Abstract: An electronic control device includes one or more substrates, a casing, a plurality of circuit blocks, a common wire, a plurality of branch wires and two interrupt wires. The circuit blocks are disposed on the substrates and the substrates are disposed in the casing. The common wire is shared by the circuit blocks. The branch wires are respectively coupled between the circuit blocks and the common wire. The two interrupt wires are respectively coupled with two of the common wire and the branch wires for overcurrent protection of the circuit blocks.

Abstract: An electronic control device includes a substrate, a plurality of component-mounted wires disposed on the substrate, a plurality of electronic components mounted on the respective component-mounted wires, a common wire disposed on the substrate and coupled with each of the electronic components, an interrupt wire coupled between one of the component-mounted wires and the common wire, a connection wire via which the interrupt wire is coupled with one of the common wire and the one of the component-mounted wires, and a solder disposed between each of the electronic components and a corresponding one of the component-mounted wires and having a lower melting point than the interrupt wire. The interrupt wire is configured to melt in accordance with heat generated by an overcurrent so as to interrupt a coupling between the one of the component-mounted wires and the common wire.

Abstract: An electronic control device includes a substrate, a plurality of component-mounted wires, a plurality of electronic components, a common wire, an interrupt wire and a protective layer. The component-mounted wires and the common wire are disposed on the substrate. The electronic components are mounted on the respective component-mounted wires and are coupled with the common wire. The interrupt wire is coupled between one component-mounted wire and the common wire, and is configured to melt in accordance with heat generated by an overcurrent to interrupt a coupling between the component-mounted wire and the common wire. The protective layer covers a surface of the substrate including the interrupt wire and defines an opening portion so that at least a portion of the interrupt wire is exposed.

Abstract: An electronic control device includes a substrate, component-mounted wires disposed on the substrate, electronic components mounted on the respective component-mounted wires, a common wire disposed on the substrate and coupled with each of the electronic components, and an interrupt wire coupled between one of the component-mounted wires and the common wire. The interrupt wire melts in accordance with heat generated by an overcurrent. The interrupt wire includes a first wire section and a second wire section shorter than the first wire section. The first wire section and the second wire section is coupled with each other at a predetermined angle that is determined so that one of the wire sections is coupled with the common wire and the other is coupled with the one of the component-mounted wires.

Abstract: An electronic control device includes one or more substrates, a casing, a plurality of circuit blocks, a common wire, a plurality of branch wires and two interrupt wires. The circuit blocks are disposed on the substrates and the substrates are disposed in the casing. The common wire is shared by the circuit blocks. The branch wires are respectively coupled between the circuit blocks and the common wire. The two interrupt wires are respectively coupled with two of the common wire and the branch wires for overcurrent protection of the circuit blocks.

Abstract: An electronic control device includes a substrate, a plurality of component-mounted wires, a plurality of electronic components, a common wire, an interrupt wire and a protective layer. The component-mounted wires and the common wire are disposed on the substrate. The electronic components are mounted on the respective component-mounted wires and are coupled with the common wire. The interrupt wire is coupled between one component-mounted wire and the common wire, and is configured to melt in accordance with heat generated by an overcurrent to interrupt a coupling between the component-mounted wire and the common wire. The protective layer covers a surface of the substrate including the interrupt wire and defines an opening portion so that at least a portion of the interrupt wire is exposed.

Abstract: An electronic control device includes one or more substrates, a casing, a plurality of circuit blocks, a common wire, a plurality of branch wires and two interrupt wires. The circuit blocks are disposed on the substrates and the substrates are disposed in the casing. The common wire is shared by the circuit blocks. The branch wires are respectively coupled between the circuit blocks and the common wire. The two interrupt wires are respectively coupled with two of the common wire and the branch wires for overcurrent protection of the circuit blocks.

Abstract: An electronic control device includes a substrate, a plurality of component-mounted wires, a plurality of electronic components, a common wire, an interrupt wire and a protective layer. The component-mounted wires and the common wire are disposed on the substrate. The electronic components are mounted on the respective component-mounted wires and are coupled with the common wire. The interrupt wire is coupled between one component-mounted wire and the common wire, and is configured to melt in accordance with heat generated by an overcurrent to interrupt a coupling between the component-mounted wire and the common wire. The protective layer covers a surface of the substrate including the interrupt wire and defines an opening portion so that at least a portion of the interrupt wire is exposed.

Abstract: An electronic control device includes a substrate, a plurality of component-mounted wires disposed on the substrate, a plurality of electronic components mounted on the respective component-mounted wires, a common wire disposed on the substrate and coupled with each of the electronic components, an interrupt wire coupled between one of the component-mounted wires and the common wire, a connection wire via which the interrupt wire is coupled with one of the common wire and the one of the component-mounted wires, and a solder disposed between each of the electronic components and a corresponding one of the component-mounted wires and having a lower melting point than the interrupt wire. The interrupt wire is configured to melt in accordance with heat generated by an overcurrent so as to interrupt a coupling between the one of the component-mounted wires and the common wire.

