Patents by Inventor Zhaomeng Wang
Zhaomeng Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11706902Abstract: A cold plate may include a plate body having a thermal conductive side; a plurality of parallel hollow fluid channels running inside the plate body; at least one fluid inlet in direct fluid communication with a first subset of the plurality of parallel hollow fluid channels; at least one fluid outlet in direct fluid communication with a second subset of the plurality of parallel hollow fluid channels; and a porous thermal conductive structure which fluidly connect the first subset of the plurality of parallel hollow fluid channels to the second subset of the plurality of parallel hollow fluid channels, and which is in thermal contact with the thermal conductive side of the plate body. The porous thermal conductive structure may include a plurality of elongate fluid contact surface regions, each may be extending continuously lengthwise along a longitudinal side of respective fluid channel to serve as a fluid interface.Type: GrantFiled: August 19, 2021Date of Patent: July 18, 2023Assignee: AEM SINGAPORE PTE. LTD.Inventors: See Jean Chan, Zhaomeng Wang
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Patent number: 11454666Abstract: A thermal test head for an integrated circuit device includes a heat exchanger assembly, a contact assembly configured to contact the integrated circuit, and a thermal control assembly disposed between the heat exchanger assembly and the contact assembly. The thermal control assembly includes a Peltier device in thermal contact with opposing surfaces of the heat exchanger assembly and the contact assembly, and a spacer in physical contact with the opposing surfaces of the heat exchanger assembly and the contact assembly.Type: GrantFiled: September 16, 2020Date of Patent: September 27, 2022Assignee: AEM SINGAPORE PTE LTDInventors: See Jean Chan, Zhaomeng Wang, Yao Kun Leonard Mak, MuralliKrishna Govindandhanasekaran
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Patent number: 11378615Abstract: A thermal test head for an integrated circuit device includes a heat exchanger assembly, a contact assembly configured to contact the integrated circuit, and a thermal control assembly disposed between the heat exchanger assembly and the contact assembly. The thermal control assembly includes a Peltier device in thermal contact with opposing surfaces of the heat exchanger assembly and the contact assembly, and a spacer in physical contact with the opposing surfaces of the heat exchanger assembly and the contact assembly.Type: GrantFiled: September 16, 2020Date of Patent: July 5, 2022Assignee: AEM SINGAPORE PTE LTDInventors: See Jean Chan, Zhaomeng Wang, Yao Kun Leonard Mak, MuralliKrishna Govindandhanasekaran
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Publication number: 20210385968Abstract: A cold plate may include a plate body having a thermal conductive side; a plurality of parallel hollow fluid channels running inside the plate body; at least one fluid inlet in direct fluid communication with a first subset of the plurality of parallel hollow fluid channels; at least one fluid outlet in direct fluid communication with a second subset of the plurality of parallel hollow fluid channels; and a porous thermal conductive structure which fluidly connect the first subset of the plurality of parallel hollow fluid channels to the second subset of the plurality of parallel hollow fluid channels, and which is in thermal contact with the thermal conductive side of the plate body. The porous thermal conductive structure may include a plurality of elongate fluid contact surface regions, each may be extending continuously lengthwise along a longitudinal side of respective fluid channel to serve as a fluid interface.Type: ApplicationFiled: August 19, 2021Publication date: December 9, 2021Inventors: See Jean Chan, Zhaomeng Wang
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Patent number: 11181575Abstract: A compact tester including a housing having a base plate and a roof plate being parallel and defining a space therebetween. The compact tester includes one or more device-under-test press units having an actuator and a contact head movable by the actuator. The compact tester includes a reinforcement arrangement having a roof reinforcement sub-arrangement coupled to the roof plate and an upright reinforcement sub-arrangement coupled to the base plate. The upright reinforcement sub-arrangement includes a pair of reinforcing side walls extending upright from the base plate. The roof reinforcement sub-arrangement includes a reinforcing structure having a reinforcing panel portion attached flat against the roof plate and an elongated reinforcing rib portion protruding from the reinforcing panel portion and away from the roof plate.Type: GrantFiled: July 8, 2020Date of Patent: November 23, 2021Assignee: AEM Singapore Pte. Ltd.Inventors: See Jean Chan, Shiau Fen Lau, Jiun Pin Goh, Zhaomeng Wang, Seenivas Rao Balachandran, Leonard Yao Kun Mak, Prabaharan Pichaiyan
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Publication number: 20210325453Abstract: A thermal test head for an integrated circuit device includes a heat exchanger assembly, a contact assembly configured to contact the integrated circuit, and a thermal control assembly disposed between the heat exchanger assembly and the contact assembly. The thermal control assembly includes a Peltier device in thermal contact with opposing surfaces of the heat exchanger assembly and the contact assembly, and a spacer in physical contact with the opposing surfaces of the heat exchanger assembly and the contact assembly.Type: ApplicationFiled: September 16, 2020Publication date: October 21, 2021Applicant: AEM SINGAPORE PTE LTDInventors: See Jean CHAN, Zhaomeng WANG, Yao Kun Leonard MAK, MuralliKrishna GOVINDANDHANASEKARAN
