Patents by Inventor Yuya HIRAYAMA

Yuya HIRAYAMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240148895
    Abstract: An antibody-drug conjugate represented by formula (I): (where Ab is an antibody, X is a group represented by formula (X-1), formula (X-2) or formula (X-3): (where at the left represents the binding site with NH and at the right represents the binding side with D), D is a group represented by formula (D-1) or formula (D-2): (where represents the binding site with X), and n is in the range of about 1 to about 8).
    Type: Application
    Filed: August 24, 2023
    Publication date: May 9, 2024
    Inventors: Masayuki MIYANO, Yuya NAKAZAWA, Kentaro ISO, Yuki YABE, Hirotatsu UMIHARA, Junichi TAGUCHI, Satoshi INOUE, Shuntaro TSUKAMOTO, Hiroyuki KOGAI, Atsumi YAMAGUCHI, Tsuyoshi AKAGI, Yohei MUKAI, Toshifumi HIRAYAMA, Masaki KATO, Toshiki MOCHIZUKI, Akihiko YAMAMOTO, Yuji YAMAMOTO, Takato SAKURADA
  • Patent number: 11952344
    Abstract: Provided is a heterocyclic compound that can have an antagonistic action on an NMD A receptor containing the NR2B subunit and that is expected to be useful as a prophylactic or therapeutic agent for depression, bipolar disorder, migraine, pain, peripheral symptoms of dementia and the like. A compound represented by the formula (I), wherein each symbol is as defined in the DESCRIPTION, or a salt thereof.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: April 9, 2024
    Assignee: Takeda Pharmaceutical Company Limited
    Inventors: Yuya Oguro, Makoto Kamata, Shuhei Ikeda, Takeshi Wakabayashi, Norihito Tokunaga, Taku Kamei, Mitsuhiro Ito, Shigemitsu Matsumoto, Hirotaka Kamitani, Takaharu Hirayama, Toshio Tanaka, Hiroshi Banno, Nobuyuki Takakura, Jinichi Yonemori, Takuya Fujimoto
  • Publication number: 20230308552
    Abstract: An information processing apparatus includes a processor configured to: acquire sound data representing a sound emitted by an apparatus; generate plural pieces of section sound data by dividing the sound data into sections where detection of words is not possible; and transmit specific section sound data among the plural pieces of section sound data, and operation information that indicates an operation of the apparatus and corresponds to the specific section sound data, to an external apparatus that analyzes the sound data of the apparatus, in association with each other.
    Type: Application
    Filed: August 10, 2022
    Publication date: September 28, 2023
    Applicant: FUJIFILM Business Innovation Corp.
    Inventor: Yuya HIRAYAMA
  • Patent number: 11691389
    Abstract: The present invention relates to a resin composition including an acrylic polymer (A) and a thermosetting resin (B), wherein a phase separation structure of a first phase containing the acrylic polymer (A) and a second phase containing the thermosetting resin (B) is formed, and an average domain size of the second phase is 20 ?m or less.
    Type: Grant
    Filed: December 2, 2020
    Date of Patent: July 4, 2023
    Assignee: RESONAC CORPORATION
    Inventors: Yuya Hirayama, Takayo Kitajima, Kenichi Tomioka, Keisuke Kushida, Minoru Kakitani, Hiroshi Shimizu
  • Publication number: 20230145264
    Abstract: A photosensitive resin composition containing a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and an anthracene-based sensitizer, in which the binder polymer contains a polymer (a) having a hydroxyalkyl (meth)acrylate unit and a styrene or styrene derivative unit and having a content of the styrene or styrene derivative unit of 40% by mass or more.
    Type: Application
    Filed: March 16, 2021
    Publication date: May 11, 2023
    Inventors: Keishi ONO, Seiji SUNOHARA, Tetsuro YAMASHITA, Yuya HIRAYAMA
  • Patent number: 11593151
    Abstract: A semiconductor device includes three integrated circuits. One of the integrated circuits includes: a first connector configured to connect to a device; and a transmitter. The transmitter is configured to transmit to another integrated circuit, first data on each of a plurality of pieces of packet data. The transmitter is also configured to, when the first connector is connected to the device, while a second controller is performing a second process, transmit, to a first controller, a request to process data transmitted from the device.
    Type: Grant
    Filed: March 12, 2020
    Date of Patent: February 28, 2023
    Assignee: FUJIFILM Business Innovation Corp.
    Inventors: Yuya Hirayama, Tsutomu Nakaminato, Kenji Kuroishi
  • Patent number: 11546485
    Abstract: An information processing apparatus includes a first integrated circuit including a first controller that processes data acquired from a device and that controls an operation of the device; a second integrated circuit including a second controller with a higher processing speed than a processing speed of the first controller; and a third integrated circuit including a first connection unit connectable to the device. The third integrated circuit includes a second connection unit connectable to the first integrated circuit, a third connection unit connectable to the second integrated circuit, and a setting unit that, when the device is connected to the first connection unit, sets an integrated circuit to be connected, in accordance with a communication speed of the connected device.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: January 3, 2023
    Assignee: FUJIFILM Business Innovation Corp.
    Inventors: Tsutomu Nakaminato, Yuya Hirayama, Kenji Kuroishi
  • Patent number: 11375080
    Abstract: An information processing apparatus includes a volatile memory that stores data, a controller that controls an operation of a device, an interface that temporarily stores data input from the device, a writing unit that controls writing of the data on the volatile memory, a first communication pathway that connects the interface to the writing unit and is used to transmit the data acquired by the interface to the volatile memory and to transfer the data written on the volatile memory, a second communication pathway that connects the interface to the writing unit and does not share a route with the first communication pathway, and a switching unit that switches a communication path used to transmit data from the interface to the volatile memory from the first communication pathway to the second communication pathway if the interface has received image data from the device.
