Patents by Inventor Yves Laplanche

Yves Laplanche has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for forming under a thin layer of a first material portions of another material and/or empty areas
    Patent number: 8252638
    Abstract: A method for forming an empty area under a layer of a given material, including forming on a substrate a stacking of a photosensitive layer and of a layer of the given material; insolating a portion of the photosensitive layer or its complement according to whether the photosensitive layer is positive or negative with an electron beam crossing the layer of the given material; and removing the portion of the photosensitive layer.
    Type: Grant
    Filed: February 28, 2007
    Date of Patent: August 28, 2012
    Assignee: STMicroelectronics S.A.
    Inventors: Philippe Coronel, Yves Laplanche, Laurent Pain
  • Method for forming under a thin layer of a first material portions of another material and/ or empty areas
    Publication number: 20070155159
    Abstract: A method for forming a empty area under a layer of a given material, including forming on a substrate a stacking of a photosensitive layer and of a layer of the given material; insolating a portion of the photosensitive layer or its complement according to whether the photosensitive layer is positive or negative with an electron beam crossing the layer of the given material; and removing the portion of the photosensitive layer.
    Type: Application
    Filed: February 28, 2007
    Publication date: July 5, 2007
    Applicants: STMicroelectronics S.A., Commissariat A L'Ernergie Atomique
    Inventors: Philippe Coronel, Yves Laplanche, Laurent Pain
  • Method for forming, under a thin layer of a first material, portions of another material and/or empty areas
    Patent number: 7202153
    Abstract: A method for forming a empty area under a layer of a given material, including forming on a substrate a stacking of a photosensitive layer and of a layer of the given material; insolating a portion of the photosensitive layer or its complement according to whether the photosensitive layer is positive or negative with an electron beam crossing the layer of the given material; and removing the portion of the photosensitive layer.
    Type: Grant
    Filed: August 9, 2004
    Date of Patent: April 10, 2007
    Assignees: STMicroelectronics S.A., Commissariat a l'Ernergie, Atomique
    Inventors: Philippe Coronel, Yves Laplanche, Laurent Pain
  • Method for forming, under a thin layer of a first material, portions of another material and/or empty areas
    Publication number: 20050037603
    Abstract: A method for forming a empty area under a layer of a given material, including forming on a substrate a stacking of a photosensitive layer and of a layer of the given material; insolating a portion of the photosensitive layer or its complement according to whether the photosensitive layer is positive or negative with an electron beam crossing the layer of the given material; and removing the portion of the photosensitive layer.
    Type: Application
    Filed: August 9, 2004
    Publication date: February 17, 2005
    Applicants: STMicroelectronics S.A., Commissariat A L'Ernergie Atomique
    Inventors: Philippe Coronel, Yves Laplanche, Laurent Pain