Patents by Inventor Zhbanov Alexander

Zhbanov Alexander has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9276182
    Abstract: A heat radiation structure of a light emitting element has leads, each lead having a plurality of leg sections, and a light emitting chip mounted on any one of the leads. The present invention can provide a high-efficiency light emitting element, in which a thermal load is reduced by widening a connecting section through which a lead and a chip seating section of the light emitting element are connected, and the heat generated from a heat source can be more rapidly radiated to the outside. Further, the present invention can also provide a high-efficiency light emitting element, in which heat radiation fins are formed between a stopper and a molding portion of a lead of the light emitting element so that natural convection can occur between the heat radiation fins, and an area in which heat radiation can occur is widened to maximize a heat radiation effect.
    Type: Grant
    Filed: April 30, 2014
    Date of Patent: March 1, 2016
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Tae Won Seo, Zhbanov Alexander, Dae Won Kim
  • Publication number: 20160056359
    Abstract: A heat radiation structure of a light emitting element has leads, each lead having a plurality of leg sections, and a light emitting chip mounted on any one of the leads. The present invention can provide a high-efficiency light emitting element, in which a thermal load is reduced by widening a connecting section through which a lead and a chip seating section of the light emitting element are connected, and the heat generated from a heat source can be more rapidly radiated to the outside. Further, the present invention can also provide a high-efficiency light emitting element, in which heat radiation fins are formed between a stopper and a molding portion of a lead of the light emitting element so that natural convection can occur between the heat radiation fins, and an area in which heat radiation can occur is widened to maximize a heat radiation effect.
    Type: Application
    Filed: April 30, 2014
    Publication date: February 25, 2016
    Applicant: Seoul Semiconductor Co., Ltd.
    Inventors: Tae Won SEO, Zhbanov Alexander, Dae Won Kim
  • Publication number: 20140231860
    Abstract: A heat radiation structure of a light emitting element has leads, each lead having a plurality of leg sections, and a light emitting chip mounted on any one of the leads. The present invention can provide a high-efficiency light emitting element, in which a thermal load is reduced by widening a connecting section through which a lead and a chip seating section of the light emitting element are connected, and the heat generated from a heat source can be more rapidly radiated to the outside. Further, the present invention can also provide a high-efficiency light emitting element, in which heat radiation fins are formed between a stopper and a molding portion of a lead of the light emitting element so that natural convection can occur between the heat radiation fins, and an area in which heat radiation can occur is widened to maximize a heat radiation effect.
    Type: Application
    Filed: April 30, 2014
    Publication date: August 21, 2014
    Applicant: Seoul Semiconductor Co., Ltd.
    Inventors: Tae Won SEO, Zhbanov Alexander, Dae Won Kim
  • Patent number: 8759869
    Abstract: A heat radiation structure of a light emitting element has leads, each lead having a plurality of leg sections, and a light emitting chip mounted on any one of the leads. The present invention can provide a high-efficiency light emitting element, in which a thermal load is reduced by widening a connecting section through which a lead and a chip seating section of the light emitting element are connected, and the heat generated from a heat source can be more rapidly radiated to the outside. Further, the present invention can also provide a high-efficiency light emitting element, in which heat radiation fins are formed between a stopper and a molding portion of a lead of the light emitting element so that natural convection can occur between the heat radiation fins, and an area in which heat radiation can occur is widened to maximize a heat radiation effect.
    Type: Grant
    Filed: December 11, 2012
    Date of Patent: June 24, 2014
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Tae Won Seo, Zhbanov Alexander, Dae Won Kim
  • Patent number: 8350286
    Abstract: A heat radiation structure of a light emitting element has leads, each lead having a plurality of leg sections, and a light emitting chip mounted on any one of the leads. The present invention can provide a high-efficiency light emitting element, in which a thermal load is reduced by widening a connecting section through which a lead and a chip seating section of the light emitting element are connected, and the heat generated from a heat source can be more rapidly radiated to the outside. Further, the present invention can also provide a high-efficiency light emitting element, in which heat radiation fins are formed between a stopper and a molding portion of a lead of the light emitting element so that natural convection can occur between the heat radiation fins, and an area in which heat radiation can occur is widened to maximize a heat radiation effect.
    Type: Grant
    Filed: February 14, 2011
    Date of Patent: January 8, 2013
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Tae Won Seo, Zhbanov Alexander, Dae Won Kim
  • Patent number: 8350287
    Abstract: A heat radiation structure of a light emitting element has leads, each lead having a plurality of leg sections, and a light emitting chip mounted on any one of the leads. The present invention can provide a high-efficiency light emitting element, in which a thermal load is reduced by widening a connecting section through which a lead and a chip seating section of the light emitting element are connected, and the heat generated from a heat source can be more rapidly radiated to the outside. Further, the present invention can also provide a high-efficiency light emitting element, in which heat radiation fins are formed between a stopper and a molding portion of a lead of the light emitting element so that natural convection can occur between the heat radiation fins, and an area in which heat radiation can occur is widened to maximize a heat radiation effect.
