Abstract: A curtain airbag for mitigating vehicle occupant ejection. The curtain airbag is stored in the upper portion of a side face section in the interior of a vehicle and is inflated and deployed along the side face section. The curtain airbag includes a front chamber partitioned at the frontmost side of an inflation region. The front chamber is inflated and deployed overlapping a divider-bar that separates a side window from a front pillar window.

Abstract: There is provided an adhesive film for a semiconductor, which can be attached to a semiconductor wafer at low temperature and which allows semiconductor chips to be obtained at high yield from the semiconductor wafer while sufficiently inhibiting generation of chip cracks and burrs. The adhesive film for a semiconductor comprises a polyimide resin that can be obtained by reaction between a tetracarboxylic dianhydride containing 4,4?-oxydiphthalic dianhydride represented by chemical formula (I) below and a diamine containing a siloxanediamine represented by the following general formula (II) below, and that can be attached to a semiconductor wafer at 100° C. or below.

Abstract: A cartridge detachably mountable to a main assembly of an electrophotographic image forming apparatus includes a developer carrying member for developing an electrostatic latent image formed on an image bearing member, and an electroconductive developer layer thickness regulating member for regulating a layer thickness of a developer deposited on the developer carrying member. A part of the developer layer thickness regulating member is directly contactable to the main assembly electrical contact.

Abstract: There is provided a developing cartridge that prevents forced erroneous mounting of the developing cartridge by a user and capable of easily recognizing the erroneous mounting by the user, and an electrophotographic image forming apparatus. When an erroneous mounting is performed, the developing cartridge is returned to a mounting start side from the vicinity of a mounting end position. Therefore, the user can easily recognize the erroneous mounting. By using a pressure member for urging the developing cartridge to an image carrier for detection of the erroneous mounting, deformation or damage of a main assembly or the developing cartridge can be suppressed.

Abstract: An image forming apparatus includes an image bearing member, a plurality of development cartridges each having a developer bearing member bearing a developer for developing an electrostatic image and a developer container accommodating the developer, a rotary configured to rotate and move the attached development cartridges toward a development position, an opening defined in an apparatus main body and allowing the development cartridge to pass through for attachment and detachment to and from the rotary, and an indicator provided on a second development cartridge arranged adjacent to a first development cartridge passing through the opening and detached from the rotary being stopped, wherein the indicator indicates an attachment method usable to attach the first development cartridge to the rotary, and wherein the indicator is located at such a position on the second development cartridge as to be visible from outside of the apparatus main body via the opening.

Abstract: A cartridge detachably mountable to a main assembly of an electrophotographic image forming apparatus includes a developer carrying member for developing an electrostatic latent image formed on an image bearing member, and an electroconductive developer layer thickness regulating member for regulating a layer thickness of a developer deposited on the developer carrying member. A part of the developer layer thickness regulating member is directly contactable to the main assembly electrical contact.

Abstract: A cartridge detachably mountable to a main assembly of an electrophotographic image forming apparatus, includes an image bearing member; a frame; process means contactable to and actable on the image bearing member; a covering member detachably mounted to the frame to protect a surface of the image bearing member; and a spacing portion provided on the covering member and inserted between the image bearing member and the process means to space the image bearing member and the process means from each other, the spacing portion being movable relative to the covering member while being interposed between the image bearing member and the process means when the covering member is removed from the frame.

Abstract: The method for producing a semiconductor chip with an adhesive film includes preparing a laminate of a divided semiconductor wafer, an adhesive film and a dicing tape, the adhesive film having a thickness in the range of 1 to 15 ?m and a tensile elongation at break of less than 5%, and the tensile elongation at break being less than 110% of the elongation at a maximum load; and dividing the adhesive film for a semiconductor by picking up the plurality of semiconductor chips in a laminating direction of the laminate. The divided semiconductor wafer has been obtained by cutting the semiconductor wafer in a thickness less than that of the semiconductor wafer and by grinding the other side of the semiconductor wafer on which no cut is formed to reach the cut.

Abstract: There is an adhesive film for a semiconductor for use in a method for manufacturing a semiconductor chip. The method includes preparing a laminated body having a semiconductor wafer, an adhesive film for a semiconductor and dicing tape laminated in that order. The adhesive film for a semiconductor has a tensile breaking elongation of less than 5%, and the tensile breaking elongation is less than 110% of the elongation at maximum load. The semiconductor wafer is partitioned into multiple semiconductor chips and notches are formed from the semiconductor wafer side so that at least a portion of the adhesive film for a semiconductor remains uncut in its thickness direction. The method also includes stretching out the dicing tape in a direction so that the multiple semiconductor chips are separated apart, to separate the adhesive film for a semiconductor along the notches.

Abstract: A cartridge detachably mountable to a main assembly of an electrophotographic image forming apparatus includes a developer carrying member for developing an electrostatic latent image formed on an image bearing member, and an electroconductive developer layer thickness regulating member for regulating a layer thickness of a developer deposited on the developer carrying member. A part of the developer layer thickness regulating member is directly contactable to the main assembly electrical contact.

Abstract: There is provided a method that allows semiconductor chips to be obtained from a semiconductor wafer at high yield, while sufficiently inhibiting generation of chip cracks and burrs. The method for manufacturing a semiconductor chip comprises a step of preparing a laminated body having a semiconductor wafer, an adhesive film for a semiconductor and dicing tape laminated in that order, the semiconductor wafer being partitioned into multiple semiconductor chips and notches being formed from the semiconductor wafer side so that at least a portion of the adhesive film for a semiconductor remains uncut in its thickness direction, and a step of stretching out the dicing tape in a direction so that the multiple semiconductor chips are separated apart, to separate the adhesive film for a semiconductor along the notches. The adhesive film for a semiconductor has a tensile breaking elongation of less than 5% and the tensile breaking elongation of less than 110% of the elongation at maximum load.

