Patents by Inventor Yuuichi Komizo

Yuuichi Komizo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6059175
    Abstract: The present invention provides (1) diffusion bonding methods for joining metallic materials like carbon steels or stainless steels,interposing a bonding material, such as 10 to 80 .mu.m thick Ni-based alloy with the melting point of 1150.degree. C. or lower,between base materials, heating so that the length heated at 800.degree. C. or above measures from 3 to 20 mm, in case of joining stainless steels a bonded layer, further, being heated between the both melting points, and applying the compressive stress, for example 0.5 to 2 kgf/mm.sup.2, so that a lateral expansion ratio is made within 1.0 to 1.1, and (2) a joined structure having the bonded joint formed thereby.
    Type: Grant
    Filed: November 28, 1997
    Date of Patent: May 9, 2000
    Assignee: Sumitomo Metal Industries, Ltd.
    Inventors: Masahiko Hamada, Yasuto Fukada, Masakatsu Ueda, Yuuichi Komizo
  • Patent number: 6024276
    Abstract: The method provides a diffusion-bonding of dual-phase stainless steel material having excellent strength and corrosion. The method includes: cold-working a material to be bonded so as to enhance the proof stress; inserting into the bonding portion an insert material; applying pressure thereto while performing shielding by mixed nitrogen/argon gas; heating the restricted bonding portion; cooling at a restricted rate; so as to form a bonded portion having the ferritic phase percentage of 30-70% by volume.
    Type: Grant
    Filed: July 17, 1998
    Date of Patent: February 15, 2000
    Assignee: Sumitomo Metal Industries, Ltd.
    Inventors: Hiroyuki Hirata, Yuuichi Komizo, Yasuto Fukada, Masakatsu Ueda