Patents by Inventor Zengzhi MA

Zengzhi MA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11810777
    Abstract: Provided is a composite encapsulating material and a photovoltaic module encapsulated with the composite encapsulating material, which relate to the technical field of photovoltaic modules. At least a partial area of the composite encapsulating material includes a high insulation material, and the high insulation material includes polyimide, modifier and modified polyimide. The above technical solution can improve an insulation performance of the encapsulating material, reduce a blank area of an edge of the module, reduce a weight of the photovoltaic module, and further reduce comprehensive cost of the photovoltaic module.
    Type: Grant
    Filed: August 21, 2020
    Date of Patent: November 7, 2023
    Assignees: Jinko Green Energy (Shanghai) Management Co., LTD., ZHEJIANG JINKO SOLAR CO., LTD.
    Inventors: Kun Yu, Changming Liu, Xinyu Zhang, Beibei Gao, Zengzhi Ma
  • Publication number: 20230142769
    Abstract: A paste and a damp-heat (DH) attenuation resistant photovoltaic cell. The paste comprises a paste body, into which an inert metal element and an oxide thereof are added, so that a barrier layer having a certain thickness can be formed on the surface of an electrode after sintering, and the barrier layer can resist oxidation and corrosion so as to enhance the oxidation resistance and the acid corrosion resistance of the metallized electrode. The electrode of the photovoltaic cell is made of the paste, and the DH attenuation resistant photovoltaic cell made of the paste can reduce DH attenuation and power loss, and has the enhanced environmental protection property and reliability.
    Type: Application
    Filed: June 2, 2020
    Publication date: May 11, 2023
    Applicants: Zhejiang Jinko Solar Co., Ltd., Jinko Solar Co., Ltd.
    Inventors: Kun YU, Changming LIU, Xinyu ZHANG, Beibei GAO, Zengzhi MA
  • Publication number: 20230131984
    Abstract: Disclosed is a barrier-type photovoltaic solder strip capable of reducing damp-heat (DH) attenuation, the photovoltaic solder strip comprising a photovoltaic solder strip body. A moisture barrier layer is arranged on a surface of the photovoltaic solder strip body that is not in contact with an electrode of a solar cell, and the moisture barrier layer can prevent external water and gas from entering the photovoltaic solder strip body, thus, on the basis of low cost, corrosion of the photovoltaic solder strip body by acidic substances, oxidizing agents and water in a module is reduced, thereby reducing attenuation of a photovoltaic module in a DH environment.
    Type: Application
    Filed: June 10, 2020
    Publication date: April 27, 2023
    Applicants: Zhejiang Jinko Solar Co., Ltd., Jinko Solar Co., Ltd.
    Inventors: Kun YU, Changming LIU, Xinyu ZHANG, Beibei GAO, Zengzhi MA
  • Publication number: 20210408309
    Abstract: Provided is a composite encapsulating material and a photovoltaic module encapsulated with the composite encapsulating material, which relate to the technical field of photovoltaic modules. At least a partial area of the composite encapsulating material includes a high insulation material, and the high insulation material includes polyimide, modifier and modified polyimide. The above technical solution can improve an insulation performance of the encapsulating material, reduce a blank area of an edge of the module, reduce a weight of the photovoltaic module, and further reduce comprehensive cost of the photovoltaic module.
    Type: Application
    Filed: August 21, 2020
    Publication date: December 30, 2021
    Inventors: Kun YU, Changming LIU, Xinyu ZHANG, Beibei GAO, Zengzhi MA