Patents by Inventor Zezhong Fu

Zezhong Fu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit edge protection method and apparatus
    Patent number: 7678613
    Abstract: An apparatus, method, and system for providing a mechanical divider adapted to shield at least a portion of an active surface of an integrated circuit from out-gassing from underfill material. The mechanical divider is attached to a mounting substrate. The underfill material is dispensed on the mounting substrate. The integrated circuit is placed on both the mechanical divider and on the underfill material after the mechanical divider has been at least partially cured. The mechanical divider may include a base surface adapted to contact the mounting substrate, a lower wall surface extending upwardly from the base surface, an upper wall surface adapted to abut a side wall of the integrated circuit, and a ledge surface extending between the lower wall surface and the upper wall surface, the ledge surface adapted to contact at least a portion of the active surface of the integrated circuit.
    Type: Grant
    Filed: April 3, 2008
    Date of Patent: March 16, 2010
    Assignee: Intel Corporation
    Inventors: Lee Peng Khaw, Kam Meng Chong, Diego Diaz, Zhiyong Wang, Zezhong Fu
  • INTEGRATED CIRCUIT EDGE PROTECTION METHOD AND APPARATUS
    Publication number: 20080188038
    Abstract: An apparatus, method, and system for providing a mechanical divider adapted to shield at least a portion of an active surface of an integrated circuit from out-gassing from underfill material. The mechanical divider is attached to a mounting substrate. The underfill material is dispensed on the mounting substrate. The integrated circuit is placed on both the mechanical divider and on the underfill material after the mechanical divider has been at least partially cured. The mechanical divider may include a base surface adapted to contact the mounting substrate, a lower wall surface extending upwardly from the base surface, an upper wall surface adapted to abut a side wall of the integrated circuit, and a ledge surface extending between the lower wall surface and the upper wall surface, the ledge surface adapted to contact at least a portion of the active surface of the integrated circuit.
    Type: Application
    Filed: April 3, 2008
    Publication date: August 7, 2008
    Inventors: Lee Peng Khaw, Kam Meng Chong, Diego Diaz, Zhiyong Wang, Zezhong Fu
  • Integrated circuit edge protection method and apparatus
    Patent number: 7372134
    Abstract: An apparatus, method, and system for providing a mechanical divider adapted to shield at least a portion of an active surface of an integrated circuit from out-gassing from underfill material. The mechanical divider is attached to a mounting substrate. The underfill material is dispensed on the mounting substrate. The integrated circuit is placed on both the mechanical divider and on the underfill material after the mechanical divider has been at least partially cured. The mechanical divider may include a base surface adapted to contact the mounting substrate, a lower wall surface extending upwardly from the base surface, an upper wall surface adapted to abut a side wall of the integrated circuit, and a ledge surface extending between the lower wall surface and the upper wall surface, the ledge surface adapted to contact at least a portion of the active surface of the integrated circuit.
    Type: Grant
    Filed: March 31, 2005
    Date of Patent: May 13, 2008
    Assignee: Intel Corporation
    Inventors: Lee Peng Khaw, Kam Meng Chong, Diego Diaz, Zhiyong Wang, Zezhong Fu
  • Integrated circuit edge protection method and apparatus
    Publication number: 20060223239
    Abstract: An apparatus, method, and system for providing a mechanical divider adapted to shield at least a portion of an active surface of an integrated circuit from out-gassing from underfill material. The mechanical divider is attached to a mounting substrate. The underfill material is dispensed on the mounting substrate. The integrated circuit is placed on both the mechanical divider and on the underfill material after the mechanical divider has been at least partially cured. The mechanical divider may include a base surface adapted to contact the mounting substrate, a lower wall surface extending upwardly from the base surface, an upper wall surface adapted to abut a side wall of the integrated circuit, and a ledge surface extending between the lower wall surface and the upper wall surface, the ledge surface adapted to contact at least a portion of the active surface of the integrated circuit.
    Type: Application
    Filed: March 31, 2005
    Publication date: October 5, 2006
    Inventors: Lee Khaw, Kam Chong, Diego Diaz, Zhiyong Wang, Zezhong Fu