Patents by Inventor Zequn Mei
Zequn Mei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20130270585Abstract: An LED light emitter includes a single emitter structure having a substrate with a plurality of light emitting diodes (LEDs) arranged thereon, wherein the plurality of LEDs includes at least one first LED die that produces a first color light, and at least one second LED die that produces a second color light. The LED light emitter also includes a total internal reflection (TIR) lens positioned to collect light emitted from the single emitter structure and adapted to mix the light from the plurality of LEDs to produce a uniform light. The plurality of LEDs are selected such that the light output by the LED light emitter has a desired color temperature when an equal current is supplied to all of the plurality of LEDs.Type: ApplicationFiled: August 27, 2012Publication date: October 17, 2013Applicant: LedEngin, Inc.Inventors: ZEQUN MEI, XIANTAO YAN, WU JIANG
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Publication number: 20130258654Abstract: An LED-based lamp can be made to have a form factor compatible with fixtures designed for MR16 lamps. Such a lamp can have a housing that provides an external electrical connection. Inside the housing is disposed a single emitter structure having a substrate with multiple light-emitting diodes (LEDs) arranged thereon. Different LEDs produce light of different colors (or color temperatures). For example, at least one LED can produce a warm white light, while at least one other LED produces a cool white light and at least one other LED produces a red light. A total-internal-reflection (TIR) lens is positioned to collect light emitted from the single emitter structure and adapted to mix the light from the LEDs to produce a uniform white light. A diffusive coating is applied to a front face of the TIR lens for further color mixing.Type: ApplicationFiled: March 26, 2013Publication date: October 3, 2013Applicant: LedEngin, Inc.Inventors: Xiantao Yan, Wu Jiang, Zequn Mei
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Publication number: 20130168703Abstract: A method for depositing a layer of phosphor-containing material on a plurality of LED dies includes disposing a template with a plurality of openings on an adhesive tape and disposing each of a plurality of LED dies in one of the plurality of openings of the template. The method also includes disposing a stencil over the template and the plurality of LED dies. The stencil has a plurality of openings configured to expose a top surface of each of the LED dies. Next, a phosphor-containing material is disposed on the exposed top surface of each the LED dies. The method further includes removing the stencil and the template.Type: ApplicationFiled: December 28, 2011Publication date: July 4, 2013Applicant: LedEngin, Inc.Inventors: Zequn Mei, Xiantao Yan
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Patent number: 8430537Abstract: A total-internal-reflection (TIR) lens for color mixing includes a body member having an outer surface and an interior open channel extending longitudinally through the body member. The body member and the interior open channel are substantially symmetric with respect to an optical axis, and the outer surface is shaped to provide total internal reflection. The body member has a first end surface region at a first end of the open channel for accommodating a light source and a second end surface region opposite the first end region. The second end surface region includes a plurality of refractive surface regions positioned around the second end region of the open channel. The lens is configured to provide projected light substantially centered with respect to the optical axis when the light source is positioned off the optical axis. In a specific embodiment, a lighting apparatus for providing centered white light includes such a lens and a plurality of light sources.Type: GrantFiled: October 12, 2009Date of Patent: April 30, 2013Assignee: Ledengin, Inc.Inventors: Wu Jiang, Xiantao Yan, Zequn Mei
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Publication number: 20130087813Abstract: A metal plate on a multi-die LED emitter substrate or a metal plate on a metal-core printed circuit board (MCPCB) that attaches to the emitter substrate (or both plates) can be fabricated with a number of generally radial grooves, at least some of which extend to the peripheral edge of the plate. These grooves can provide channels that allow air to escape during solder-bonding processes, reducing the size and/or total area of solder voids and thereby improving thermal transfer between the emitter and the MCPCB.Type: ApplicationFiled: October 11, 2011Publication date: April 11, 2013Applicant: LedEngin, Inc.Inventors: Xiantao Yan, Debo A. Adebiyi, Zequn Mei
