Patents by Inventor Zhefei J. Chen

Zhefei J. Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Compositions for chemical-mechanical planarization of noble-metal-featured substrates, associated methods, and substrates produced by such methods
    Patent number: 8142675
    Abstract: A composition for chemical-mechanical planarization comprises periodic acid and an abrasive present in a combined amount sufficient to planarize a substrate surface having a feature thereon comprising a noble metal, noble metal alloy, noble metal oxide, or any combination thereof. In one embodiment, the periodic acid is present in an amount in a range of from about 0.05 to about 0.3 moles/kilogram, and the abrasive is present in an amount in a range of from about 0.2 to about 6 weight percent. In another embodiment, the composition further comprises a pH-adjusting agent present in an amount sufficient to cause the pH of the composition to be in a range of from about pH 5 to about pH 10, or of from about pH 1 to about pH 4.
    Type: Grant
    Filed: April 28, 2009
    Date of Patent: March 27, 2012
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Robert J. Small, Zhefei J. Chen
  • COMPOSITIONS FOR CHEMICAL-MECHANICAL PLANARIZATION OF NOBLE-METAL-FEATURED SUBSTRATES, ASSOCIATED METHODS, AND SUBSTRATES PRODUCED BY SUCH METHODS
    Publication number: 20090255903
    Abstract: A composition for chemical-mechanical planarization comprises periodic acid and an abrasive present in a combined amount sufficient to planarize a substrate surface having a feature thereon comprising a noble metal, noble metal alloy, noble metal oxide, or any combination thereof. In one embodiment, the periodic acid is present in an amount in a range of from about 0.05 to about 0.3 moles/kilogram, and the abrasive is present in an amount in a range of from about 0.2 to about 6 weight percent. In another embodiment, the composition further comprises a pH-adjusting agent present in an amount sufficient to cause the pH of the composition to be in a range of from about pH 5 to about pH 10, or of from about pH 1 to about pH 4.
    Type: Application
    Filed: April 28, 2009
    Publication date: October 15, 2009
    Inventors: Robert J. SMALL, Zhefei J. CHEN
  • Compositions of chemical mechanical planarization slurries contacting noble-metal-featured substrates
    Patent number: 7524346
    Abstract: A composition for chemical-mechanical planarization comprises periodic acid and an abrasive present in a combined amount sufficient to planarize a substrate surface having a feature thereon comprising a noble metal, noble metal alloy, noble metal oxide, or any combination thereof. In one embodiment, the periodic acid is present in an amount in a range of from about 0.05 to about 0.3 moles/kilogram, and the abrasive is present in an amount in a range of from about 0.2 to about 6 weight percent. In another embodiment, the composition further comprises a pH-adjusting agent present in an amount sufficient to cause the pH of the composition to be in a range of from about pH 5 to about pH 10, or of from about pH 1 to about pH 4.
    Type: Grant
    Filed: January 25, 2002
    Date of Patent: April 28, 2009
    Assignee: DuPont Air Products NanoMaterials LLC
    Inventors: Robert J. Small, Zhefei J. Chen
  • Composition for chemical-mechanical polishing and method of using same
    Patent number: 7037350
    Abstract: A composition for chemical-mechanical polishing, comprising an aqueous solution and an abrasive that comprises polymer particles, is described. The polymer particles carry an electrical charge, such that nearby particles repel one another. Accordingly, aggregation of polymer particles may be reduced, minimized or eliminated. The composition may additionally comprise an oxidizing agent. A method of using the composition to polish a substrate surface, such as a substrate surface having a metal surface feature or layer, is also described. A substrate so polished may exhibit good surface characteristics, such as a relatively smooth surface or a reduced number of, or a lack of, microscratches on the surface of the substrate.
    Type: Grant
    Filed: July 14, 2003
    Date of Patent: May 2, 2006
    Assignee: DA NanoMaterials L.L.C.
    Inventors: Robert J. Small, Zhefei J. Chen
  • Compositions for chemical-mechanical planarization of noble-metal-featured substrates, associated methods, and substrates produced by such methods
    Publication number: 20030194879
    Abstract: A composition for chemical-mechanical planarization comprises periodic acid and an abrasive present in a combined amount sufficient to planarize a substrate surface having a feature thereon comprising a noble metal, noble metal alloy, noble metal oxide, or any combination thereof. In one embodiment, the periodic acid is present in an amount in a range of from about 0.05 to about 0.3 moles/kilogram, and the abrasive is present in an amount in a range of from about 0.2 to about 6 weight percent. In another embodiment, the composition further comprises a pH-adjusting agent present in an amount sufficient to cause the pH of the composition to be in a range of from about pH 5 to about pH 10, or of from about pH 1 to about pH 4.
    Type: Application
    Filed: January 25, 2002
    Publication date: October 16, 2003
    Inventors: Robert J. Small, Zhefei J. Chen