Patents by Inventor Zachary Reid

Zachary Reid has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11975870
    Abstract: Systems and methods for nuclear reactor direct drive of a cryocooler turbine. A nuclear thermal propulsion (NTP) system may have a nuclear reactor that heats a thermal working fluid for directly driving the turbine to power a cryogenic fluid management (CFM) system for keeping propellant at cryogenic temperatures. The features may be used on NTP rockets. The propellant may be liquid hydrogen.
    Type: Grant
    Filed: June 22, 2022
    Date of Patent: May 7, 2024
    Assignee: Blue Origin, LLC
    Inventor: Zachary Reid Tolley
  • Publication number: 20230415926
    Abstract: Systems and methods for nuclear reactor direct drive of a cryocooler turbine. A nuclear thermal propulsion (NTP) system may have a nuclear reactor that heats a thermal working fluid for directly driving the turbine to power a cryogenic fluid management (CFM) system for keeping propellant at cryogenic temperatures. The features may be used on NTP rockets. The propellant may be liquid hydrogen.
    Type: Application
    Filed: June 22, 2022
    Publication date: December 28, 2023
    Inventor: Zachary Reid Tolley
  • Publication number: 20130029433
    Abstract: An instrument comprises a substrate, a plurality of sensors distributed at positions across the substrate's surface, at least one electronic processing component on the surface, electrical conductors extending across the surface and connected to the sensors and processing component, and a cover disposed over the sensors, processing component and conductors. The cover and substrate have similar material properties to a production substrate. The cover is configured to electromagnetically shield the sensors, conductors, or processing component. The instrument has approximately the same thickness and/or flatness as the production substrate. It is emphasized that this abstract is provided to comply with rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
    Type: Application
    Filed: January 30, 2012
    Publication date: January 31, 2013
    Applicant: KLA-Tencor Corporation
    Inventors: Mei H. Sun, Mark Wiltse, Wayne G. Renken, Zachary Reid, Tony Dibiase
  • Patent number: 8104342
    Abstract: An instrument for measuring a parameter comprises a substrate, a plurality of sensors carried by and distributed across a surface of the substrate that individually measure the parameter at different positions, an electronic processing component carried by the substrate surface, electrical conductors extending across the surface connected to the sensors and the electronic processing component, and a cover disposed over the sensors, electronic processing component and conductors. The cover and substrate have similar material properties to a production substrate processed by a substrate processing cell. The instrument has approximately the same thickness and/or flatness as the production substrate. The instrument may be subjected a substrate process and one or more parameters may be measured with the instrument during the process. The behavior of a production wafer in the substrate process may be characterized based on measurements of the parameters made with the one or more sensors.
    Type: Grant
    Filed: February 20, 2008
    Date of Patent: January 31, 2012
    Assignee: KLA-Tencor Corporation
    Inventors: Mei H. Sun, Mark Wiltse, Wayne G. Renken, Zachary Reid, Tony DiBiase
  • Publication number: 20090056441
    Abstract: An instrument for measuring a parameter comprises a substrate, a plurality of sensors carried by and distributed across a surface of the substrate that individually measure the parameter at different positions, an electronic processing component carried by the substrate surface, electrical conductors extending across the surface connected to the sensors and the electronic processing component, and a cover disposed over the sensors, electronic processing component and conductors. The cover and substrate have similar material properties to a production substrate processed by a substrate processing cell. The instrument has approximately the same thickness and/or flatness as the production substrate. The instrument may be subjected a substrate process and one or more parameters may be measured with the instrument during the process. The behavior of a production wafer in the substrate process may be characterized based on measurements of the parameters made with the one or more sensors.
    Type: Application
    Filed: February 20, 2008
    Publication date: March 5, 2009
    Applicant: KLA-Tencor Corporation
    Inventors: Mei H. Sun, Mark Wiltse, Wayne G. Renken, Zachary Reid, Tony DiBiase