Abstract: An electronic control device includes a substrate, a plurality of component-mounted wires disposed on the substrate, a plurality of electronic components mounted on the respective component-mounted wires, a common wire coupled with each of the electronic components, an interrupt wire coupled between one of the component-mounted wires and the common wire, and a heat release portion. The interrupt wire melts in accordance with heat generated by an overcurrent. The heat release portion is attached to the common wire and is disposed at a position where a wiring distance from the interrupt wire is shorter than a wiring distance between the interrupt wire and any of the electronic components except for one of the electronic components mounted on the one of the component-mounted wires.

Abstract: An electronic control device includes a substrate, a plurality of component-mounted wires disposed on the substrate, a plurality of electronic components mounted on the respective component-mounted wires, a common wire disposed on the substrate and coupled with each of the electronic components, an interrupt wire coupled between one of the component-mounted wires and the common wire, a connection wire via which the interrupt wire is coupled with one of the common wire and the one of the component-mounted wires, and a solder disposed between each of the electronic components and a corresponding one of the component-mounted wires and having a lower melting point than the interrupt wire. The interrupt wire is configured to melt in accordance with heat generated by an overcurrent so as to interrupt a coupling between the one of the component-mounted wires and the common wire.

Abstract: A signal input circuit includes: a signal input device having a signal input terminal; an inspection capacitor connected between the signal input terminal and a reference potential; a connection unit connecting/disconnecting an inspection path between the inspection capacitor and the signal input terminal; a charge and discharge unit charging/discharging the inspection capacitor; and a determination processing unit carrying out a terminal failure detection processing. The determination processing unit controls the connection unit to disconnect the inspection path and controls the charge and discharge unit to set the voltage of the inspection capacitor to a terminal inspection voltage in a charge and discharge procedure, controls the connection unit to connect the inspection path in a continuity establishing procedure, and detects the terminal failure at the signal input terminal or a communication path from the signal input terminal based on a voltage of the inspection path.

Abstract: An electronic control device includes one or more substrates, a casing, a plurality of circuit blocks, a common wire, a plurality of branch wires and two interrupt wires. The circuit blocks are disposed on the substrates and the substrates are disposed in the casing. The common wire is shared by the circuit blocks. The branch wires are respectively coupled between the circuit blocks and the common wire. The two interrupt wires are respectively coupled with two of the common wire and the branch wires for overcurrent protection of the circuit blocks.

Abstract: An electronic control device includes a substrate, component-mounted wires disposed on the substrate, electronic components mounted on the respective component-mounted wires, a common wire disposed on the substrate and coupled with each of the electronic components, and an interrupt wire coupled between one of the component-mounted wires and the common wire. The interrupt wire melts in accordance with heat generated by an overcurrent. The interrupt wire includes a first wire section and a second wire section shorter than the first wire section. The first wire section and the second wire section is coupled with each other at a predetermined angle that is determined so that one of the wire sections is coupled with the common wire and the other is coupled with the one of the component-mounted wires.

Abstract: An electronic control device includes a substrate, a plurality of component-mounted wires disposed on the substrate, a plurality of electronic components mounted on the respective component-mounted wires, a common wire coupled with each of the electronic components, an interrupt wire coupled between one of the component-mounted wires and the common wire, and a heat release portion. The interrupt wire melts in accordance with heat generated by an overcurrent. The heat release portion is attached to the common wire and is disposed at a position where a wiring distance from the interrupt wire is shorter than a wiring distance between the interrupt wire and any of the electronic components except for one of the electronic components mounted on the one of the component-mounted wires.

Abstract: An electronic control device includes a substrate, a plurality of component-mounted wires disposed on the substrate, a plurality of electronic components mounted on the respective component-mounted wires, a common wire disposed on the substrate and coupled with each of the electronic components, an interrupt wire coupled between one of the component-mounted wires and the common wire, a connection wire via which the interrupt wire is coupled with one of the common wire and the one of the component-mounted wires, and a solder disposed between each of the electronic components and a corresponding one of the component-mounted wires and having a lower melting point than the interrupt wire. The interrupt wire is configured to melt in accordance with heat generated by an overcurrent so as to interrupt a coupling between the one of the component-mounted wires and the common wire.

Abstract: An electronic control device includes a substrate, a plurality of component-mounted wires, a plurality of electronic components, a common wire, an interrupt wire and a protective layer. The component-mounted wires and the common wire are disposed on the substrate. The electronic components are mounted on the respective component-mounted wires and are coupled with the common wire. The interrupt wire is coupled between one component-mounted wire and the common wire, and is configured to melt in accordance with heat generated by an overcurrent to interrupt a coupling between the component-mounted wire and the common wire. The protective layer covers a surface of the substrate including the interrupt wire and defines an opening portion so that at least a portion of the interrupt wire is exposed.

Abstract: A signal input circuit includes: a signal input device having a signal input terminal; an inspection capacitor connected between the signal input terminal and a reference potential; a connection unit connecting/disconnecting an inspection path between the inspection capacitor and the signal input terminal; a charge and discharge unit charging/discharging the inspection capacitor; and a determination processing unit carrying out a terminal failure detection processing. The determination processing unit controls the connection unit to disconnect the inspection path and controls the charge and discharge unit to set the voltage of the inspection capacitor to a terminal inspection voltage in a charge and discharge procedure, controls the connection unit to connect the inspection path in a continuity establishing procedure, and detects the terminal failure at the signal input terminal or a communication path from the signal input terminal based on a voltage of the inspection path.