    Type: Grant
    Filed: July 20, 2011
    Date of Patent: January 8, 2013
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Tae Won Seo, Zhbanov Alexander, Dae Won Kim
  • Patent number: 8278677
    Abstract: Disclosed is a light emitting diode lamp that has low resistance to heat emitted therefrom. The LED lamp may include a heat coupling member thermally coupling a top part of a first lead to a top part of a second lead. The LED lamp may further include one or more top parts for lowering thermal resistance of the LED lamp. This configuration facilitates heat transfer from the first lead having an LED chip mounted thereon to the top part of the second lead and/or to the other top parts, lowering resistance to heat emitted from the LED lamp.
    Type: Grant
    Filed: March 31, 2008
    Date of Patent: October 2, 2012
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventor: Zhbanov Alexander
  • Publication number: 20110278636
    Abstract: A heat radiation structure of a light emitting element has leads, each lead having a plurality of leg sections, and a light emitting chip mounted on any one of the leads. The present invention can provide a high-efficiency light emitting element, in which a thermal load is reduced by widening a connecting section through which a lead and a chip seating section of the light emitting element are connected, and the heat generated from a heat source can be more rapidly radiated to the outside. Further, the present invention can also provide a high-efficiency light emitting element, in which heat radiation fins are formed between a stopper and a molding portion of a lead of the light emitting element so that natural convection can occur between the heat radiation fins, and an area in which heat radiation can occur is widened to maximize a heat radiation effect.
    Type: Application
    Filed: July 20, 2011
    Publication date: November 17, 2011
    Applicant: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Tae Won SEO, Zhbanov ALEXANDER, Dae Won KIM
  • Publication number: 20110133244
    Abstract: A heat radiation structure of a light emitting element has leads, each lead having a plurality of leg sections, and a light emitting chip mounted on any one of the leads. The present invention can provide a high-efficiency light emitting element, in which a thermal load is reduced by widening a connecting section through which a lead and a chip seating section of the light emitting element are connected, and the heat generated from a heat source can be more rapidly radiated to the outside. Further, the present invention can also provide a high-efficiency light emitting element, in which heat radiation fins are formed between a stopper and a molding portion of a lead of the light emitting element so that natural convection can occur between the heat radiation fins, and an area in which heat radiation can occur is widened to maximize a heat radiation effect.
    Type: Application
    Filed: February 14, 2011
    Publication date: June 9, 2011
    Applicant: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Tae Won SEO, Zhbanov ALEXANDER, Dae Won KIM
  • Patent number: 7948002
    Abstract: A heat radiation structure of a light emitting element has leads, each lead having a plurality of leg sections, and a light emitting chip mounted on any one of the leads. The present invention can provide a high-efficiency light emitting element, in which a thermal load is reduced by widening a connecting section through which a lead and a chip seating section of the light emitting element are connected, and the heat generated from a heat source can be more rapidly radiated to the outside. Further, the present invention can also provide a high-efficiency light emitting element, in which heat radiation fins are formed between a stopper and a molding portion of a lead of the light emitting element so that natural convection can occur between the heat radiation fins, and an area in which heat radiation can occur is widened to maximize a heat radiation effect.
    Type: Grant
    Filed: November 21, 2006
    Date of Patent: May 24, 2011
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Tae Won Seo, Zhbanov Alexander, Dae Won Kim
  • Publication number: 20090045430
    Abstract: A heat radiation structure of a light emitting element has leads, each lead having a plurality of leg sections, and a light emitting chip mounted on any one of the leads. The present invention can provide a high-efficiency light emitting element, in which a thermal load is reduced by widening a connecting section through which a lead and a chip seating section of the light emitting element are connected, and the heat generated from a heat source can be more rapidly radiated to the outside. Further, the present invention can also provide a high-efficiency light emitting element, in which heat radiation fins are formed between a stopper and a molding portion of a lead of the light emitting element so that natural convection can occur between the heat radiation fins, and an area in which heat radiation can occur is widened to maximize a heat radiation effect.
    Type: Application
    Filed: November 21, 2006
    Publication date: February 19, 2009
    Applicant: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Tae Won Seo, Zhbanov Alexander, Dae Won Kim
  • Publication number: 20080237625
    Abstract: Disclosed is a light emitting diode lamp that has low resistance to heat emitted therefrom. The LED lamp may include a heat coupling member thermally coupling a top part of a first lead to a top part of a second lead. The LED lamp may further include one or more top parts for lowering thermal resistance of the LED lamp. This configuration facilitates heat transfer from the first lead having an LED chip mounted thereon to the top part of the second lead and/or to the other top parts, lowering resistance to heat emitted from the LED lamp.
    Type: Application
    Filed: March 31, 2008
    Publication date: October 2, 2008
    Applicant: SEOUL SEMICONDUCTOR CO., LTD.
    Inventor: Zhbanov ALEXANDER