Patents by Inventor Yuuji Namie

Yuuji Namie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CHEMICAL MECHANICAL POLISHING AQUEOUS DISPERSION AND CHEMICAL MECHANICAL POLISHING METHOD FOR SEMICONDUCTOR DEVICE
    Publication number: 20140011360
    Abstract: A chemical mechanical polishing aqueous dispersion of the invention includes (A) a first water-soluble polymer having a weight average molecular weight of 500,000 to 2,000,000 and including a heterocyclic ring in its molecule, (B) a second water-soluble polymer or its salt having a weight average molecular weight of 1000 to 10,000 and including one group selected from a carboxyl group and a sulfonic group, (C) an oxidizing agent, and (D) abrasive grains, and has a pH of 7 to 12.
    Type: Application
    Filed: September 16, 2013
    Publication date: January 9, 2014
    Applicant: JSR CORPORATION
    Inventors: Yuuji NAMIE, Tomohisa Konno, Masayuki Motonari, Hirotaka Shida, Akihiro Takemura
  • Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method for semiconductor device
    Patent number: 8574330
    Abstract: A chemical mechanical polishing aqueous dispersion of the invention includes (A) a first water-soluble polymer having a weight average molecular weight of 500,000 to 2,000,000 and including a heterocyclic ring in its molecule, (B) a second water-soluble polymer or its salt having a weight average molecular weight of 1000 to 10,000 and including one group selected from a carboxyl group and a sulfonic group, (C) an oxidizing agent, and (D) abrasive grains, and has a pH of 7 to 12.
    Type: Grant
    Filed: September 27, 2007
    Date of Patent: November 5, 2013
    Assignee: JSR Corporation
    Inventors: Yuuji Namie, Tomohisa Konno, Masayuki Motonari, Hirotaka Shida, Akihiro Takemura
  • AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING AND CHEMICAL MECHANICAL POLISHING METHOD FOR SEMICONDUCTOR DEVICE
    Publication number: 20090221213
    Abstract: A chemical mechanical polishing aqueous dispersion of the invention includes (A) a first water-soluble polymer having a weight average molecular weight of 500,000 to 2,000,000 and including a heterocyclic ring in its molecule, (B) a second water-soluble polymer or its salt having a weight average molecular weight of 1000 to 10,000 and including one group selected from a carboxyl group and a sulfonic group, (C) an oxidizing agent, and (D) abrasive grains, and has a pH of 7 to 12.
    Type: Application
    Filed: September 27, 2007
    Publication date: September 3, 2009
    Applicant: JRS CORPORATION
    Inventors: Yuuji Namie, Tomohisa Konno, Masayuki Motonari, Hirotaka Shida, Akihiro Takemura