Abstract: A heat recycling system for recycling heat from an electronic device includes a first tube, a second tube, and a plurality of thermoelectric modules. The first tube is used to receive heated air from the electronic device. The second tube is used to receive cooling air from outside. A first end of each thermoelectric module is inserted into the first tube, and a second end of each thermoelectric module is inserted into the second tube. Therefore, the number of thermoelectric modules may generate current.

Abstract: A heat recycling system for recycling heat from an electronic device includes a pipe with an inside tube and an outside tube coiled around the inside tube. The inside tube is connected to a first airduct to receive heated air from the electronic device. The outside tube is to receive cooling air from outside. A number of thermoelectric modules are formed in walls of the inside tube. A first end of each thermoelectric module is inserted into the outside tube, and a second end of each thermoelectric module is inserted into the inside tube. Therefore, the number of thermoelectric modules may generate current.

Abstract: When the detected temperature by the first temperature sensor is greater than the preset temperature value, the controller controls the airflow capacity of the waste heat inputted into the first intake apparatus to be reduced and controls the airflow capacity of the cold air inputted into the second intake apparatus to increase, therefore, the temperature of the waste heat inputted into the first intake apparatus is reduced. When the detected temperature by the first temperature sensor is less than the preset temperature value, the controller controls the heater to heat the waste heat inputted into the first intake apparatus, when the detected temperature by the first temperature sensor reaches the preset temperature value, the controller controls the first valve to open, to output the waste heat.

Abstract: A server cabinet includes a rack and an air baffle plate. The rack defines an interior space configured for accommodating a plurality of servers therein. The rack includes a top wall, an opposite bottom wall and two sidewalls respectively connected between left sides of the top and the bottom walls and right sides of the top and the bottom walls. The servers are arranged along a bottom-to-top direction. Each of the servers is fixed between the two sidewalls. A space is defined between a topmost server and the top wall. The air baffle plate is positioned in the space for blocking an airflow on a rear side of the servers from flowing back to a front side of the servers via the space.

Abstract: A server cabinet includes a rack and a common power supply received in the rack. The rack defines an interior space configured for accommodating a plurality of servers therein. Each server has an electrical plug at an outer side thereof. The common power supply includes a power input socket and a plurality of power output sockets. The power output sockets are configured to electrically connect to the server electrical plugs, respectively. The common power supply is configured for receiving AC power from an external power source via the power input socket, and converting the AC power to DC power and outputting the DC power to the servers via the power output sockets.

Abstract: A server cabinet includes a rack and a plurality of I/O modules received in the rack. The rack defines an interior space for accommodating a plurality of servers therein. Each server includes a plurality of I/O ports at an outer side thereof. Each of the I/O modules includes a casing, a driving mechanism received in the casing and a plurality of I/O sockets. A plurality of apertures corresponding to the I/O sockets are defined in one side of the casing. The driving mechanism is configured for controlling the I/O sockets telescopically move out of the casing through the apertures or back to the casing. The I/O sockets of each of the I/O modules is configured to electrically connect the I/O ports of each of the servers, respectively, when the I/O sockets are out of the casing.

Abstract: A server cabinet includes a rack and a plurality of I/O modules received in the rack. The rack defines an interior space for accommodating a plurality of servers therein. Each server includes a plurality of I/O ports at an outer side thereof. Each of the I/O modules includes a casing, a driving mechanism received in the casing and a plurality of I/O sockets. A plurality of apertures corresponding to the I/O sockets are defined in one side of the casing. The driving mechanism is configured for controlling the I/O sockets telescopically move out of the casing through the apertures or back to the casing. The I/O sockets of each of the I/O modules is configured to electrically connect the I/O ports of each of the servers, respectively, when the I/O sockets are out of the casing.

Abstract: A server cabinet includes a rack and a common power supply received in the rack. The rack defines an interior space configured for accommodating a plurality of servers therein. Each server has an electrical plug at an outer side thereof. The common power supply includes a power input socket and a plurality of power output sockets. The power output sockets are configured to electrically connect to the server electrical plugs, respectively. The common power supply is configured for receiving AC power from an external power source via the power input socket, and converting the AC power to DC power and outputting the DC power to the servers via the power output sockets.

Abstract: A server cabinet includes a rack and an air baffle plate. The rack defines an interior space configured for accommodating a plurality of servers therein. The rack includes a top wall, an opposite bottom wall and two sidewalls respectively connected between left sides of the top and the bottom walls and right sides of the top and the bottom walls. The servers are arranged along a bottom-to-top direction. Each of the servers is fixed between the two sidewalls. A space is defined between a topmost server and the top wall. The air baffle plate is positioned in the space for blocking an airflow on a rear side of the servers from flowing back to a front side of the servers via the space.

Abstract: When the detected temperature by the first temperature sensor is greater than the preset temperature value, the controller controls the airflow capacity of the waste heat inputted into the first intake apparatus to be reduced and controls the airflow capacity of the cold air inputted into the second intake apparatus to increase, therefore, the temperature of the waste heat inputted into the first intake apparatus is reduced. When the detected temperature by the first temperature sensor is less than the preset temperature value, the controller controls the heater to heat the waste heat inputted into the first intake apparatus, when the detected temperature by the first temperature sensor reaches the preset temperature value, the controller controls the first valve to open, to output the waste heat.

Abstract: A heat recycling system for recycling heat from an electronic device includes a pipe with an inside tube and an outside tube coiled around the inside tube. The inside tube is connected to a first airduct to receive heated air from the electronic device. The outside tube is to receive cooling air from outside. A number of thermoelectric modules are formed in walls of the inside tube. A first end of each thermoelectric module is inserted into the outside tube, and a second end of each thermoelectric module is inserted into the inside tube. Therefore, the number of thermoelectric modules may generate current.