Abstract: A method for depth mapping includes providing depth mapping resources, including a radiation source, which projects optical radiation into a volume of interest containing an object, and a sensor, which senses the optical radiation reflected from the object. The volume of interest has a depth that varies with angle relative to the radiation source and the sensor. A depth map of the object is generated using the resources while applying at least one of the resources non-uniformly over the volume of interest, responsively to the varying depth as a function of the angle.

Abstract: A mobile device includes a camera module, including a lens and an image sensor. An inertial sensor in the mobile device outputs a signal indicative of an orientation of the device. A controller corrects one or more focal properties of the camera module responsively to the orientation indicated by the inertial sensor.

Abstract: A beam generating device includes a semiconductor substrate, having an optical passband. A first array of vertical-cavity surface-emitting lasers (VCSELs) is formed on a first face of the semiconductor substrate and are configured to emit respective laser beams through the substrate at a wavelength within the passband. A second array of microlenses is formed on a second face of the semiconductor substrate in respective alignment with the VCSELs so as to transmit the laser beams generated by the VCSELs. The VCSELs are configured to be driven to emit the laser beams in predefined groups in order to change a characteristic of the laser beams.

Abstract: An optoelectronic device includes a semiconductor substrate, an array of optical emitters arranged on the substrate in a two-dimensional pattern, a projection lens and a diffractive optical element (DOE). The projection lens is mounted on the semiconductor substrate and is configured to collect and focus light emitted by the optical emitters so as to project optical beams containing a light pattern corresponding to the two-dimensional pattern of the optical emitters on the substrate. The DOE is mounted on the substrate and is configured to produce and project multiple overlapping replicas of the pattern.

Abstract: A method for depth mapping includes providing depth mapping resources, including a radiation source, which projects optical radiation into a volume of interest containing an object, and a sensor, which senses the optical radiation reflected from the object. The volume of interest has a depth that varies with angle relative to the radiation source and the sensor. A depth map of the object is generated using the resources while applying at least one of the resources non-uniformly over the volume of interest, responsively to the varying depth as a function of the angle.

Abstract: Imaging apparatus includes an illumination assembly, including a plurality of radiation sources and projection optics, which are configured to project radiation from the radiation sources onto different, respective regions of a scene. An imaging assembly includes an image sensor and objective optics configured to form an optical image of the scene on the image sensor, which includes an array of sensor elements arranged in multiple groups, which are triggered by a rolling shutter to capture the radiation from the scene in successive, respective exposure periods from different, respective areas of the scene so as to form an electronic image of the scene. A controller is coupled to actuate the radiation sources sequentially in a pulsed mode so that the illumination assembly illuminates the different, respective areas of the scene in synchronization with the rolling shutter.

Abstract: An optoelectronic device includes a semiconductor substrate, an array of optical emitters arranged on the substrate in a two-dimensional pattern, a projection lens and a diffractive optical element (DOE). The projection lens is mounted on the semiconductor substrate and is configured to collect and focus light emitted by the optical emitters so as to project optical beams containing a light pattern corresponding to the two-dimensional pattern of the optical emitters on the substrate. The DOE is mounted on the substrate and is configured to produce and project multiple overlapping replicas of the pattern.

Abstract: Imaging apparatus includes an illumination assembly, including a plurality of radiation sources and projection optics, which are configured to project radiation from the radiation sources onto different, respective regions of a scene. An imaging assembly includes an image sensor and objective optics configured to form an optical image of the scene on the image sensor, which includes an array of sensor elements arranged in multiple groups, which are triggered by a rolling shutter to capture the radiation from the scene in successive, respective exposure periods from different, respective areas of the scene so as to form an electronic image of the scene. A controller is coupled to actuate the radiation sources sequentially in a pulsed mode so that the illumination assembly illuminates the different, respective areas of the scene in synchronization with the rolling shutter.

Abstract: An optoelectronic device includes a semiconductor substrate, an array of optical emitters arranged on the substrate in a two-dimensional pattern, a projection lens and a diffractive optical element (DOE). The projection lens is mounted on the semiconductor substrate and is configured to collect and focus light emitted by the optical emitters so as to project optical beams containing a light pattern corresponding to the two-dimensional pattern of the optical emitters on the substrate. The DOE is mounted on the substrate and is configured to produce and project multiple overlapping replicas of the pattern.

