Abstract: One of the purposes of the present invention is to provide a condensation-curable silicone resin composition which show a less increase of the viscosity during handling and cures quickly to provide a cured product which has a very small amount of a remaining catalyst and which has high heat resistance and high light resistance.

Abstract: One of the purposes of the present invention is to provide a curable resin composition which has good curability and provides a cured product having a sufficient hardness, in particular an addition-curable organic silicon resin composition. The present invention provides a curable resin composition comprising the following components (A) to (C): (A) an organic-silicon compound having at least two alkenyl groups in a molecule, (B) an organic silicon compound which is represented by the formula (I) and has at least three hydrosilyl groups each bonded to the carbon atom of the benzene ring in an amount such that a ratio of the number of the hydrosilyl group in component (B) to the number of the alkenyl group in component (A) is 0.4 to 4, and (C) a hydrosilylation catalyst in a catalytic amount.

Abstract: A curable organosilicon resin composition includes; (A) an organopolysiloxane having a resin structure containing 10 to 60 mol % of an R1SiO3/2 unit, 30 to 80 mol % of an (R2)2SiO2/2 unit, and 1 to 30 mol % of an (R3)3SiO1/2 unit. At least a part of the (R2)2SiO2/2 unit is in continuous repeating units with the average number of the repeating units being 3 to 80. The organopolysiloxane has a weight average molecular weight of 5,000 to 50,000; the amount of the hydroxy groups bonded to silicon atoms is 0.001 to 1.0 mol/100 g; and the amount of the alkoxy groups, each having 1 to 10 carbon atoms, bonded to silicon atoms is 1.0 mol/100 g or less. A curable organosilicon resin composition has excellent workability, can give a cured product rapidly, and can make the cured product excellent in mechanical properties, heat resistance, crack resistance, and adhesive property, the surface tackiness being suppressed.

Abstract: The present invention provides methods of manufacturing a condensation-curable silicone resin composition sheet that is in a plastic solid state or a semi-solid state at ordinary temperature, including: (A) organopolysiloxane having a weight average molecular weight of 5,000 or more and 1,000,000 or less in terms of polystyrene shown by the following formula (1): (R13SiO1/2)a?(R12SiO2/2)b?(R2SiO3/2)c?(SiO4/2)d?(OR3)e???(1); together with (B) organopolysiloxane having a molecular weight of 10,000 or more and 1,000,000 or less in terms of polystyrene shown by the following formula (2): (R13SiO1/2)a(R12SiO2/2)b(R2SiO3/2)c(SiO4/2)d(OR3)e(HSi(OR3)2O1/2)f ??(2) in an amount of 5 to 100 parts by mass based on 100 parts by mass of the component (A). This condensation-curable silicone resin composition sheet is easy to be handled and has high heat resistance and ultraviolet light resistance while being excel in curing characteristics.

Abstract: The present invention provides methods of manufacturing a condensation-curable silicone resin composition sheet that is in a plastic solid state or a semi-solid state at ordinary temperature, including: (A) organopolysiloxane having a weight average molecular weight of 5,000 or more and 1,000,000 or less in terms of polystyrene shown by the following formula (1): (R13SiO1/2)a?(R12SiO2/2)b?(R2SiO3/2)c?(SiO4/2)d?(OR3)e?; (1); together with (B) organopolysiloxane having a molecular weight of 10,000 or more and 1,000,000 or less in terms of polystyrene shown by the following formula (2): (R13SiO1/2)a(R12SiO2/2)b(R2SiO3/2)c(SiO4/2)d(OR3)e(HSi(OR3)2O1/2)f (2) in an amount of 5 to 100 parts by mass based on 100 parts by mass of the component (A).

Abstract: A resin composition comprising (A) a silphenylene skeleton-bearing organosilicon compound containing at least two hydroxyl and/or alkoxy groups per molecule and (B) an organosilicon compound having a hydrogen atom and a hydroxyl and/or alkoxy group on a common silicon atom, or comprising (C) a silphenylene skeleton-bearing organosilicon compound having a hydrogen atom and a hydroxyl and/or alkoxy group on a common silicon atom is condensation curable without a need for catalysts. The cured product has satisfactory hardness, crack resistance, heat resistance and light resistance.