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Patent number: 8399268Abstract: A method for depositing a layer of phosphor-containing material on a plurality of LED dies includes disposing a template with a plurality of openings on an adhesive tape and disposing each of a plurality of LED dies in one of the plurality of openings of the template. The method also includes forming a patterned dry film photoresist layer over the template and the plurality of LED dies. The photoresist layer has a plurality of openings configured to expose a top surface of each of the LED dies. Next, a phosphor-containing material is disposed on the exposed top surface of each the LED dies. The method further includes removing the photoresist layer and the template.Type: GrantFiled: December 28, 2011Date of Patent: March 19, 2013Assignee: LedEngin, Inc.Inventors: Zequn Mei, Xiantao Yan
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Patent number: 8324641Abstract: A light-emitting device has a light source disposed on a support. A matrix material including a dispersion of beads is disposed over the light source. The refractive index of the beads is different from the refractive index of the matrix material. The light source may include an LED. The matrix material may include a lens.Type: GrantFiled: June 29, 2007Date of Patent: December 4, 2012Assignee: LedEngin, Inc.Inventors: Xiantao Yan, Zequn Mei
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Publication number: 20120286669Abstract: The color of an LED-based lamp can be tuned to a desired color or color temperature. The lamp can include two or more independently addressable groups of LEDs associated with different colors or color temperatures and a total-internal-reflection (TIR) color-mixing lens to produce light of a uniform color by mixing the light from the different groups of LEDs. The color of the output light is tuned by controllably dividing an input current among the groups of LEDs. Tuning can be performed once, e.g., during manufacture, and the lamp does not require active feedback components for maintaining color temperature.Type: ApplicationFiled: May 12, 2011Publication date: November 15, 2012Applicant: LedEngin, Inc.Inventors: Xiantao Yan, Kachun Lee, Zequn Mei
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Publication number: 20120286218Abstract: A method of making an electrically conductive ink is provided. This ink is suitable for use in a photovoltaic device. The method includes the steps of providing solder particles, providing a surface oxide removal material; and formulating an ink with the solder particles and the surface oxide removal material. As a result, a solder is formed. This solder maintains electrical conductivity when used in the ink at a processing temperature less than 250 C.Type: ApplicationFiled: May 11, 2012Publication date: November 15, 2012Applicant: NANOSOLAR, INC.Inventors: Zequn Mei, Darren Lochun
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Publication number: 20100091491Abstract: A total-internal-reflection (TIR) lens for color mixing includes a body member having an outer surface and an interior open channel extending longitudinally through the body member. The body member and the interior open channel are substantially symmetric with respect to an optical axis, and the outer surface is shaped to provide total internal reflection. The body member has a first end surface region at a first end of the open channel for accommodating a light source and a second end surface region opposite the first end region. The second end surface region includes a plurality of refractive surface regions positioned around the second end region of the open channel. The lens is configured to provide projected light substantially centered with respect to the optical axis when the light source is positioned off the optical axis. In a specific embodiment, a lighting apparatus for providing centered white light includes such a lens and a plurality of light sources.Type: ApplicationFiled: October 12, 2009Publication date: April 15, 2010Applicant: LedEngin, Inc.Inventors: Wu Jiang, Xiantao Yan, Zequn Mei
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Patent number: 7504312Abstract: An electrical resistor structure overlies a substrate and comprises a composite resistor having a first resistor of relatively low resistance and a second resistor of relatively high resistance overlying the first resistor. First and second electrodes make contact with the composite resistor at spaced locations, and a bond pad overlies the second resistor at a position between the electrodes. A metallized fiber is soldered a to a metal bond pad by providing a stacked resistor structure beneath the bond pad, disposing a solder preform over the bond pad, disposing the metallized fiber over the bond pad, and flowing a current through the stacked resistor structure. The stacked resistor structure, when subjected to a current flowing generally along a first axis, is characterized by a temperature profile that has first and second peaks on either side of the bond pad.Type: GrantFiled: January 31, 2007Date of Patent: March 17, 2009Assignee: Emcore CorporationInventors: Zequn Mei, Richard D. Bjorn, Frans Kusnadi, John Cameron Major
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Publication number: 20090001390Abstract: A light-emitting device has a light source disposed on a support. A matrix material including a dispersion of beads is disposed over the light source. The refractive index of the beads is different from the refractive index of the matrix material. The light source may include an LED. The matrix material may include a lens.Type: ApplicationFiled: June 29, 2007Publication date: January 1, 2009Inventors: Xiantao Yan, Zequn Mei
