Abstract: Proposed are techniques for simplifying the process of suppressing an increase in a reflected wave Pr due to IMD. A high-frequency power supply system for providing high-frequency power to a load includes: a bias power supply for supplying a bias power having a first frequency; a source power supply for supplying a high-frequency output having a second frequency higher than the first frequency and being frequency modulated with the first frequency; and a matching device including an impedance matching circuit for acquiring the bias power and the frequency modulated high-frequency output and achieving impedance matching between the source power supply and the load. The source power supply, in response to a trigger signal for timing having the first frequency, detects a reflected wave while causing a modulation start phase and a modulation amount gain to be varied, and determines an optimum modulation start phase and modulation amount gain that minimize the reflected wave.

Abstract: A high-frequency power supply device includes: a first power supply that supplies first high-frequency power to a load by outputting a first high-frequency voltage having a first fundamental frequency; a second power supply that supplies second high-frequency power to the load by outputting a second high-frequency voltage having a second fundamental frequency lower than the first fundamental frequency; a first matching unit between the first power supply and the load; and a second matching unit between the second power supply and the load. When frequency-modulating the first high-frequency voltage with a modulation signal having a same frequency as the second fundamental frequency to output a modulated wave, the first power supply repeatedly performs search processing of a start phase of the modulation signal and search processing of a frequency shift amount of the modulated wave such that magnitude of a reflection coefficient or magnitude of reflected wave power reduces.

Abstract: A high-frequency power supply device includes: a first power supply that supplies first high-frequency power to a load by outputting a first high-frequency voltage having a first fundamental frequency; a second power supply that supplies second high-frequency power to the load by outputting a second high-frequency voltage having a second fundamental frequency lower than the first fundamental frequency; a first matching unit that performs a first matching operation of matching an impedance of the first power supply with an impedance of the load in a state in which intermodulation distortion caused by the first high-frequency power and the second high-frequency power being simultaneously supplied to the load, occurs. The first power supply frequency-modulates the first high-frequency voltage with a modulation signal having a same frequency as the second fundamental frequency to output a modulated wave after the first matching operation is completed.

Abstract: A high-frequency power supply apparatus includes the following elements. A first power supply outputs a first high-frequency voltage with a first fundamental frequency. A second power supply outputs a second high-frequency voltage with a second fundamental frequency lower than the first fundamental frequency. A second matching device is connected between the second power supply and the load. The second matching device generates a timing control signal with a frequency lower than the second fundamental frequency. The first power supply generates a modulation signal by applying a start phase and a frequency shift amount to a modulation fundamental wave signal whose frequency is equal to the second fundamental frequency. The start phase is applied to the modulation fundamental wave signal in accordance with an input timing of the timing control signal. The first power supply performs frequency modulation on the first high-frequency voltage by using the modulation signal.

Abstract: The present disclosure, calculating an impedance change considering a reflected wave due to IMD, provides an impedance matching device for performing impedance matching between a source power supply side and a load side, including: a detector that detects a forward wave power supplied from the source power supply and a reflected wave power from the load and outputs a forward wave voltage as a component of the forward wave power and a reflected wave voltage as a component of the reflected wave power, an impedance information output part that calculates impedance from the forward wave voltage and the reflected wave voltage, and a matching part that performs matching operation based on an impedance value supplied from the impedance information output part. The impedance information output part complexifies each of the forward wave voltage and the reflected wave voltage to calculate an impedance value to generate an impedance locus.

Abstract: Proposed are techniques for simplifying the process of suppressing an increase in a reflected wave Pr due to IMD. A high-frequency power supply system for providing high-frequency power to a load includes: a bias power supply for supplying a bias power having a first frequency; a source power supply for supplying a high-frequency output having a second frequency higher than the first frequency and being frequency modulated with the first frequency; and a matching device including an impedance matching circuit for acquiring the bias power and the frequency modulated high-frequency output and achieving impedance matching between the source power supply and the load. The source power supply, in response to a trigger signal for timing having the first frequency, detects a reflected wave while causing a modulation start phase and a modulation amount gain to be varied, and determines an optimum modulation start phase and modulation amount gain that minimize the reflected wave.

Abstract: A communication system provided according to one aspect of the present disclosure includes a first communication device, a second communication device, and a connection line. The second communication device communicates with the first communication device. The connection line connects the first communication device and the second communication device. The first communication device includes a switching unit that switches a voltage applied to the second communication device through the connection line. The second communication device includes a specifying unit that specifies the voltage applied from the first communication device through the connection line. The first communication device and the second communication device perform a pairing process based on a state switched by the switching unit and a state specified by the specifying unit.

Abstract: A semiconductor integrated circuit generates second boot code by encrypting first boot code, and transmits, based on route information indicating a delivery route of the second boot code, encrypted data including the second boot code to a first destination via a network. A different semiconductor integrated circuit is the first destination, and receives the encrypted data via the network and generates third boot code by decrypting the second boot code.

Abstract: A semiconductor integrated circuit generates second boot code by encrypting first boot code, and transmits, based on route information indicating a delivery route of the second boot code, encrypted data including the second boot code to a first destination via a network. A different semiconductor integrated circuit is the first destination, and receives the encrypted data via the network and generates third boot code by decrypting the second boot code.