Patents by Inventor ZhaoJian Chen

ZhaoJian Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Component carrier comprising a copper filled multiple-diameter laser drilled bore
    Patent number: 10701793
    Abstract: A component carrier includes a layer stack formed of an electrically insulating structure and an electrically conductive structure. Furthermore, a bore extends into the layer stack and has a first bore section with a first diameter (D1) and a connected second bore section with a second diameter (D2) differing from the first diameter (D1). A thermally conductive material fills substantially the entire bore. The bore is in particular formed by laser drilling.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: June 30, 2020
    Assignee: AT&S (China) Co., Ltd.
    Inventors: Nikolaus Bauer-Öppinger, ZhaoJian Chen, Yucun Dou, Wilhelm Tamm
  • Component Carrier Comprising a Copper Filled Multiple-Diameter Laser Drilled Bore
    Publication number: 20190215950
    Abstract: A component carrier includes a layer stack formed of an electrically insulating structure and an electrically conductive structure. Furthermore, a bore extends into the layer stack and has a first bore section with a first diameter (D1) and a connected second bore section with a second diameter (D2) differing from the first diameter (D1). A thermally conductive material fills substantially the entire bore. The bore is in particular formed by laser drilling.
    Type: Application
    Filed: March 19, 2019
    Publication date: July 11, 2019
    Inventors: Nikolaus Bauer-Öppinger, ZhaoJian Chen, Yucun Dou, Wilhelm Tamm
  • Component carrier comprising a copper filled multiple-diameter laser drilled bore
    Patent number: 10278280
    Abstract: A component carrier includes a layer stack formed of an electrically insulating structure and an electrically conductive structure. Furthermore, a bore extends into the layer stack and has a first bore section with a first diameter (D1) and a connected second bore section with a second diameter (D2) differing from the first diameter (D1). A thermally conductive material fills substantially the entire bore. The bore is in particular formed by laser drilling.
    Type: Grant
    Filed: January 28, 2017
    Date of Patent: April 30, 2019
    Assignee: AT&S (China) Co. Ltd.
    Inventors: Nikolaus Bauer-Öppinger, ZhaoJian Chen, Yucun Dou, Wilhelm Tamm
  • Component Carrier Comprising a Copper Filled Multiple-Diameter Laser Drilled Bore
    Publication number: 20170223820
    Abstract: A component carrier includes a layer stack formed of an electrically insulating structure and an electrically conductive structure. Furthermore, a bore extends into the layer stack and has a first bore section with a first diameter (D1) and a connected second bore section with a second diameter (D2) differing from the first diameter (D1). A thermally conductive material fills substantially the entire bore. The bore is in particular formed by laser drilling.
    Type: Application
    Filed: January 28, 2017
    Publication date: August 3, 2017
    Inventors: Nikolaus Bauer-Öppinger, ZhaoJian Chen, Yucun Dou, Wilhelm Tamm