Patents by Inventor Yuusuke Matsuda

Yuusuke Matsuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240140132
    Abstract: An envelope processing apparatus for enclosing an enclosure in an envelope includes an envelope conveyance path, an enclosure supplier, an envelope supplier, a flap opener, and an envelope stacker. The envelope conveyance path extends in a substantially vertical direction to convey the envelope. The enclosure supplier supplies the enclosure to the envelope via the envelope conveyance path. The envelope supplier supplies the envelope to the envelope conveyance path, The flap opener opens a flap portion of the envelope between the envelope supplier and the envelope conveyance path. The envelope stacker stacks the envelope ejected from the envelope conveyance path.
    Type: Application
    Filed: May 6, 2022
    Publication date: May 2, 2024
    Applicant: Ricoh Company, Ltd.
    Inventors: Nobuyoshi SUZUKI, Michitaka SUZUKI, Yuusuke SHIBASAKI, Makoto HIDAKA, Akira KUNIEDA, Takahiro WATANABE, Takuya MORINAGA, Takahiro MATSUDA, Shingo YOSHIZAWA, Shinji ASAMI, Kazuyoshi MATSUO
  • Patent number: 11970019
    Abstract: An envelope processing apparatus that inserts an enclosure into an envelope includes an envelope conveyor, a flap opener, an enclosure pusher, and circuitry. The envelope conveyor extends in a vertical direction and conveys the envelope to an enclosing position via an envelope conveyance passage as a passage in which the envelope is conveyed. The flap opener opens a flap of the envelope. The enclosure pusher pushes the enclosure toward an opening of a body of the envelope conveyed to the enclosing position with the flap open. The circuitry changes a pushing amount of the enclosure into the envelope and adjusts the pushing amount based on the opening of the body of the envelope within a specified range from an inside to an outside of the body of the envelope.
    Type: Grant
    Filed: April 11, 2023
    Date of Patent: April 30, 2024
    Assignee: Ricoh Company, Ltd.
    Inventors: Nobuyoshi Suzuki, Michitaka Suzuki, Yuusuke Shibasaki, Takahiro Matsuda, Atsushi Shinoda, Shingo Yoshizawa, Takahiro Watanabe, Takuya Morinaga
  • Publication number: 20240075767
    Abstract: An envelope processing apparatus conveys an envelope to an enclosing position and encloses an enclosure on which specific information is formed at a formation position. The enclosing device includes: an envelope conveyor to convey the enclosure to the enclosing position to insert the enclosure into the envelope; a sensor to acquire, as an image, a structure of the envelope during conveyance, and acquire transparent-portion information indicating a position of a transparent portion in the envelope; an envelope holder to hold the envelope in a state in which the enclosure is insertable; and control circuitry to output position adjustment information for adjusting a position of the envelope in a width direction of the envelope at the enclosing position or a position of the specific information in a conveyance direction of the envelope, based on relative positions between the formation position of the specific information and the position of the transparent portion.
    Type: Application
    Filed: September 5, 2023
    Publication date: March 7, 2024
    Applicant: Ricoh Company, Ltd.
    Inventors: Shingo YOSHIZAWA, Michitaka SUZUKI, Nobuyoshi SUZUKI, Yuusuke SHIBASAKI, Takahiro MATSUDA, Atsushi SHINODA, Takahiro WATANABE, Takuya MORINAGA
  • Patent number: 11919325
    Abstract: An enclosing-sealing apparatus includes a flap opener that opens a flap of an envelope while the envelope is conveyed to an enclosing position. A first envelope detector is disposed upstream from the flap opener in an envelope conveyance direction and detects both ends of the envelope in the envelope conveyance direction. A second envelope detector is disposed downstream from the flap opener in the envelope conveyance direction and detects both ends of the envelope in the envelope conveyance direction in an open state in which the flap opens. A controller determines the open state of the flap based on a first detection result sent from the first envelope detector and a second detection result sent from the second envelope detector. The controller performs troubleshooting for enclosing the enclosure into the envelope if the controller determines that the open state of the flap is faulty.
    Type: Grant
    Filed: April 15, 2022
    Date of Patent: March 5, 2024
    Assignee: Ricoh Company, Ltd.
    Inventors: Akira Kunieda, Michitaka Suzuki, Shinji Asami, Nobuyoshi Suzuki, Yuusuke Shibasaki, Takahiro Matsuda, Makoto Hidaka, Kazuyoshi Matsuo, Shingo Yoshizawa, Takahiro Watanabe, Takuya Morinaga
  • Patent number: 8125727
    Abstract: A disk drive. The disk drive includes a disk configured to store data, a motor configured to rotate the disk, a head-slider and a controller. The head-slider includes a slider configured to fly in proximity to a recording surface of the disk, and an element on the slider. The controller is configured to measure a fly height between the head-slider and the disk at different common-mode voltages of the element to determine an operational common-mode voltage from a measurement result.
    Type: Grant
    Filed: September 18, 2009
    Date of Patent: February 28, 2012
    Assignee: Hitachi Global Storgae Technologies, Netherlands B.V.
    Inventors: Kazushi Tsuwako, Yuusuke Matsuda, Masashi Murai, Toshiya Shiramatsu
  • Publication number: 20110090586
    Abstract: A disk drive. The disk drive includes a disk configured to store data, a motor configured to rotate the disk, a head-slider and a controller. The head-slider includes a slider configured to fly in proximity to a recording surface of the disk, and an element on the slider. The controller is configured to measure a fly height between the head-slider and the disk at different common-mode voltages of the element to determine an operational common-mode voltage from a measurement result.
    Type: Application
    Filed: September 18, 2009
    Publication date: April 21, 2011
    Inventors: Kazushi Tsuwako, Yuusuke Matsuda, Masashi Murai, Toshiya Shiramatsu