Abstract: Provided is a conductive particle which can effectively suppress occurrence of connection failure. A conductive particle (1, 11, 21) according to the present invention is a conductive particle including a base particle (2) and a conductive portion (3, 12, 22) disposed on a surface of the base particle, in which a particle diameter of the conductive particle is 30 ?m or more, and a ratio of a resistance value (R20) of the conductive particle after loading and unloading up to 20% compression deformation of the conductive particle are repeated 20 times to a resistance value (R1) of the conductive particle after loading and unloading up to 20% compression deformation of the conductive particle are performed once is 1.5 or less.

Abstract: Provided is a metal-containing particle which can be bonded to another particle or another member by melting a tip of a protrusion in the metal-containing particle at a relatively low temperature and solidifying the melt after melting, enhance connection reliability, suppress an ion migration phenomenon, and enhance insulation reliability. The metal-containing particle according to the present invention is a metal-containing particle, an outer surface of which has a plurality of protrusions, in which the metal-containing particle includes a base particle, a metal section which is disposed on a surface of the base particle, an outer surface of the metal section having a plurality of protrusions, and a metal film covering the outer surface of the metal section, and a tip of the protrusion in the metal-containing particle is meltable at 400° C. or less.