Abstract: The present invention provides a condensation-curable silicone resin composition sheet that is in a plastic solid state or a semi-solid state at ordinary temperature, including: (A) organopolysiloxane having a weight average molecular weight of 5,000 or more and 1,000,000 or less in terms of polystyrene shown by the following formula (1): (R13SiO1/2)a?(R12SiO2/2)b?(R2SiO3/2)c?(SiO4/2)d?(OR3)e???(1); together with (B) organopolysiloxane having a molecular weight of 10,000 or more and 1,000,000 or less in terms of polystyrene shown by the following formula (2): (R13SiO1/2)a(R12SiO2/2)b(R2SiO3/2)c(SiO4/2)d(OR3)e(HSi(OR3)2O1/2)f??(2) in an amount of 5 to 100 parts by mass based on 100 parts by mass of the component (A). This condensation-curable silicone resin composition sheet is easy to be handled and has high heat resistance and ultraviolet light resistance while being excel in curing characteristics.

Abstract: One of the purposes of the present invention is to provide a curable resin composition which has good curability and provides a cured product having a sufficient hardness, in particular an addition-curable organic silicon resin composition. The present invention provides a curable resin composition comprising the following components (A) to (C): (A) an organic-silicon compound having at least two alkenyl groups in a molecule, (B) an organic silicon compound which is represented by the formula (I) and has at least three hydrosilyl groups each bonded to the carbon atom of the benzene ring in an amount such that a ratio of the number of the hydrosilyl group in component (B) to the number of the alkenyl group in component (A) is 0.4 to 4, and (C) a hydrosilylation catalyst in a catalytic amount.

Abstract: A condensation-curable silicone composition provides a cured product having good performance at a low temperature, excellent resistance to a temperature change, and a crack resistance, and a semiconductor device has a high reliability, whose semiconductor element is encapsulated with the cured product. A condensation-curable silicone composition has (A) a branched organopolysiloxane represented by formula (1-1) or (1-2) with a short branch made of 1 to 4 siloxane units and (C) a condensation catalyst in a catalytic amount. Further, a condensation-curable silicone composition also has (B) an organopolysiloxane having a network structure and represented by formula (2). Further, a semiconductor device is provided with a cured product obtained by curing the condensation-curable silicone composition.

Abstract: The present invention provides a condensation-curable silicone resin composition sheet that is in a plastic solid state or a semi-solid state at ordinary temperature, including: (A) organopolysiloxane having a weight average molecular weight of 5,000 or more and 1,000,000 or less in terms of polystyrene shown by the following formula (1): (R13SiO1/2)e?(R12SiO2/2)b?(R2SiO3/2)c?(SiO4/2)d?(OR3)e???(1) ; together with (B) organopolysiloxane having a molecular weight of 10,000 or more and 1,000,000 or less in terms of polystyrene shown by the following formula (2): (R13SiO1/2)a(R12SiO2/2)b(R2SiO3/2)c(SiO4/2)d(OR3)e(HSi(OR3)2O1/2)f (2) in an amount of 5 to 100 parts by mass based on 100 parts by mass of the component (A). This condensation-curable silicone resin composition sheet is easy to be handled and has high heat resistance and ultraviolet light resistance while being excel in curing characteristics.

Abstract: An addition/condensation curable silicone resin sheet comprising (A) an organopolysiloxane containing at least two silicon-bonded alkenyl groups and at least two silicon-bonded alkoxy or hydroxyl groups, (B) an organopolysiloxane containing at least two silicon-bonded hydrogen atoms and at least two silicon-bonded alkoxy or hydroxyl groups, (C) an organopolysiloxane containing at least two silicon atoms having two alkoxy or hydroxyl groups and one hydrogen atom on a common silicon atom, and (D) a hydrosilylation catalyst is plastic and solid or semisolid at normal temperature. The silicone resin sheet is easy to work, effective to cure, and likely to form a cured layer around an LED chip.

Abstract: One of the purposes of the present invention is to provide a condensation-curable silicone resin composition which show a less increase of the viscosity during handling and cures quickly to provide a cured product which has a very small amount of a remaining catalyst and which has high heat resistance and high light resistance.

Abstract: An organopolysiloxane having at least 4 terminal hydrosilyl groups per molecule is novel. Also provided is an addition curable silicone composition comprising (A) a linear organopolysiloxane having at least two alkenyl groups per molecule, (B) an organopolysiloxane having at least 4 terminal hydrosilyl groups per molecule, and (C) a hydrosilylation catalyst.

