Patents by Inventor Zerui Chen

Zerui Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240111824
    Abstract: A circuit arrangement includes an array of switches that represent a Boolean satisfiability expression that has a plurality of clauses each defined by a combination of Boolean variables Xi or ¬Xi, a first plane, and a constraints network operatively arranged with the first plane. The constraints network enforces each of the clauses such that values of different ones of the variables continue to randomly or pseudo randomly flip until the values of the variables Xi and ¬Xi stop changing or a predetermined condition occurs.
    Type: Application
    Filed: September 27, 2023
    Publication date: April 4, 2024
    Inventors: Tony Levi, Wei Wu, Sandeep Gupta, Buyun Chen, Zerui Liu, Deming Meng, Shiyu Su, Qiaochu Zhang, Shuo-Wei Chen
  • Patent number: 7847315
    Abstract: A high-efficiency power semiconductor rectifier device (10) comprising a ?P++ layer (12), a P-body (14), an N-drift region (16), an N+ substrate (18), an anode (20), and a cathode (22). The method of fabricating the device (10) comprises the steps of depositing the N-drift region (16) on the N+ substrate (18), implanting boron into the N-drift region (16) to create a P-body region (14), forming a layer of titanium silicide (56) on the P-body region (14), and concentrating a portion of the implanted boron at the interface region between the layer of titanium silicide (56) and the P-body region (14) to create the ?P++ layer (12) of supersaturated P-doped silicon.
    Type: Grant
    Filed: March 9, 2007
    Date of Patent: December 7, 2010
    Assignee: Diodes Fabtech Inc.
    Inventors: Roman J. Hamerski, Zerui Chen, James Man-Fai Hong, Johnny Duc Van Chiem, Christopher D. Hruska, Timothy Eastman
  • Publication number: 20080217721
    Abstract: A high-efficiency power semiconductor rectifier device (10) comprising a ?P++ layer (12), a P-body (14), an N-drift region (16), an N+ substrate (18), an anode (20), and a cathode (22). The method of fabricating the device (10) comprises the steps of depositing the N-drift region (16) on the N+ substrate (18), implanting boron into the N-drift region (16) to create a P-body region (14), forming a layer of titanium silicide (56) on the P-body region (14), and concentrating a portion of the implanted boron at the interface region between the layer of titanium silicide (56) and the P-body region (14) to create the ?P++ layer (12) of supersaturated P-doped silicon.
    Type: Application
    Filed: March 9, 2007
    Publication date: September 11, 2008
    Inventors: Roman J. Hamerski, Zerui Chen, James Man-Fai Hong, Johnny Duc Van Chiem, Christopher D. Hruska, Timothy Eastman