Abstract: An under-screen optical fingerprint module, a display screen assembly, and an electronic device are provided. The under-screen optical fingerprint module includes an image sensor and a light transmission layer. The image sensor has multiple photosensitive units. The light transmission layer is located below a display screen body and covers the image sensor. The light transmission layer is provided with optical transmission paths each corresponding to one photosensitive unit. Each optical transmission path is provided with a collimating element and a light outlet. Light transmitted through the display screen body enters the optical transmission paths through the collimating elements, travels to the light outlets along the optical transmission paths, and is incident on the corresponding photosensitive units from the light outlets.

Abstract: An optical fingerprint sensor and an electronic device having same are provided. The optical fingerprint sensor includes a light-sensing element, an optical filter layer and an optical lens. The light-sensing element includes: a light-sensing base layer having a groove in a side surface thereof; a first light-sensing layer configured to receive visible light and arranged in the groove; and a second light-sensing layer configured to receive invisible light, and arranged between an inner wall surface of the groove and an outer wall surface of the first light-sensing layer. The optical filter layer is stacked on a side of the light-sensing element where the groove is formed. The optical lens is configured for focusing and stacked on a side of the optical filter layer facing away from the light-sensing element.

Abstract: In an embodiment, a phase shifter includes: a light input end; a light output end; a p-type semiconductor material, and an n-type semiconductor material contacting the p-type semiconductor material along a boundary area, wherein the boundary area is greater than a length from the light input end to the light output end multiplied by a core width of the phase shifter.

Abstract: A method of optimizing production cycle queue time includes selecting a plurality of process steps for a production cycle, calculating queue times for each of the plurality of process steps, statistically analyzing the queue times, and generating at least one visual output that illustrates the statistically analyzed queue times.

Abstract: A method of optimizing production cycle queue time includes selecting a plurality of process steps for a production cycle, calculating queue times for each of the plurality of process steps, statistically analyzing the queue times, and generating at least one visual output that illustrates the statistically analyzed queue times.

Abstract: Methods, systems, and computer program products for managing movement of work-in-process materials between processing units in an automated manufacturing environment are provided. A system includes a host system in communication with a work-in-process (WIP) material lot. The system also includes an application executing on the host. The application implements a method that includes tracking a position of the WIP material lot, receiving a list of the processing units designated to be inoperative during a down time, and receiving a start time and a duration of the down time. The method also includes determining a maximum dwell time for each of the designated processing units and scheduling movement of the WIP material lot during an interim between a current time and the start time of the down time based on current position of the work-in-process material lot, the current time, the start time and duration of the down time, and the maximum dwell time.

Abstract: Methods, systems, and computer program products for managing movement of work-in-process materials between processing units in an automated manufacturing environment are provided. A system includes a host system in communication with a work-in-process (WIP) material lot. The system also includes an application executing on the host. The application implements a method that includes tracking a position of the WIP material lot, receiving a list of the processing units designated to be inoperative during a down time, and receiving a start time and a duration of the down time. The method also includes determining a maximum dwell time for each of the designated processing units and scheduling movement of the WIP material lot during an interim between a current time and the start time of the down time based on current position of the work-in-process material lot, the current time, the start time and duration of the down time, and the maximum dwell time.

Abstract: Methods, systems, and computer program products for managing movement of work-in-process materials (WIPs) between processing units are provided. A system includes a host system and an application executing thereon. The application implements a method that includes receiving a list of WIP lots, and indexing a list of routes with raw process time by process steps and with safe holding points. The method also includes indexing a scheduled start time of shutdown for the process units and calculating transport time for moving each of the lots to the next nearest safe holding point in the route. For each lot, the method includes determining whether the lot is at a safe holding point, and assigning a dispatch priority to the lot if it is not at the safe holding point. The method further includes sending a list of assigned dispatch priorities to a dispatcher for transporting the lots to corresponding safe holding points prior to initiating the shutdown.

Abstract: Methods, systems, and computer program products for managing movement of work-in-process materials between processing units in an automated manufacturing environment are provided. A system includes a host system in communication with a work-in-process (WIP) material lot. The system also includes an application executing on the host. The application implements a method that includes tracking a position of the WIP material lot, receiving a list of the processing units designated to be inoperative during a down time, and receiving a start time and a duration of the down time. The method also includes determining a maximum dwell time for each of the designated processing units and scheduling movement of the WIP material lot during an interim between a current time and the start time of the down time based on current position of the work-in-process material lot, the current time, the start time and duration of the down time, and the maximum dwell time.

Abstract: Controlling stocker capacity in an automated facility and controlling monitor budgets by capped releases, capped FOUP supplies, and wafer reuse methodology. A Database is used to order, track, and reclaim test (monitor) wafers in the FAB. The database automatically controls the amount of FOUPs in the FAB as well as the amount of wafers released into the FAB each day. This database also interacts with the Control Center in helping to release monitor wafers in the FAB.

Abstract: The present invention is intended for use on BiCMOS technology where the BJTs are formed after the FETs. A thin FET protection layer 26 is deposited on the raised and recessed regions 28 of the semiconductor substrate 10. A selectively removable filler layer 30 is then deposited on the FET protection layer 26 with a thickness to over-fill the recessed regions 28 of the gates 24 of the FETs. The selectively removable filler layer 30 is then planarized until the FET protection layer 26 on top of the gates 24 is exposed. The recessed regions 28 between the gates 24 are left substantially filled with selectively removable filler layer 30. The selectively removable filler layer 30 in the region where the BJT is formed is patterned and an opening 32 is made to allow for the depositing of layers of different materials 34, 36, 38, 40, 42, 44 used in the construction of the BJT. The layer of different materials 34, 36, 38, 40, 42, 44 are processed by methods known in the art to form polysilicon emitter 46 of the BJT.

Abstract: An apparatus and method of planarizing objects, particularly electronic components. The off-concentric polishing system of the present invention comprises at least two polishing platens positioned adjacent each other such that the polishing portions of the platens are substantially co-planar. At least one wafer carrier is moveably mounted over the at least two platens such that a wafer may be polished by more than one platen substantially simultaneously. The platen configurations may be in a linear or non-linear configuration such that the wafer being polished is no longer centrally disposed over a single platen but is off-concentrically positioned over multiple platens. The off-concentric positioning of the wafer provides enhanced slurry distribution and endpoint detection. The present invention reduces time and cost in manufacturing electronic components by engaging several polishing conditions simultaneously without the need for sequential polishing.

Abstract: An apparatus and method of planarizing objects, particularly electronic components. The off-concentric polishing system of the present invention comprises at least two polishing platens positioned adjacent each other such that the polishing portions of the platens are substantially co-planar. At least one wafer carrier is moveably mounted over the at least two platens such that a wafer may be polished by more than one platen substantially simultaneously. The platen configurations may be in a linear or non-linear configuration such that the wafer being polished is no longer centrally disposed over a single platen but is off-concentrically positioned over multiple platens. The off-concentric positioning of the wafer provides enhanced slurry distribution and endpoint detection. The present invention reduces time and cost in manufacturing electronic components by engaging several polishing conditions simultaneously without the need for sequential polishing.