Patents by Inventor Zainal Abidin

Zainal Abidin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130312614
    Abstract: A separator vessel (5) comprising; a separation chamber (10) arranged to separate liquid from an inflow production fluid (45); at least one gas scrubber (15) for removing entrained liquid from a separated gas inflow from said separation chamber (10); wherein said at least one gas scrubber (15) is positioned above and proximate to said separation chamber (10), said gas scrubber (15) and separation chamber (10) connectable through a vertically oriented at least one liquid outflow conduit (20) arranged to direct the removed entrained liquid from the gas scrubber (15) to the separation chamber (10) wherein the conduit (20) is arranged such that an outflow end (22) of said conduit (20) extends into the separation chamber (10) such that it is lower than a minimum threshold liquid depth (65) in said separation chamber (10).
    Type: Application
    Filed: January 30, 2012
    Publication date: November 28, 2013
    Applicants: PETROLIAM NASIONAL BERHAD (PETRONAS), NGL TECH SDN. BHD.
    Inventors: Shahrul Azman B Zainal Abidin, Arul Jothy
  • Publication number: 20120133100
    Abstract: A compression unit (108) for a mechanical seal, comprising a hollow cylinder (112) having a first end (317), a second end (321), a seal face (111) attached to the second end (321), and a resilient region (210) between the first end (317) and the second end (321), characterized in that the resilient region (210) is defined by a plurality of helical slots (201) passing completely through the cylinder's (112) wall, each of the slots (201) having a distinct starting (206) and end point (207) such that the slots (201) co-axially coiled around the cylinder (112) and the starting (206) and end point (207) for each helical slot (201) are spaced around the periphery of the cylinder (112).
    Type: Application
    Filed: November 23, 2011
    Publication date: May 31, 2012
    Inventor: Azhar Bin ZAINAL ABIDIN
  • Publication number: 20120071314
    Abstract: The present invention is a new composition of matter and can be used as components of a capacitor. The dielectric properties possess in this material has improved tremendously as compared to the existing component. The finding of high dielectric permittivity in the present invention ceramic according to its formulation and processing technique that can operate or use at wide range frequencies and temperatures are very useful in electronic and electrical devices. The present invention is best for applications at the range of temperatures. The permittivity is recorded at 1 kHz are between ˜20,000 to ˜54,000 and almost constant over three decade of frequency. Thus, the dielectric permittivity obtained can be used as energy storage, sensor, electric filter, etc., besides minimizing the devices size.
    Type: Application
    Filed: June 9, 2010
    Publication date: March 22, 2012
    Inventors: Abdul Halim Shaari, Walter Charles Primus, Wan Mohd Daud Wan Yusoff, Zainal Abidin Talib, Elias Salon
  • Patent number: 7261441
    Abstract: A LED device including a first encapsulant that at least partially encapsulates a LED and resides within a light reflecting cavity, and a second encapsulant residing above the first encapsulant—wherein the first encapsulant is partially comprised of a first percentage of a first light reflecting substance. In addition, there is provided a method for constructing a LED device.
    Type: Grant
    Filed: February 27, 2004
    Date of Patent: August 28, 2007
    Assignee: Avago Technologies ECBU IP (Singapore) Pte. Ltd.
    Inventors: Kee Yean Ng, Teong Heng Sim, Keh Chin Seah, Mohammad Zamri Zainal Abidin, Fakhrul Arifin Mohd Afif, Noor Azian Mat Jiwa
  • Patent number: 7208363
    Abstract: A method of fabricating local interconnect lines (LILs) of a CMOS structures, the method comprising etching an inter layer dielectric (ILD) material of the CMOS structure at a first temperature to form one or more holes and one or more slits; and etching an etch-stop material of the CMOS structure at a second temperature lower than the first temperature to extend the holes and slits to devices of the CMOS structure.
    Type: Grant
    Filed: May 5, 2005
    Date of Patent: April 24, 2007
    Assignee: Systems on Silicon Manufacturing Co. Pte. Ltd.
    Inventors: Stephane Dufrenne, Mohd Faizal Zainal Abidin