Abstract: A curable organosilicon resin composition includes; (A) an organopolysiloxane having a resin structure containing 10 to 60 mol % of an R1SiO3/2 unit, 30 to 80 mol % of an (R2)2SiO2/2 unit, and 1 to 30 mol % of an (R3)3SiO1/2 unit. At least a part of the (R2)2SiO2/2 unit is in continuous repeating units with the average number of the repeating units being 3 to 80. The organopolysiloxane has a weight average molecular weight of 5,000 to 50,000; the amount of the hydroxy groups bonded to silicon atoms is 0.001 to 1.0 mol/100 g; and the amount of the alkoxy groups, each having 1 to 10 carbon atoms, bonded to silicon atoms is 1.0 mol/100 g or less. A curable organosilicon resin composition has excellent workability, can give a cured product rapidly, and can make the cured product excellent in mechanical properties, heat resistance, crack resistance, and adhesive property, the surface tackiness being suppressed.

Abstract: One of the purposes of the present invention is to provide a method for preparing an organopolysiloxane having a short branch chain. In particular, the purposes of the present invention is to provide a method for preparing an organopolysiloxane having a shorter side chain than a main chain, such as a siloxane side chain having 1 to 5 siloxane units. The present preparation methods are characterized in that the starting material is an organosiloxane which is represented by the formula (1) and has two hydrolyzable groups bonded to a silicon atom at one terminal. The present invention provides a method wherein an organo(poly)siloxane represented by the formula (1) is condensation reacted to prepare an organopolysiloxane represented by formula (2) which is then used as starting materials for introducing a branch, whereby a short siloxane side chain is efficiently introduced in the organopolysiloxane, while controlling a structure of the main chain.

Abstract: The present invention provides a condensation-curable silicone resin composition containing (A) 100 parts by mass of one or more polyorganosiloxanes represented by the following average composition formula (1): (R3SiO1/2)x(R2SiO2/2)y(RSiO3/2)w(SiO4/2)u (1), and (B) 0.1 to 500 parts by mass of a polyorganosiloxane having one or more silicon-bonded hydrogen atoms and two or more silicon-bonded —OX groups per molecule, wherein at least one silicon atom is bonded to both of one or more hydrogen atoms and one or more —OX groups. There can be provided a condensation-curable silicone resin composition that can quickly provide a cured product having high heat resistance and light resistance.

Abstract: A resin composition comprising (A) a silphenylene skeleton-bearing organosilicon compound containing at least two hydroxyl and/or alkoxy groups per molecule and (B) an organosilicon compound having a hydrogen atom and a hydroxyl and/or alkoxy group on a common silicon atom, or comprising (C) a silphenylene skeleton-bearing organosilicon compound having a hydrogen atom and a hydroxyl and/or alkoxy group on a common silicon atom is condensation curable without a need for catalysts. The cured product has satisfactory hardness, crack resistance, heat resistance and light resistance.

Abstract: The present invention provides a nanoparticle of an inorganic oxide particle being surface-treated, wherein: a primary particle size of the nanoparticle measured by a dynamic light scattering method is 8 nm or more and 30 nm or less, and the inorganic oxide particle is surface-treated in such a way that alkoxy groups having 1 to 10 carbon atoms are contained in a range of 0.001 to 0.5 mol/100 g. The inventive nanoparticle, being added to a silicone resin composition, enables the cured product thereof to possess excellent mechanical properties, transparency, crack resistance, heat resistance, and gas barrier properties, and enables the composition to have low viscosity and good workability even after the addition of the nanoparticle.

Abstract: An addition/condensation curable silicone resin sheet comprising (A) an organopolysiloxane containing at least two silicon-bonded alkenyl groups and at least two silicon-bonded alkoxy or hydroxyl groups, (B) an organopolysiloxane containing at least two silicon-bonded hydrogen atoms and at least two silicon-bonded alkoxy or hydroxyl groups, (C) an organopolysiloxane containing at least two silicon atoms having two alkoxy or hydroxyl groups and one hydrogen atom on a common silicon atom, and (D) a hydrosilylation catalyst is plastic and solid or semisolid at normal temperature. The silicone resin sheet is easy to work, effective to cure, and likely to form a cured layer around an LED chip.

Abstract: The invention provides an addition-curable silicone composition which provides a cured product having good performance at a low temperature and excellent resistance to a temperature change, and to provide a semiconductor device having a high reliability, whose semiconductor element is encapsulated with the cured product. The invention provides an addition-curable silicone composition comprising (A) a branched organopolysiloxane having at least two alkenyl groups and represented by the formula (1) with a short branch consisting of 1 to 4 siloxane units, (B) an organohydrogenpolysiloxane having at least two hydrosilyl groups, in an amount such that a ratio of the number of the hydrosilyl groups in component (B) to the number of the alkenyl groups in component (A) is 0.4 to 4, and (C) a hydrosilylation catalyst in a catalytic amount. The invention also provides a semiconductor device provided with a cured product obtained by curing the condensation-curable silicone composition.