Abstract: A device implementing the subject technology may include at least one processor configured to transmit an allocation request requesting allocation of a group communication session with a plurality of devices and receive an allocation response in response to the allocation request, the allocation response including credential information for the device to use to join the group communication session. The at least one processor may be further configured to transmit an allocation bind request with the credential information to join the group communication session using the credential information and receive an allocation bind success response in response to the allocation bind request, the allocation bind success response indicating that the device has joined the group communication session. The at least one processor may be further configured to provide a join notification to the plurality of devices via an intermediary device to notify that the device has joined the group communication session.

Abstract: The present disclosure relates to a semiconductor device and a method of fabricating the same, which includes a substrate, a plurality of bit lines, a plurality of first plugs, a first spacer, a second spacer, a plurality of second plugs and a metal silicide layer. The bit lines are disposed on the substrate. The first plugs are disposed on the substrate and separated from the bit lines. The first spacer and the second spacer are disposed between each of the bit lines and the first plugs, and include a first height and a second height respectively. The second plugs are disposed on the first plugs respectively, and the metal silicide layer is disposed between the first plugs and the second plugs, wherein an end surface of the metal silicide layer is clamped between the second spacer and the first spacer.

Abstract: A planar transformer includes a magnetic core assembly, at least one printed circuit board and at least one winding module. The magnetic core assembly includes a first magnetic core and a second magnetic core. The at least one printed circuit board is disposed between the first magnetic core and the second magnetic core. The printed circuit board includes a first winding. The at least one winding module is disposed between the first magnetic core and the second magnetic core. The winding module includes a second winding and a plastic molding layer. At least a portion of the second winding is covered by the plastic molding layer. The at least one printed circuit board and the at least one winding module are individual components.

Abstract: This invention relates to a connector socket structure, including a main socket structure, two terminal bases, two USB terminals, two eSATA terminals, one first fixing cap, one RJ45 networking unit, one second fixing cap, one rear shell and one front shell, so as to provide a rigid structure for RJ45 networking function and to enable two individual multi-purpose sockets which simultaneously fit standard USB2.0, USB3.0 and eSATA three-in-one connection.