Patents by Inventor Yuya AKANISHI

Yuya AKANISHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130256267
    Abstract: A substrate processing method includes a water removing step of removing water from a substrate, a silylating step of supplying a silylating agent to the substrate after the water removing step, and an etching step of supplying an etching agent to the substrate after the silylating step. The substrate may have a surface on which a nitride film and an oxide film are exposed and in this case, the etching step may be a selective etching step of selectively etching the nitride film by the etching agent. The etching agent may be supplied in a form of a vapor having an etching component.
    Type: Application
    Filed: November 28, 2012
    Publication date: October 3, 2013
    Applicant: DAINIPPON SCREEN MFG. CO., LTD.
    Inventors: Takashi OTA, Yuya AKANISHI, Akio HASHIZUME
  • Patent number: 8501025
    Abstract: A substrate treatment apparatus is provided, which includes: a seal chamber including a chamber body having an opening, a lid member provided rotatably with respect to the chamber body and configured to close the opening, and a first liquid seal structure which liquid-seals between the lid member and the chamber body, the seal chamber having an internal space sealed from outside; a lid member rotating unit which rotates the lid member; a substrate holding/rotating unit which holds and rotates a substrate in the internal space of the seal chamber; and a treatment liquid supplying unit which supplies a treatment liquid to the substrate rotated by the substrate holding/rotating unit.
    Type: Grant
    Filed: March 10, 2011
    Date of Patent: August 6, 2013
    Assignee: Dainippon Screen Mfg. Co., Ltd.
    Inventors: Akio Hashizume, Yuya Akanishi, Kenji Kawaguchi, Manabu Yamamoto
  • Publication number: 20130052828
    Abstract: In a substrate processing apparatus (1), a silicon oxide film on a main surface of a substrate (9) is removed in an oxide film removing part (4) and then a silylation material is applied to the main surface, to thereby perform a silylation process in a silylation part (6). It is thereby possible to lengthen the Q time from the removal of the silicon oxide film to the formation of the silicon germanium film and reduce the temperature for prebaking in the formation of the silicon germanium film.
    Type: Application
    Filed: August 21, 2012
    Publication date: February 28, 2013
    Inventors: Akio HASHIZUME, Yuya AKANISHI
  • Publication number: 20110240601
    Abstract: A substrate treatment apparatus is provided, which includes: a seal chamber including a chamber body having an opening, a lid member provided rotatably with respect to the chamber body and configured to close the opening, and a first liquid seal structure which liquid-seals between the lid member and the chamber body, the seal chamber having an internal space sealed from outside; a lid member rotating unit which rotates the lid member; a substrate holding/rotating unit which holds and rotates a substrate in the internal space of the seal chamber; and a treatment liquid supplying unit which supplies a treatment liquid to the substrate rotated by the substrate holding/rotating unit.
    Type: Application
    Filed: March 10, 2011
    Publication date: October 6, 2011
    Inventors: Akio HASHIZUME, Yuya AKANISHI, Kenji KAWAGUCHI, Manabu YAMAMOTO