Abstract: An optoelectronic device includes a semiconductor substrate and a monolithic array of light-emitting elements, including first and second sets of the light-emitting elements arranged on the substrate in respective first and second two-dimensional patterns, which are interleaved on the substrate. First and second conductors are respectively connected to separately drive the first and second sets of the light-emitting elements so that the device selectably emits light in either or both of the first and second patterns.

Abstract: Imaging apparatus includes an illumination assembly, including a plurality of radiation sources and projection optics, which are configured to project radiation from the radiation sources onto different, respective regions of a scene. An imaging assembly includes an image sensor and objective optics configured to form an optical image of the scene on the image sensor, which includes an array of sensor elements arranged in multiple groups, which are triggered by a rolling shutter to capture the radiation from the scene in successive, respective exposure periods from different, respective areas of the scene so as to form an electronic image of the scene. A controller is coupled to actuate the radiation sources sequentially in a pulsed mode so that the illumination assembly illuminates the different, respective areas of the scene in synchronization with the rolling shutter.

Abstract: Optoelectronic apparatus includes a semiconductor die and a monolithic array of light-emitting elements formed on the semiconductor die in a grid pattern comprising multiple columns. Conductors formed on the die define a respective common contact for driving each column of the light-emitting elements.

Abstract: Optoelectronic apparatus includes a substrate, such as a semiconductor die and a monolithic array of light-emitting elements formed on the semiconductor die in a grid pattern comprising multiple columns. In one embodiment, the apparatus includes a cylindrical lens, having a cylinder axis that is angled relative to the columns of the grid pattern of the light-emitting elements. A diffractive optical element (DOE) is mounted on the substrate and configured to project the light emitted by the elements so as to generate a pattern of stripes corresponding to the columns of the grid pattern.

Abstract: Optical apparatus includes a semiconductor substrate and one or more radiation sources, mounted on a surface of the substrate and configured to emit optical radiation. A scanning mirror is mounted on the substrate and is configured to scan the reflected optical radiation over a predetermined angular range in a direction that is angled away from the surface.

Abstract: A beam generating device includes a semiconductor substrate, having an optical passband. A first array of vertical-cavity surface-emitting lasers (VCSELs) is formed on a first face of the semiconductor substrate and are configured to emit respective laser beams through the substrate at a wavelength within the passband. A second array of microlenses is formed on a second face of the semiconductor substrate, with the microlenses in respective alignment with the VCSELs so as to transmit the laser beams generated by the VCSELs.

Abstract: Optoelectronic apparatus includes a semiconductor die and a monolithic array of light-emitting elements formed on the semiconductor die in a grid pattern comprising multiple columns. Conductors formed on the die define a respective common contact for driving each column of the light-emitting elements. A diffractive optical element (DOE) is configured to project multiple replicas of a pattern of stripes generated by the light-emitting elements, each stripe corresponding to a respective one of the columns.

Abstract: Imaging apparatus includes an illumination assembly, including a plurality of radiation sources and projection optics, which are configured to project radiation from the radiation sources onto different, respective regions of a scene. An imaging assembly includes an image sensor and objective optics configured to form an optical image of the scene on the image sensor, which includes an array of sensor elements arranged in multiple groups, which are triggered by a rolling shutter to capture the radiation from the scene in successive, respective exposure periods from different, respective areas of the scene so as to form an electronic image of the scene. A controller is coupled to actuate the radiation sources sequentially in a pulsed mode so that the illumination assembly illuminates the different, respective areas of the scene in synchronization with the rolling shutter.

Abstract: A method for manufacturing includes forming on a surface of a metal master a pattern that defines an array of diffractive optical elements (DOEs). The pattern is replicated from the metal master onto a layer of a curable polymer that is deposited over a transparent substrate. The polymer in which the pattern has been replicated is cured, thereby setting the DOEs in the polymer. The transparent substrate is diced so as to singulate the DOEs.

Abstract: An optoelectronic device includes a semiconductor substrate and a monolithic array of light-emitting elements, including first and second sets of the light-emitting elements arranged on the substrate in respective first and second two-dimensional patterns, which are interleaved on the substrate. First and second conductors are respectively connected to separately drive the first and second sets of the light-emitting elements so that the device selectably emits light in either or both of the first and second patterns.

Abstract: Optoelectronic apparatus includes a semiconductor die and a monolithic array of light-emitting elements formed on the semiconductor die in a grid pattern comprising multiple columns. Conductors formed on the die define a respective common contact for driving each column of the light-emitting elements.