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Publication number: 20210325452Abstract: A thermal test head for an integrated circuit device includes a heat exchanger assembly, a contact assembly configured to contact the integrated circuit, and a thermal control assembly disposed between the heat exchanger assembly and the contact assembly. The thermal control assembly includes a Peltier device in thermal contact with opposing surfaces of the heat exchanger assembly and the contact assembly, and a spacer in physical contact with the opposing surfaces of the heat exchanger assembly and the contact assembly.Type: ApplicationFiled: September 16, 2020Publication date: October 21, 2021Applicant: AEM SINGAPORE PTE LTDInventors: See Jean CHAN, Zhaomeng WANG, Yao Kun Leonard MAK, MuralliKrishna GOVINDANDHANASEKARAN
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Patent number: 11129297Abstract: A cold plate may include a plate body having a thermal conductive side; a plurality of parallel hollow fluid channels running inside the plate body; at least one fluid inlet in direct fluid communication with a first subset of the plurality of parallel hollow fluid channels; at least one fluid outlet in direct fluid communication with a second subset of the plurality of parallel hollow fluid channels; and a porous thermal conductive structure which fluidly connect the first subset of the plurality of parallel hollow fluid channels to the second subset of the plurality of parallel hollow fluid channels, and which is in thermal contact with the thermal conductive side of the plate body. The porous thermal conductive structure may include a plurality of elongate fluid contact surface regions, each may be extending continuously lengthwise along a longitudinal side of respective fluid channel to serve as a fluid interface.Type: GrantFiled: January 28, 2020Date of Patent: September 21, 2021Assignee: AEM SINGAPORE PTE. LTD.Inventors: See Jean Chan, Zhaomeng Wang
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Publication number: 20210011078Abstract: A compact tester including a housing having a base plate and a roof plate being parallel and defining a space therebetween. The compact tester includes one or more device-under-test press units having an actuator and a contact head movable by the actuator. The compact tester includes a reinforcement arrangement having a roof reinforcement sub-arrangement coupled to the roof plate and an upright reinforcement sub-arrangement coupled to the base plate. The upright reinforcement sub-arrangement includes a pair of reinforcing side walls extending upright from the base plate. The roof reinforcement sub-arrangement includes a reinforcing structure having a reinforcing panel portion attached flat against the roof plate and an elongated reinforcing rib portion protruding from the reinforcing panel portion and away from the roof plate.Type: ApplicationFiled: July 8, 2020Publication date: January 14, 2021Inventors: See Jean Chan, Shiau Fen Lau, Jiun Pin Goh, Zhaomeng Wang, Seenivas Rao Balachandran, Leonard Yao Kun Mak, Prabaharan Pichaiyan
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Publication number: 20200383238Abstract: A cold plate may include a plate body having a thermal conductive side; a plurality of parallel hollow fluid channels running inside the plate body; at least one fluid inlet in direct fluid communication with a first subset of the plurality of parallel hollow fluid channels; at least one fluid outlet in direct fluid communication with a second subset of the plurality of parallel hollow fluid channels; and a porous thermal conductive structure which fluidly connect the first subset of the plurality of parallel hollow fluid channels to the second subset of the plurality of parallel hollow fluid channels, and which is in thermal contact with the thermal conductive side of the plate body. The porous thermal conductive structure may include a plurality of elongate fluid contact surface regions, each may be extending continuously lengthwise along a longitudinal side of respective fluid channel to serve as a fluid interface.Type: ApplicationFiled: January 28, 2020Publication date: December 3, 2020Inventors: See Jean Chan, Zhaomeng Wang
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Publication number: 20110308942Abstract: In a first aspect, the present invention is directed to a microelectrode array for detecting heavy metals in an aqueous solution. The microelectrode array can comprise a layer of a doped carbon film and a patterning layer arranged on the doped carbon film for defining multiple microelectrodes in the doped carbon film to form the microelectrode array. The size, and shape, and arrangement of each of the multiple microelectrodes can be defined by the size, and shape, and arrangement of each of the openings in the patterning layer which expose the underlying doped carbon film. Furthermore, the ratio of the maximal width of a microelectrode relative to the shortest distance between the neighboring microelectrodes (center to center) in the microelectrode array is between about 1:1.2 and about 1:6. The present invention is also directed to an apparatus using the microelectrode array and methods of manufacturing the same.Type: ApplicationFiled: July 23, 2010Publication date: December 22, 2011Applicant: Nanyang Technological UniversityInventors: Erjia Liu, Wenguang Ma, Guocheng Yang, Aiping Liu, Nay Win Khun, Zhaomeng Wang