Shu-Yen CHANG, Yen-Ying CHEN, Yu-Yu LIN, Shu-Lun TANG
  • Publication number: 20240023235
    Abstract: The present disclosure provides a package device including a redistribution layer. The redistribution layer includes a first dielectric layer, a conductive layer, and a second dielectric layer, and the conductive layer is disposed between the first dielectric layer and the second dielectric layer, wherein the redistribution layer has a test mark, the test mark includes a conductive pattern formed of the conductive layer, the conductive pattern includes a center portion and a plurality of extension portions, and the plurality of extension portions are respectively connected to the center portion.
    Type: Application
    Filed: September 27, 2023
    Publication date: January 18, 2024
    Applicant: InnoLux Corporation
    Inventors: Yeong-E CHEN, Cheng-En CHENG, Yu-Ting LIU
  • Publication number: 20240006249
    Abstract: The present disclosure provides an electronic device including a redistribution layer, a plurality of passive components, and an electronic component. The redistribution layer includes a first insulating layer, a second insulating layer, and a plurality of traces electrically connected to each other through a first opening of the first insulating layer and a second opening of the second insulating layer, wherein the first insulating layer has a first side away from the second insulating layer, and the second insulating layer has a second side away from the first insulating layer. The passive components are disposed on the first side. The electronic component is disposed on the second side. The plurality of passive components are electrically connected to the electronic component through the plurality of traces.
    Type: Application
    Filed: September 19, 2023
    Publication date: January 4, 2024
    Applicant: InnoLux Corporation
    Inventors: Yeong-E CHEN, Kuang-Chiang HUANG, Yu-Ting LIU, Yi-Hung LIN, Cheng-En CHENG
  • Patent number: 11839456
    Abstract: The present invention discloses a method for determining a maximum value of a heart rate data of a user performing a physical activity. Acquire first heart rate data in a first duration of the physical activity performed by the user. Acquire motion data in the first duration of the physical activity performed by the user. Calculate second heart rate data based on the motion data in the first duration of the physical activity performed by the user by a mathematical model and estimate the maximum value of the heart rate data of the user based on a comparison between the first first heart rate data and the second heart rate data.
    Type: Grant
    Filed: July 14, 2021
    Date of Patent: December 12, 2023
    Assignee: BOMDIC INC.
    Inventors: Szu-Hong Chen, Pin-Yu Chen, Tai-Yu Huang, Yu-Ting Liu
  • Patent number: 11823587
    Abstract: A virtual reality system with an inspecting function of assembling and disassembling and an inspection method of assembling and disassembling based on virtual reality are presented. A learning-end acquires an inspection data and a teaching assembling-disassembling record being set with a plurality of checkpoints, plays the teaching assembling-disassembling record, modifies a learning assembling-disassembling status of a plurality of virtual objects based on user's operations for assembling or disassembling. The learning-end issues an assembling-disassembling error reminder when the learning assembling-disassembling status is inconsistent with a teaching assembling-disassembling status at any of the checkpoints.
    Type: Grant
    Filed: May 16, 2022
    Date of Patent: November 21, 2023
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Yao-Han Yen, Wen-Hsin Lo, Yu-Ting Liu, Guan-Jhih Liou
  • Patent number: 11812549
    Abstract: A package device and a manufacturing method thereof are provided. The package device includes a redistribution layer. The redistribution layer includes a first dielectric layer, a conductive layer, and a second dielectric layer, and the conductive layer is disposed between the first dielectric layer and the second dielectric layer, wherein the redistribution layer has a test mark, the test mark includes a conductive pattern formed of the conductive layer, the conductive pattern includes a center portion and a plurality of extension portions, and the plurality of extension portions are respectively connected to the center portion.
    Type: Grant
    Filed: January 10, 2023
    Date of Patent: November 7, 2023
    Assignee: InnoLux Corporation
    Inventors: Yeong-E Chen, Cheng-En Cheng, Yu-Ting Liu
  • Patent number: 11804991
    Abstract: A sequence detection device includes a decision-feedback equalizer (DFE), a combining circuit, a decision circuit, and a sequence detection circuit. The DFE processes a symbol decision signal to generate a first equalized signal. The combining circuit combines a data signal and the first equalized signal to generate a sample signal. The decision circuit performs hard decision upon the sample signal to generate the symbol decision signal. The sequence detection circuit performs sequence detection upon the data signal to generate and output a symbol sequence. Regarding the sequence detection, the sequence detection circuit selects branches for branch metric calculation according to at least the symbol decision signal.
    Type: Grant
    Filed: August 22, 2022
    Date of Patent: October 31, 2023
    Assignee: MEDIATEK INC.
    Inventors: Yu-Ting Liu, Che-Yu Chiang, Deng-Fu Weng
  • Patent number: 11798853
    Abstract: The present disclosure provides a manufacturing method of a package device, which includes providing a carrier substrate, a first conductive layer, and a release layer, where the carrier substrate has a device region and a peripheral region, and the first conductive layer and the release layer are disposed on the carrier substrate. The method further includes forming a second conductive layer on the release layer in the device region, where at least one of the first and second conductive layers includes a first pad in the peripheral region. The second conductive layer includes a second pad electrically connected to the first pad through the first conductive layer. The method also includes performing an inspection step to provide an input signal to one of the first and second pads, and to receive an output signal from another of the first and second pads.
    Type: Grant
    Filed: May 10, 2021
    Date of Patent: October 24, 2023
    Assignee: InnoLux Corporation
    Inventors: Yeong-E Chen, Kuang-Chiang Huang, Yu-Ting Liu, Yi-Hung Lin, Cheng-En Cheng