    Type: Grant
    Filed: September 8, 2019
    Date of Patent: June 28, 2022
    Assignee: FUJIFILM Business Innovation Corp.
    Inventors: Yuya Hirayama, Tsutomu Nakaminato, Kenji Kuroishi
  • Publication number: 20210079172
    Abstract: The present invention relates to a resin composition including an acrylic polymer (A) and a thermosetting resin (B), wherein a phase separation structure of a first phase containing the acrylic polymer (A) and a second phase containing the thermosetting resin (B) is formed, and an average domain size of the second phase is 20 ?m or less.
    Type: Application
    Filed: December 2, 2020
    Publication date: March 18, 2021
    Inventors: Yuya HIRAYAMA, Takayo KITAJIMA, Kenichi TOMIOKA, Keisuke KUSHIDA, Minoru KAKITANI, Hiroshi SHIMIZU
  • Publication number: 20210024741
    Abstract: To provide a thermosetting resin composition that has low elasticity, high heat resistance, high elongation under an ordinary temperature environment and a high temperature environment, high electric insulation reliability, and high adhesion strength to a metal foil, and is capable of providing a prepreg that is excellent in crack resistance; a prepreg including the thermosetting resin composition; a metal foil with a resin including the thermosetting resin composition and a metal foil laminated on each other; a laminate including the prepreg or the metal foil with a resin; a printed wiring board including the laminate; and a semiconductor package including the printed wiring board. Specifically, the thermosetting resin composition contains (A) a phenol-based resin, and the component (A) contains (A-1) a phenol-based resin having an aliphatic hydrocarbon group having 10 to 25 carbon atoms.
    Type: Application
    Filed: March 29, 2019
    Publication date: January 28, 2021
    Inventors: Yuya HIRAYAMA, Keisuke KUSHIDA, Kenichi TOMIOKA, Hiroshi SHIMIZU
  • Publication number: 20210004260
    Abstract: An information processing apparatus includes a first integrated circuit and a second integrated circuit. The first integrated circuit includes a first controller which processes data obtained from a device and which controls operations of the device. The second integrated circuit includes a second controller whose data processing speed is faster than the data processing speed of the first controller. When the second controller performs a second process with greater priority than a first process after start of the first process and before completion of the first process, the second controller determines whether or not the first controller is to restart the first process on the basis of a condition defined as to data subjected to the first process.
    Type: Application
    Filed: March 12, 2020
    Publication date: January 7, 2021
    Applicant: FUJI XEROX CO., LTD.
    Inventors: Yuya HIRAYAMA, Tsutomu NAKAMINATO, Kenji KUROISHI
  • Publication number: 20200288038
    Abstract: An information processing apparatus includes a first integrated circuit including a first controller that processes data acquired from a device and that controls an operation of the device; a second integrated circuit including a second controller with a higher processing speed than a processing speed of the first controller; and a third integrated circuit including a first connection unit connectable to the device. The third integrated circuit includes a second connection unit connectable to the first integrated circuit, a third connection unit connectable to the second integrated circuit, and a setting unit that, when the device is connected to the first connection unit, sets an integrated circuit to be connected, in accordance with a communication speed of the connected device.
    Type: Application
    Filed: August 27, 2019
    Publication date: September 10, 2020
    Applicant: FUJI XEROX CO., LTD.
    Inventors: Tsutomu NAKAMINATO, Yuya HIRAYAMA, Kenji KUROISHI
  • Publication number: 20200092438
    Abstract: An information processing apparatus includes a volatile memory that stores data, a controller that controls an operation of a device, an interface that temporarily stores data input from the device, a writing unit that controls writing of the data on the volatile memory, a first communication pathway that connects the interface to the writing unit and is used to transmit the data acquired by the interface to the volatile memory and to transfer the data written on the volatile memory, a second communication pathway that connects the interface to the writing unit and does not share a route with the first communication pathway, and a switching unit that switches a communication path used to transmit data from the interface to the volatile memory from the first communication pathway to the second communication pathway if the interface has received image data from the device.
    Type: Application
    Filed: September 8, 2019
    Publication date: March 19, 2020
    Applicant: FUJI XEROX CO., LTD.
    Inventors: Yuya Hirayama, Tsutomu Nakaminato, Kenji Kuroishi
  • Publication number: 20190161586
    Abstract: The present invention relates to a resin composition including an acrylic polymer (A) and a thermosetting resin (B), wherein a phase separation structure of a first phase containing the acrylic polymer (A) and a second phase containing the thermosetting resin (B) is formed, and an average domain size of the second phase is 20 ?m or less.
    Type: Application
    Filed: May 15, 2017
    Publication date: May 30, 2019
    Inventors: Yuya HIRAYAMA, Takayo KITAJIMA, Kenichi TOMIOKA, Keisuke KUSHIDA, Minoru KAKITANI, Hiroshi SHIMIZU
  • Patent number: D1013855
    Type: Grant
    Filed: August 26, 2021
    Date of Patent: February 6, 2024
    Assignee: JAPAN WIND TUNNEL MANUFACTURING INC.
    Inventors: Katsuya Mizuki, Yuya Hirayama