Abstract: An integrated circuit package for an electronic timepiece comprising an integrated circuit holder, a circuit board having an aperture therein and an integrated circuit chip is disclosed. The integrated circuit plastic holder comprises a container, a frame surrounding the container, and bars connecting the container with the frame. The container component is inserted into the aperture of the circuit board. The integrated circuit chip is placed in the container component. Electrodes are provided on the chip and circuit board and wire-bonded to complete the electrical circuit and a synthetic resin potting compound introduced into the circuit holder so as to incase the integrated circuit chip, circuit board, and respective electrode connections within the confines of the framework surrounding the container. Thus, the frame acts as a weir for defining the spreading range of the resin.