Abstract: A recycle system for a manufactured article including an input unit which inputs first information relating to the manufactured article and a storage unit which stores second information relating to recycle processes and third information relating to materials to be controlled by the recycle system. A computation unit is provided which determines whether or not the first information includes information indicative of at least one of the materials stored as the third information, and which selects a recycle process from the second information according to the result of determination, and an output unit is provided which outputs information of the selected recycle process.

Abstract: A system promoting a proper recycle of discarded article and contributing economization of energy consumption which will otherwise increase, reduction in the amount of wastes and prevention of environmental pollution due to harmful substances. A recycle system includes an input unit for inputting information concerning article, a storage for storing databases of information for reuse of the articles, a recycle processing method deciding processor for deciding a recycle processing for the article in accordance with recycling rules determined previously by referencing the information for the reuse of the article as contained in the database stored in the storage unit on the basis of the information concerning the article inputted through the input unit, and a recycle factory equipment control unit functioning as an output unit for outputting the result of the decision to a succeeding process.

Abstract: Provided is a lead-free solder for connecting LSI and parts on organic substrates, which can provide soldering at a maximum temperature of 220.degree.-230.degree. C. and which has a sufficient reliability in mechanical strength even at a high temperature of 150.degree. C. Also provided are electronic products prepared using this lead-free solder. The lead-free solder has a solder composition including 3-5% Zn and 10-23% Bi, the balance being Sn. Preferably, the solder composition is a composition (Sn, Zn, Bi) surrounded by lines connecting A and B, B and C and C and A, where A is (85, 5, 10 ), B is (72, 5, 23) and C is (76, 3, 21), of a ternary diagram having pure Sn, pure Zn and pure Bi at the vertices of an equilateral triangle. Through use of this solder, it is possible to solder parts, etc. on conventionally employed organic substrates at reflow temperatures equivalent to those for conventional Pb--Sn eutectic solders. The solder does not damage the environment, can be stably supplied and is low in cost.