Abstract: An electrophotographic image forming apparatus detachably mountable to a main assembly of the apparatus, includes a rotatable image bearing member on which a latent image is to be formed; charging means for contacting said image bearing member to charge a surface of said image bearing member; a frame supporting said image bearing member and said charging means; a covering member, demountably mounted to said frame, for protecting the surface of said image bearing member; and a spacer member including a spacing portion, movably provided on said covering member, for entering between said image bearing member and said charging means to space them therebetween, and a retaining portion, contacting said covering member when said spacing portion is not between said image bearing member and said charging means, for preventing said spacer member from disengaging from said covering member.

Abstract: The method for producing a semiconductor chip with an adhesive film of the present invention comprises steps of preparing a laminate in which at least a divided semiconductor wafer comprising a plurality of semiconductor chips, obtained by forming a cut which separates the semiconductor wafer into a plurality of semiconductor chips on one side of the semiconductor wafer in a thickness less than that of the semiconductor wafer and by grinding the other side of the semiconductor wafer on which no cut is formed to reach the cut, an adhesive film for a semiconductor and a dicing tape are laminated, the adhesive film for a semiconductor having a thickness in the range of 1 to 15 ?m and a tensile elongation at break of less than 5%, and the tensile elongation at break being less than 110% of the elongation at a maximum load; and dividing the adhesive film for a semiconductor by picking up the plurality of semiconductor chips in a laminating direction of the laminate, thereby preparing a semiconductor chip with an a

Abstract: A drum cartridge detachably mountable to an electrophotographic image forming apparatus, which apparatus including a main assembly, and a supporting member, swingably mounted to the main assembly, for supporting a plurality of developing devices and for bringing the developing devices sequentially to a developing position by rotation thereof, the apparatus including an electrophotographic photosensitive member drum; and a detachable spacer member for moving the supporting member away from the electrophotographic photosensitive member drum by contacting to the supporting member when the drum cartridge is mounted to the main assembly.

Abstract: A curtain air bag system includes a main deployment portion for an occupant seated in a front seat, that is housed folded up in an upper edge portion of an opening in a vehicle body, and inflates by receiving a supply of gas when the vehicle is in a side collision and when the vehicle rolls over, and deploys in a curtain shape downward with respect to the vehicle; an auxiliary deployment portion that inflates by receiving a supply of gas via a gas passage that is communicated with a portion of the auxiliary deployment portion in a vertical direction of the vehicle, and that deploys such that a lower end side, when viewed from a side, overlaps with a side door forward of the main deployment portion; and a connecting portion that connects a portion on an upper end side of the auxiliary deployment portion to a front pillar.

Abstract: An electrophotographic image forming apparatus detachably mountable to a main assembly of the apparatus, includes a rotatable image bearing member on which a latent image is to be formed; charging means for contacting said image bearing member to charge a surface of said image bearing member; a frame supporting said image bearing member and said charging means; a covering member, demountably mounted to said frame, for protecting the surface of said image bearing member; and a spacer member including a spacing portion, movably provided on said covering member, for entering between said image bearing member and said charging means to space them therebetween, and a retaining portion, contacting said covering member when said spacing portion is not between said image bearing member and said charging means, for preventing said spacer member from disengaging from said covering member.

Abstract: An image forming apparatus to which a plurality of cartridges are detachably mountable, the cartridges each having a cartridge side identification portion, the image forming apparatus includes a plurality of mounting portions to which the cartridges are demountably mountable; and a identification urging means, provided in each of the mounting portions, for permitting a cartridge to be mounted to the mounting portion when the cartridge is properly to be mounted to the mounting portion on the basis of correspondence with the cartridge side identification portion, and for urging the cartridge in a direction opposite a direction in which the cartridge is mounted when the cartridge is improper for the mounting portion.

Abstract: An electronic component is disclosed, and this component includes an element with an electrode section which is formed of upper electrode (74), lower electrode (72), piezoelectric unit (70) placed between upper electrode (74) and lower electrode (72), and adhesive layer (76) layered between upper electrode (74) and piezoelectric unit (70). Piezoelectric unit (70) includes piezoelectric layer (80) made of piezoelectric material containing lead, and adhesive layer (76) includes a tungsten layer made of tungsten-based material. Piezoelectric layer (80) and the tungsten layer are layered together. The structure discussed above allows preventing a piezoelectric constant from lowering and a base-point voltage from varying. The lowering and the varying have been caused by a temperature-rise.

Abstract: The present invention relates to a semiconductor-encapsulating adhesive, a semiconductor-encapsulating film-form adhesive, a method for producing a semiconductor device, and a semiconductor device. The present invention provides a semiconductor-encapsulating adhesive comprising (a) an epoxy resin, and (b) a compound formed of an organic acid reactive with an epoxy resin and a curing accelerator.

Abstract: A method for producing a semiconductor chip with an adhesive film, which includes: preparing a laminate in which a semiconductor wafer, an adhesive film and a dicing tape are laminated in that order, the adhesive film having a thickness in the range of 1 to 15 ?m and a tensile elongation at break of less than 5%, and the tensile elongation at break being less than 110% of the elongation at a maximum load, and the semiconductor wafer having a section, for dividing the semiconductor wafer into a plurality of semiconductor chips, which is formed by irradiating with laser light; dividing the semiconductor wafer into a plurality of semiconductor chips without dividing the adhesive film, by expanding the dicing tape; and dividing the adhesive film by picking up the plurality of semiconductor chips.