Abstract: The invention disclosed relates to an electrochemical process for decreasing high levels of organic contaminants in metal plating baths. The process involves breaking down the organic contaminants in an electrochemical cell by electrochemical oxidation. The electrochemical cell includes an anode comprising an active material which is stable at low (acid) pH and at the high electrical potential required to break down the organic contaminants by oxidation. Typical examples of such anodes include a valve metal substrate coated with doped tin dioxide, lead dioxide, or platinum-based materials, the latter in some instances being coated on a high surface area valve metal substrate.

Abstract: Disclosed is A flow-through electrochemical reactor comprising a body having an internal chamber, and an inlet port and an outlet port in communication with said internal chamber to permit flow of wastewater therethrough, at least one porous anode arranged in said internal chamber such that the wastewater flowing between said inlet port and said outlet port flows through the pores of said at least one porous anode, said at least one porous anode having activity for the destruction of a target substance, and at least one cathode disposed in the internal chamber to permit an electric current to be established between said at least one cathode and said at least one anode, said electric current reducing the concentration of said target substance in the wastewater flowing through the chamber.

Abstract: An electroplating solution includes a non-aqueous non-aromatic organic solvent and a mixture including soluble metallic salts and organic additives dissolved in the non-aqueous non-aromatic organic solvent. Electrodeposition of a metal from the electroplating solution includes preparing an electroplating solution and electrodepositing the metal from the electroplating solution onto a conductive substrate under a cathodic current. An electroplating system has a plating chamber containing an electroplating solution, an entry point to the electroplating system, and a transporting system to convey a part to be electroplated from the entry point to the plating chamber. The electroplating solution includes a non-aqueous non-aromatic organic solvent and a mixture including soluble metallic salts and organic additives, the mixture dissolved in the non-aqueous non-aromatic organic solvent.

Abstract: The invention disclosed relates to an electrochemical process for decreasing high levels of organic contaminants in metal plating baths. The process involves breaking down the organic contaminants in an electrochemical cell by electrochemical oxidation. The electrochemical cell includes an anode comprising an active material which is stable at low (acid) pH and at the high electrical potential required to break down the organic contaminants by oxidation. Typical examples of such anodes include a valve metal substrate coated with doped tin dioxide, lead dioxide, or platinum-based materials, the latter in some instances being coated on a high surface area valve metal substrate.

Abstract: Disclosed is A flow-through electrochemical reactor comprising a body having an internal chamber, and an inlet port and an outlet port in communication with said internal chamber to permit flow of wastewater therethrough, at least one porous anode arranged in said internal chamber such that the wastewater flowing between said inlet port and said outlet port flows through the pores of said at least one porous anode, said at least one porous anode having activity for the destruction of a target substance, and at least one cathode disposed in the internal chamber to permit an electric current to be established between said at least one cathode and said at least one anode, said electric current reducing the concentration of said target substance in the wastewater flowing through the chamber.