Patents by Inventor Yuusaku YOSHIDA

Yuusaku YOSHIDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11835413
    Abstract: A resonant pressure sensor includes a first substrate and a resonator. The first substrate includes a diaphragm and a projection disposed on the diaphragm. The resonator is disposed in the first substrate, a part of the resonator being included in the projection, and the resonator being disposed between a top of the projection and an intermediate level of the first substrate. The first substrate is an SOI substrate in which a silicon dioxide layer is inserted between a silicon substrate and a superficial silicon layer. The intermediate level of the first substrate is disposed in the silicon substrate, and the resonator is disposed in the projection included in the superficial silicon layer.
    Type: Grant
    Filed: December 30, 2021
    Date of Patent: December 5, 2023
    Assignee: Yokogawa Electric Corporation
    Inventors: Takashi Yoshida, Yuusaku Yoshida, Atsushi Yumoto, Yoshitaka Suzuki
  • Publication number: 20220120627
    Abstract: A resonant pressure sensor includes a first substrate and a resonator. The first substrate includes a diaphragm and a projection disposed on the diaphragm. The resonator is disposed in the first substrate, a part of the resonator being included in the projection, and the resonator being disposed between a top of the projection and an intermediate level of the first substrate. The first substrate is an SOI substrate in which a silicon dioxide layer is inserted between a silicon substrate and a superficial silicon layer. The intermediate level of the first substrate is disposed in the silicon substrate, and the resonator is disposed in the projection included in the superficial silicon layer.
    Type: Application
    Filed: December 30, 2021
    Publication date: April 21, 2022
    Applicant: Yokogawa Electric Corporation
    Inventors: Takashi YOSHIDA, Yuusaku YOSHIDA, Atsushi YUMOTO, Yoshitaka SUZUKI
  • Patent number: 11243131
    Abstract: A resonant pressure sensor includes a first substrate including a diaphragm and at least one projection disposed on the diaphragm, and at least one resonator disposed in the first substrate, at least a part of the resonator being included in the projection, and the resonator being disposed between a top of the projection and an intermediate level of the first substrate.
    Type: Grant
    Filed: August 15, 2014
    Date of Patent: February 8, 2022
    Assignee: Yokogawa Electric Corporation
    Inventors: Takashi Yoshida, Yuusaku Yoshida, Atsushi Yumoto, Yoshitaka Suzuki
  • Patent number: 9865797
    Abstract: A resonant transducer includes a silicon single crystal substrate, a silicon single crystal resonator disposed over the silicon single crystal substrate, a shell made of silicon, surrounding the resonator with a gap, and forming a chamber together with the silicon single crystal substrate, an exciting module configured to excite the resonator, a vibration detecting module configured to detect vibration of the resonator, a first layer disposed over the chamber, the first layer having a through-hole over the resonator, a second layer disposed over the first layer, the second layer covering a gap being positioned above the through-hole and being communicated with the through-hole, and a third layer covering the first layer and the second layer, and the third layer sealing the gap.
    Type: Grant
    Filed: July 30, 2014
    Date of Patent: January 9, 2018
    Assignee: Yokogawa Electric Corporation
    Inventors: Takashi Yoshida, Takeshi Mishima, Shigeto Iwai, Yuusaku Yoshida
  • Patent number: 9003889
    Abstract: A resonant pressure sensor including one or more resonant-type strain gauges arranged on a diaphragm may include a sensor substrate made of silicon and including one surface on which one or more resonant-type strain gauge elements are arranged and the other surface which is polished to have a thickness corresponding to the diaphragm, a base substrate made of silicon and including one surface directly bonded with the other surface of the sensor substrate, a concave portion formed in a portion of the base substrate bonding with the sensor substrate, substantially forming the diaphragm in the sensor substrate, and including a predetermined gap that does not restrict a movable range of the diaphragm due to foreign substances and suppresses vibration of the diaphragm excited by vibration of the resonant-type strain gauge elements, one or more conducting holes, and a fluid.
    Type: Grant
    Filed: August 23, 2012
    Date of Patent: April 14, 2015
    Assignee: Yokogawa Electric Corporation
    Inventors: Yuusaku Yoshida, Takashi Yoshida, Hiroshi Suzuki, Shuhei Yoshita, Hisashi Terashita
  • Publication number: 20150047434
    Abstract: A resonant pressure sensor includes a first substrate including a diaphragm and at least one projection disposed on the diaphragm, and at least one resonator disposed in the first substrate, at least a part of the resonator being included in the projection, and the resonator being disposed between a top of the projection and an intermediate level of the first substrate.
    Type: Application
    Filed: August 15, 2014
    Publication date: February 19, 2015
    Applicant: YOKOGAWA ELECTRIC CORPORATION
    Inventors: Takashi Yoshida, Yuusaku YOSHIDA, Atsushi YUMOTO, Yoshitaka SUZUKI
  • Publication number: 20150042208
    Abstract: A resonant transducer includes a silicon single crystal substrate, a silicon single crystal resonator disposed over the silicon single crystal substrate, a shell made of silicon, surrounding the resonator with a gap, and forming a chamber together with the silicon single crystal substrate, an exciting module configured to excite the resonator, a vibration detecting module configured to detect vibration of the resonator, a first layer disposed over the chamber, the first layer having a through-hole over the resonator, a second layer disposed over the first layer, the second layer covering a gap being positioned above the through-hole and being communicated with the through-hole, and a third layer covering the first layer and the second layer, and the third layer sealing the gap.
    Type: Application
    Filed: July 30, 2014
    Publication date: February 12, 2015
    Applicant: YOKOGAWA ELECTRIC CORPORATION
    Inventors: Takashi YOSHIDA, Takeshi MISHIMA, Shigeto IWAI, Yuusaku YOSHIDA
  • Publication number: 20130047734
    Abstract: A resonant pressure sensor including one or more resonant-type strain gauges arranged on a diaphragm may include a sensor substrate made of silicon and including one surface on which one or more resonant-type strain gauge elements are arranged and the other surface which is polished to have a thickness corresponding to the diaphragm, a base substrate made of silicon and including one surface directly bonded with the other surface of the sensor substrate, a concave portion formed in a portion of the base substrate bonding with the sensor substrate, substantially forming the diaphragm in the sensor substrate, and including a predetermined gap that does not restrict a movable range of the diaphragm due to foreign substances and suppresses vibration of the diaphragm excited by vibration of the resonant-type strain gauge elements, one or more conducting holes, and a fluid.
    Type: Application
    Filed: August 23, 2012
    Publication date: February 28, 2013
    Applicant: YOKOGAWA ELECTRIC CORPORATION
    Inventors: Yuusaku YOSHIDA, Takashi YOSHIDA, Hiroshi SUZUKI, Shuhei YOSHITA, Hisashi TERASHITA