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Publication number: 20070132064Abstract: An electrical resistor structure overlies a substrate and comprises a composite resistor having a first resistor of relatively low resistance and a second resistor of relatively high resistance overlying the first resistor. First and second electrodes make contact with the composite resistor at spaced locations, and a bond pad overlies the second resistor at a position between the electrodes. A metallized fiber is soldered a to a metal bond pad by providing a stacked resistor structure beneath the bond pad, disposing a solder preform over the bond pad, disposing the metallized fiber over the bond pad, and flowing a current through the stacked resistor structure. The stacked resistor structure, when subjected to a current flowing generally along a first axis, is characterized by a temperature profile that has first and second peaks on either side of the bond pad.Type: ApplicationFiled: January 31, 2007Publication date: June 14, 2007Applicant: K2 Optronics, Inc.Inventors: Zequn Mei, Richard Bjorn, Frans Kusnadi, John Cameron Major
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Patent number: 7199446Abstract: An electrical resistor structure overlies a substrate and comprises a composite resistor having a first resistor of relatively low resistance and a second resistor of relatively high resistance overlying the first resistor. First and second electrodes make contact with the composite resistor at spaced locations, and a bond pad overlies the second resistor at a position between the electrodes. A metallized fiber is soldered a to a metal bond pad by providing a stacked resistor structure beneath the bond pad, disposing a solder preform over the bond pad, disposing the metallized fiber over the bond pad, and flowing a current through the stacked resistor structure. The stacked resistor structure, when subjected to a current flowing generally along a first axis, is characterized by a temperature profile that has first and second peaks on either side of the bond pad.Type: GrantFiled: February 18, 2003Date of Patent: April 3, 2007Assignee: K2 Optronics, Inc.Inventors: Zequn Mei, Richard D. Bjorn, Frans Kusnadi, John Cameron Major
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Patent number: 7168608Abstract: System and method for formation of a hermetic seal with an significantly greater melting temperature than the melting temperature of the solder employed. The hermetic seal is formed from a solder with a low melting point and a metal having a predetermined thickness that corresponds to the solder. The solder and metal combination undergoes reflow for a period of time relative to the solder thickness. The resultant seal has a melting point at a temperature significantly greater than the melting temperature of the solder.Type: GrantFiled: December 24, 2002Date of Patent: January 30, 2007Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.Inventor: Zequn Mei
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Patent number: 6680128Abstract: Solder compositions, solder pastes and methods of manufacturing thereof having a solder material coated with a coating material by an immersion coating process or an electroless plating process. The solder composition and solder pastes are substantially lead-free and have melting temperatures approaching those of traditional tin-lead solders.Type: GrantFiled: September 27, 2001Date of Patent: January 20, 2004Assignee: Agilent Technologies, Inc.Inventor: Zequn Mei
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Publication number: 20030059642Abstract: Solder compositions, solder pastes and methods of manufacturing thereof having a solder material coated with a coating material by an immersion coating process or an electroless plating process. The solder composition and solder pastes are substantially lead-free and have melting temperatures approaching those of traditional tin-lead solders.Type: ApplicationFiled: September 27, 2001Publication date: March 27, 2003Inventor: Zequn Mei
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Patent number: 6307160Abstract: A high-strength solder interconnect formed on a copper/electroless nickel/immersion gold metallization solder pad and method. The invention provides a low cost, high-strength solder interconnect on a copper/electroless nickel/immersion gold metallization (CENIGM) pad that can be formed at a temperature at or below the temperature used in eutectic tin-lead (Sn—Pb) solder applications. The invention includes a first substrate having a solder-wettable pad and a second substrate having a copper/electroless nickel/immersion gold metallization (CENIGM) solder pad. The invention also provides a solder interconnect between the solder-wettable pad and the CENIGM solder pad. The invention may provide a solder interconnect that includes a solder body including at least 2% indium (In) by weight and wetted to both the CENIGM solder pad and the solder-wettable pad.Type: GrantFiled: October 29, 1998Date of Patent: October 23, 2001Assignee: Agilent Technologies, Inc.Inventors: Zequn Mei, Ali Eslambolchi