Patents by Inventor Zhen Du

Zhen Du has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11995385
    Abstract: A matching design method of static stiffness for a combined box body structure of a large reducer is provided, including the following steps, building a transmission system model and an initial structure model and obtaining load data; performing a statics analysis; obtaining primary design variables and design responses; constructing design variables; constructing a static stiffness matching target of a combined box body; constructing an objective function; setting constraint conditions; constructing a response surface proxy model; constructing a static stiffness matching optimization model of combined box body; obtaining optimal design variables and obtaining an optimal structure model of the box body; performing the statics analysis on the optimal structure model of the box body, and performing a contrastive analysis with statics analysis results of the corrected box body two-dimensional unit finite element model to confirm optimization effects.
    Type: Grant
    Filed: January 16, 2024
    Date of Patent: May 28, 2024
    Assignee: University of Shanghai for Science and Technology
    Inventors: Lihui Zhao, Dongdong Zhang, Shuo Weng, Jinzhi Feng, Kang Du, Zhen Wang
  • Publication number: 20240165015
    Abstract: Disclosed are a Lactobacillus rhamnosus strain having accession number CCTCC NO: M 2021185, a ferment lysate prepared thereby for regulating skin microecology, and a preparation method for the ferment lysate. The ferment lysate comprises the following components in mass percentages of same in the ferment lysate: 0.2-1% of proteins, 0.3-0.8% of polysaccharides, and 0.2-1% of amino acids. The ferment lysate obtained by using the above bacterial strain for fermentation can strongly inhibit the reproduction and growth of pathogenic bacteria, has a promotion effect on some of probiotics, has a strong inhibition effect on pathogenic hyphae of Candida albicans, can not only generate antimicrobial peptides during fermentation, but also increase the expression level of antimicrobial peptides in skin cells at the genetic level and the protein level, thereby improving skin immunity.
    Type: Application
    Filed: March 24, 2022
    Publication date: May 23, 2024
    Applicant: BLOOMAGE BIOTECHNOLOGY CORPORATION LIMITED
    Inventors: Zhen LU, Yujie WEI, Yuanjun SUN, Ranran DU, Yan ZHAO, Xueping GUO
  • Patent number: 11932881
    Abstract: A heparin skeleton synthase originates from Neisseria animaloris, with an amino acid sequence as shown in SEQ ID NO.2 and a nucleotide sequence of the coding gene as shown in SEQ ID NO.1. Its recombinant expression level is 6.8 times that of the existing heparin skeleton synthase KfiA from Escherichia coli K5, and total enzyme activity per fermentation liquor is 5.22 times that of the heparin skeleton synthase KfiA. The heparin skeleton synthase mutants obtained through site-directed mutagenesis of the sites No. 16, No. 25, No. 30, No. 111, No. 165, and No. 172 in the amino acid sequence of the said heparin skeleton synthase all have high expression levels.
    Type: Grant
    Filed: January 3, 2022
    Date of Patent: March 19, 2024
    Assignees: SHAN DONG UNIVERSITY, Bloomage Biotechnology Corporation Limited
    Inventors: Juzheng Sheng, Xueping Guo, Jianqun Deng, Fengshan Wang, Zhen Lu, Ranran Du, Liu Sun, Yuanjun Sun
  • Publication number: 20210398248
    Abstract: An electronic device for automated image-based auditing of equipment cabinets may include a memory storing an imaging computer program; and a computer processor. The imaging computer program, when executed by the computer processor, may cause the computer processor to perform the following: receive a plurality images from an image capture device on a carriage, wherein the image capture device is configured to traverse an equipment cabinet and capture the plurality of images of equipment in the equipment cabinet; generate a single image by stitching the plurality of images together; receive data from a sensor on the carriage, wherein the sensor is configured to capture data from the equipment in the equipment cabinet; associate the data with a location in the equipment cabinet; compare the single image and the data to an expected image and expected data; and output a result of the comparison.
    Type: Application
    Filed: June 22, 2021
    Publication date: December 23, 2021
    Inventors: Jacob COX, Robert S. NEWNAM, Zhen DU
  • Patent number: 10991660
    Abstract: A semiconductor wafer is singulated to form a plurality of semiconductor packages. The semiconductor wafer has a semiconductor substrate, a metal layer, an adhesive layer, a rigid supporting layer, a passivation layer and a plurality of contact pads. A semiconductor package has a semiconductor substrate, a metal layer, an adhesive layer, a rigid supporting layer, a passivation layer and a plurality of contact pads. A thickness of the rigid supporting layer is larger than a thickness of the semiconductor substrate. A thickness of the metal layer is thinner than the thickness of the semiconductor substrate. An entirety of the rigid supporting layer may be made of a single crystal silicon material or a poly-crystal silicon material. The single crystal silicon material or the poly-crystal silicon material may be fabricated from a reclaimed silicon wafer. An advantage of using a reclaimed silicon wafer is for a cost reduction.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: April 27, 2021
    Assignee: ALPHA ANC OMEGA SEMICONDUCTOR (CAYMAN) LTD.
    Inventors: Long-Ching Wang, Zhen Du, Bo Chen, Jun Lu, Yueh-Se Ho
  • Publication number: 20190189569
    Abstract: A semiconductor wafer is singulated to form a plurality of semiconductor packages. The semiconductor wafer has a semiconductor substrate, a metal layer, an adhesive layer, a rigid supporting layer, a passivation layer and a plurality of contact pads. A semiconductor package has a semiconductor substrate, a metal layer, an adhesive layer, a rigid supporting layer, a passivation layer and a plurality of contact pads. A thickness of the rigid supporting layer is larger than a thickness of the semiconductor substrate. A thickness of the metal layer is thinner than the thickness of the semiconductor substrate. An entirety of the rigid supporting layer may be made of a single crystal silicon material or a poly-crystal silicon material. The single crystal silicon material or the poly-crystal silicon material may be fabricated from a reclaimed silicon wafer. An advantage of using a reclaimed silicon wafer is for a cost reduction.
    Type: Application
    Filed: December 20, 2017
    Publication date: June 20, 2019
    Applicant: Alpha and Omega Semiconductor (Cayman) Ltd.
    Inventors: Long-Ching Wang, Zhen Du, Bo Chen, Jun Lu, Yueh-Se Ho
  • Publication number: 20130085109
    Abstract: Methods of cardiovascular patient treatment using substances sufficient to reduce actin depolymerization. In an exemplary embodiment of a method of treating a patient of the present disclosure, the method comprises the step of administering a therapeutically effective dose of a substance that reduces actin depolymerization within a vasculature of a patient to treat a cardiovascular condition of the patient. In at least one embodiment, the substance the substance is selected from the group consisting of jasplakinolide, Jasplaskinolide V, and Amphidinolide H.
    Type: Application
    Filed: November 21, 2012
    Publication date: April 4, 2013
    Inventors: Ghassan S. Kassab, Zhen-Du Zhang