Abstract: The present invention relates to a mold releasing film for printed circuit board production, which comprises a resin layer (P) containing (A) a polyphenylene ether-based resin in an amount of 50 wt % or more. According to the present invention, it is possible to provide a mold releasing film suitable for production of printed circuit boards, particularly flexible printed circuit boards, which is excellent in mold-releasing property, exhibits little heat shrinkage, hardly imparts wrinkles to printed circuit board products, itself hardly gets wrinkled, and is excellent in contamination resistance since no bleeding-out is observed, and which is also excellent in an anti-moisture absorbing property, shape-following property, less overflow of adhesive, adhesion between multilayer films and slipping property between films.

Abstract: The present invention relates to a mold releasing film for printed circuit board production, which comprises a resin layer (P) containing (A) a polyphenylene ether-based resin in an amount of 50 wt % or more. According to the present invention, it is possible to provide a mold releasing film suitable for production of printed circuit boards, particularly flexible printed circuit boards, which is excellent in mold-releasing property, exhibits little heat shrinkage, hardly imparts wrinkles to printed circuit board products, itself hardly gets wrinkled, and is excellent in contamination resistance since no bleeding-out is observed, and which is also excellent in an anti-moisture absorbing property, shape-following property, less overflow of adhesive, adhesion between multilayer films and slipping property between films.

Abstract: The present invention relates to a mold releasing film for printed circuit board production, which comprises a resin layer (P) containing (A) a polyphenylene ether-based resin in an amount of 50 wt % or more. According to the present invention, it is possible to provide a mold releasing film suitable for production of printed circuit boards, particularly flexible printed circuit boards, which is excellent in mold-releasing property, exhibits little heat shrinkage, hardly imparts wrinkles to printed circuit board products, itself hardly gets wrinkled, and is excellent in contamination resistance since no bleeding-out is observed, and which is also excellent in an anti-moisture absorbing property, shape-following property, less overflow of adhesive, adhesion between multilayer films and slipping property between films.

Abstract: The present invention provides: a resin-made mechanical element for optical disk drives, comprising a filler reinforced resin composition obtained by blending from 5 to 150 parts by weight of an inorganic filler in a flake form to 100 parts by weight of a resin composition comprising from 30 to 90% by weight of a polyphenylene sulfide resin, from 70 to 10% by weight of a polyphenylene ether resin and a compatibilizing agent, or a resin-made mechanical element for optical disk drives, comprising a filler reinforced resin composition obtained by blending a combination of an inorganic filler in a flake form and a fibrous reinforcing filler in a total amount of 5 to 150 parts by weight with 100 parts by weight of a resin composition comprising from 30 to 90% by weight of a polyphenylene sulfide resin, from 70 to 10% by weight of a polyphenylene ether resin and a compatibilizing agent.

Abstract: The present invention relates to a mold releasing film for printed circuit board production, which comprises a resin layer (P) containing (A) a polyphenylene ether-based resin in an amount of 50 wt % or more. According to the present invention, it is possible to provide a mold releasing film suitable for production of printed circuit boards, particularly flexible printed circuit boards, which is excellent in mold-releasing property, exhibits little heat shrinkage, hardly imparts wrinkles to printed circuit board products, itself hardly gets wrinkled, and is excellent in contamination resistance since no bleeding-out is observed, and which is also excellent in an anti-moisture absorbing property, shape-following property, less overflow of adhesive, adhesion between multilayer films and slipping property between films.

Abstract: The present invention provides: a resin-made mechanical element for optical disk drives, comprising a filler reinforced resin composition obtained by blending from 5 to 150 parts by weight of an inorganic filler in a flake form to 100 parts by weight of a resin composition comprising from 30 to 90% by weight of a polyphenylene sulfide resin, from 70 to 10% by weight of a polyphenylene ether resin and a compatibilizing agent, or a resin-made mechanical element for optical disk drives, comprising a filler reinforced resin composition obtained by blending a combination of an inorganic filler in a flake form and a fibrous reinforcing filler in a total amount of 5 to 150 parts by weight with 100 parts by weight of a resin composition comprising from 30 to 90% by weight of a polyphenylene sulfide resin, from 70 to 10% by weight of a polyphenylene ether resin and a compatibilizing agent.