Abstract: An electronic device includes a central processing module having a base board, a central processing unit fixed to the base board, and a heat dissipation assembly secured to the base board. The heat dissipation assembly has a first heat sink, a second heat sink and an air deflector. The air deflector blocks an opening of the channel to deflect and guide airflow flow through the first heat sink and the second heat sink.

Abstract: A method for control a temperature of a computing device detects a first CPU temperature TN1 using a thermal sensor, controls the fan to swivel from an angle corresponding to the initial cooling location to an angle corresponding to a new cooling location according to a preset swiveling angle of the fan to cool the CPU according to a preset initial rotational speed if the TN1 is not less than a preset maximum temperature Tmax of the CPU, detects a second CPU temperature TN2 using the thermal sensor if the cooling time of the fan at the initial rotational speed is equal to the preset cooling time. The method controls the fan to swivel from the angle corresponding to the new cooling location to the angle corresponding to the initial cooling location according to the swiveling angle of the fan if the TN2 is less than the Tmax.

Abstract: A noise reduction apparatus is mounted in a container data center. The container data center includes a container and a number of servers mounted inside the container. The noise reduction apparatus includes a first sensor, a number of fan adjusting systems, and a number of temperature sensors. The first sensor is mounted at an entrance of the container. When a user enters the container, the first sensor outputs a first control signal. The fan adjusting systems slow down fans in the servers according to the first control signal. When the user leaves the container, the first sensor outputs a second control signal. The fan adjusting systems speed up the fans according to the second control signal. The temperature sensors sense temperatures inside the servers respectively. The fan adjusting systems further speed up the fans when the temperatures exceed a preset temperature.

Abstract: An exemplary heat dissipation device includes a centrifugal fan and a fin assembly. The centrifugal fan includes a fan frame and an impeller mounted in the fan frame. The fan frame includes a base plate, a cover plate and a side wall extending between the base plate and the cover plate. An air outlet is defined in the side wall. The fin assembly is arranged at the air outlet. The cover plate defines an air inlet corresponding to the impeller and forms an air blocking portion near the air outlet. The air blocking portion defines a space therein. A total cross-sectional area of the space of the air blocking portion increases from an inner side of the air blocking portion near the impeller to an outer side of the air blocking portion near the fin assembly, so that the airflow generated by the impeller can be prevented from reflowing back to the impeller from the fin assembly.

Abstract: An electronic device includes a chassis, a group of fans, and an air conducting cover. The air conducting cover defines a number of air entrances, and the fans respectively facing the corresponding air entrance. Each entrance including two opposite flaps. Air flow enters the air entrances. When air flow reversely passes through the air entrances, the air flow closes the flaps.

Abstract: A light emitting apparatus and a control method thereof are provided. The light emitting apparatus has a semiconductor device capable of emitting light, and the control method includes the following descriptions. A driving power of the semiconductor device is reduced to an ideal power stepwise and gradually. After every time the driving power of the semiconductor device is reduced, the semiconductor device continually emits the light by the reduced driving power within a predetermined time.

Abstract: A motherboard includes a main circuit board, a CPU socket, and an interface. The main circuit board includes a holding surface and a side wall connected to the holding surface. The CPU socket is positioned on the holding surface. The interface is positioned on the side wall. The interface is electrically connected to the CPU socket. The interface provides a connection between the main circuit board and a sub-circuit board.

Abstract: An electronic device includes a central processing module having a base board, a central processing unit fixed to the base board, and a heat dissipation assembly secured to the base board. The heat dissipation assembly has a first heat sink, a second heat sink and an air deflector. The air deflector blocks an opening of the channel to deflect and guide airflow flow through the first heat sink and the second heat sink.

Abstract: An electronic device includes a casing, an electronic component accommodated in the casing; and a composite heat conductive layer between the casing and the electronic component. The composite heat conductive layer includes a graphite layer and a thermal pad layer between the electronic component and the graphite layer. The thermal pad layer is attached to the electronic component. The graphite layer is attached to an inner surface of the casing. The graphite layer is located between the casing and the thermal pad layer. Heat conductive efficiency of the graphite layer along a horizontal spreading direction thereof exceeds that along a vertical thickness direction thereof. A surface area of the graphite layer is not less than that of the electronic component. Heat generated by the electronic component is evenly transferred and is spread to the casing via the graphite layer of the composite heat conductive layer.

Abstract: A cooling system includes an area heat extraction hardware, a cooling device including an evaporator, a compressor and a condenser, a grounded-coupled heat exchanger connecting to the condenser and a cooling medium circularly flowing in the area heat extraction hardware, the cooling device and the grounded-coupled heat exchanger. The area heat extraction hardware extracts heat from the air and heats the cooling medium. The heated cooling medium passes through the evaporator and the evaporator extracts the heat of the heated cooling medium. The compressor transfers the heat extracted by the evaporator to the condenser. The condenser transfers the heat from the compressor to the grounded-coupled heat exchanger. The grounded-coupled heat exchanger transfers the heat of the cooling medium to the ground so the cooling medium is cooled.

