Patents by Inventor Yuzo TAGUCHI

Yuzo TAGUCHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11765817
    Abstract: An object here is to provide a control device which can be reduced in size, weight and cost while being able to prevent unauthorized access. The control device includes: a microcontroller having a storage device, a processor, a package in which the storage device and the processor are accommodated, and multiple communication electrodes provided on a bottom surface of the package; and a wiring board having wiring layers comprised of a front surface layer, an intermediate layer and a rear surface layer, each having a wiring pattern formed therein, insulating members for insulating the respective wiring layers from each other; interlayer connection portions each making an electrical connection between the wiring patterns in different ones of the wiring layers; multiple electrode pads formed n the front surface layer; and communication-dedicated interlayer connection portions which are electrically connected to the respective electrode pads, and which are each externally exposed.
    Type: Grant
    Filed: May 19, 2022
    Date of Patent: September 19, 2023
    Assignee: Mitsubishi Electric Corporation
    Inventors: Yutaka Takeuchi, Hideyuki Takahama, Yuzo Taguchi, Shozo Kanzaki
  • Publication number: 20220408553
    Abstract: An object here is to provide a control device which can be reduced in size, weight and cost while being able to prevent unauthorized access. The control device includes: a microcontroller having a storage device, a processor, a package in which the storage device and the processor are accommodated, and multiple communication electrodes provided on a bottom surface of the package; and a wiring board having wiring layers comprised of a front surface layer, an intermediate layer and a rear surface layer, each having a wiring pattern formed therein, insulating members for insulating the respective wiring layers from each other; interlayer connection portions each making an electrical connection between the wiring patterns in different ones of the wiring layers; multiple electrode pads formed n the front surface layer; and communication-dedicated interlayer connection portions which are electrically connected to the respective electrode pads, and which are each externally exposed.
    Type: Application
    Filed: May 19, 2022
    Publication date: December 22, 2022
    Applicant: Mitsubishi Electric Corporation
    Inventors: Yutaka TAKEUCHI, Hideyuki TAKAHAMA, Yuzo TAGUCHI, Shozo KANZAKI