Abstract: A heat dissipation apparatus includes an air conditioning unit, a plurality of temperature sensors, a plurality of adjustable air outlet boards, a plurality of actuators, and a control unit. The temperature sensors determine the temperature of server racks. The adjustable air outlet boards guide airflow from the air conditioning device to the corresponding server racks. The actuator adjusts the corresponding adjustable air outlet board to alter the airflow to the corresponding server rack. The control unit receives the temperature detected by the temperature sensors to submit corresponding control signals, altering power supplied to the air conditioning unit and adjust the adjustable air outlet boards through the actuators. The present disclosure further provides a heat dissipation method and a container data center including the heat dissipation apparatus as disclosed.

Abstract: A case includes a box, a top cover, a first airflow guide member, and a second airflow guide member. The box has an opening sealed by the top cover. The first airflow guide member and the second airflow guide member are fixed on at least one of the top cover and a side plate of the box. The first airflow guide member and the second airflow guide member are spaced from each other, and cooperatively define a guide channel. The box defines an inlet and an outlet communicating with the guide channel.

Abstract: A container data center includes a container defining a number of inlets, a number of server systems received in the container. A cold aisle is defined between the container and the server systems. The cold aisle forms a number of commutating portions each corresponding to one of the inlets. Each commutating portion includes a ventilation plate opposite to the corresponding inlet. The ventilation plate defines a number of ventilation holes.

Abstract: An electronic device includes a chassis, a circuit board installed in the chassis, a memory card coupled to the circuit board, and a heat sink for cooling the memory card. The heat sink includes a first cooling plate, a second cooling plate, and a connection member connected between corresponding sides of the first cooling plate and the second cooling plate. A conducting member extends from the connection member, and contacts the chassis.

Abstract: A fan duty cycle controlling system and method are implemented by a computing device. The fan duty cycle controlling system obtains an optimum duty cycle range of a fan around a central processing unit (CPU), and controls the fan to operate at the optimum duty cycle range. By implementing the system and method, the computing device can obtain an optimum cooling efficiency of the computer system, and reduce system noise generated by the fan when the fan operates at the optimum duty cycle range.

Abstract: The disclosure relates to a waste heat utilizing system for a container data center. The waste heat utilizing system includes a first heat exchanger received in and absorbing heat from the container data center, a water inlet pipe communicated with the first heat exchanger for supplying water to the first heat exchanger to exchange heat, a second pipe communicated with the first heat exchanger for removing heated water from the first heat exchanger, a second heat exchanger connected to the second pipe for dissipating heat of the heated water removed from the first heat exchanger, and a heat utilizing device receiving the second heat exchanger therein for absorbing the heat dissipated by the second heat exchanger. A third pipe is dipped into water container and connected to an outlet of the second heat exchanger, and water is flowed back to the water container via the third pipe.

Abstract: A hard disk backplane structure includes a main body and an additional board. The hard disk backplane structure includes a first side surface and second side surface adjacent to the first side surface and a backplane connector. The additional board includes a receptacle for connection with an additional electrical component. A hard disk cooling assembly using the hard disk backplane structure is also provided in the disclosure.

Abstract: A heat dissipation apparatus is arranged in a housing of an electronic device. The electronic device includes a motherboard mounted in the housing. The heat dissipation apparatus includes a heat dissipation block mounted to an electronic element of the motherboard, a heat sink, a number of pipes connecting the heat sink to the heat dissipation block, and a plate plugged in a socket of the motherboard. The heat sink is mounted to the plate.

Abstract: A liquid cooling device includes a heat dissipating module and a container thermally connected to the heat dissipating module. The heat dissipating module includes a chamber, a first liquid inlet accessing the chamber and a first liquid outlet accessing the chamber. The container includes a liquid feeding channel and a liquid releasing channel isolated from each other. The liquid feeding channel accesses the chamber via the first liquid inlet. The liquid releasing channel accesses the chamber via the first liquid outlet. Heat absorbed by the heat dissipating module is taken away by a coolant successively flowing through the liquid feeding channel, the first liquid inlet, the chamber, the first liquid outlet and the liquid releasing channel.

Abstract: A modular data center includes a container and a heat-dissipating control system. The container defines an opening with a cover rotatably mounted to the container to cover or uncover the opening when needed to assist in dissipating heat. The heat-dissipating control system includes a temperature sensor, a comparison unit, and a driving device. The temperature sensor is used to sense a temperature in the container, and output a sensed temperature value. The comparison unit is used to receive the sensed temperature value, and compare the sensed temperature value with a first predetermined temperature value. When the sensed temperature value is greater than or equal to the first predetermined temperature value, the comparison unit outputs a control signal. The driving device is used to open the cover to expose the opening after receiving the first control signal.