Abstract: The present disclosure provides a coal bump control method for sectional hydraulic fracturing regions of a near vertical ultra thick coal seam. The method includes: deepening a main shaft from a mining level to a fracturing level; excavating a cross-hole from a roof rock layer of a coal seam at the fracturing level to enter a coal seam being mined, and excavating a roadway along the strike of the coal seam; and drilling hydraulic fracturing boreholes in a dedicated fracturing roadway along an inclination angle of the coal seam to the coal seam above the roadway, wherein the length of the borehole makes the borehole in communication with a goaf, and the spacing of the boreholes along the strike and the sectional spacing of the boreholes in an inclination direction are designed according to the parameters of fracturing equipments and the fracturing length.

Abstract: A method for preparing a shell-bionic ceramic tool and a shell-bionic ceramic tool, wherein the shell-bionic ceramic tool includes alternating stacks of ceramic powders with different components, pressing a ceramic green body using a cold briquetting method, carrying out pre-pressing once using a graphite indenter on a working surface thereof after each layer of the ceramic powder being loaded, and pressing a last layer using a graphite rod, and then pressing a whole ceramic green body with a certain pressure to promote a bonding of the layers of ceramic powder, which in turn gives a complex shape to an interface between the layers, increases a bonding area between the layers, and plays the role of hindering crack expansion, extending the crack expansion path, and improving the bonding strength of the interface; after then, hot-pressed sintering is used to densify the ceramic green body to obtain the shell-bionic ceramic tool.

Abstract: A hydrogel for cell-laden bioprinting, bioink, and a preparation method and an application thereof, relates to the technical field of biomedical polymer hydrogels. The hydrogel for cell-laden bioprinting is polymer gel formed by adding a cell-specific material into a matrix of alginate and gelatin and crosslinking and curing, wherein the cell-specific material is polypeptide selected according to different laden cells. The structures printed using the hydrogel may have the advantages such as adjustable mechanical properties, adjustable porosity, high biocompatibility, high printing accuracy, and high customizability, which may widely support the printing of human tissues and organs such as spinal cord, cartilage, and heart, and has good prospects for applications in tissue repair, organ transplantation and so on.

Abstract: A ternary phase shift keying transmitter and receiver can efficiently communicate using ternary encoded data that avoids indistinguishable transition curves for each of the three modulated states in the ternary encoded data. The transmitter is interoperable and can function with different types of receivers including direct detection-based receivers and coherent detection-based receivers.

Abstract: An optical transmitter can generate probabilistically shaped quadrature amplitude modulation (PS-QAM) signaling for transmission over a fiber to a destination without optical amplification. The single fiber can transmit the PS-QAM signaling using dense wavelength division multiplexing having a relatively large number of channels that are closely spaced. A coherent receiver can receive the PS-QAM signaling for decoding without implementing chromatic dispersion compensation.

Abstract: An alumina-based ceramic tool material with low thermal expansion and a preparation process thereof, accordingly, the ceramic tool material may have both the high hardness of alumina ceramics after the hot pressing sintering, and reduces the thermal expansion coefficient of the overall ceramic material by adding the Sc2W3O12 as the negative thermal expansion phase, which improves the thermal shock resistance of ceramic tools in high-speed cutting engineering and meets the requirements of large temperature range during the machining of nickel-based superalloys. Moreover, the composite material does not use metal binder and has strong thermal stability even in the high-speed machining under extreme heat-force-chemistry coupling, so it has a high machining compatibility for nickel-based superalloys.

Abstract: A co-packaged optical-electrical chip can include an application-specific integrated circuit (ASIC) and a plurality of optical modules, such as optical transceivers. The ASIC and each of the optical modules can exchange electrical signaling via integrated electrical paths. The ASIC can include Ethernet switch, error correction, bit-to-symbol mapping/demapping, and digital signal processing circuits to pre-compensate and post-compensate channel impairments (e.g., inter-channel/intra-channel impairments) in electrical and optical domains. The co-packaged inter-chip interface can be scaled to handle different data rates using spectral efficient signaling formats (e.g., QAM-64, PAM-8) without adding additional data lines to a given design and without significantly increasing the power consumption of the design.

Abstract: A sourceless co-packaged optical-electrical chip can include a plurality of different optical transceivers, each of which can transmit to an external destination or internal components. Each of the transceivers can be configured for a different modulation format, such as different pulse amplitude, phase shift key, and quadrature amplitude modulation formats. Different light sources provide light for processing by the transceivers, where the light source and transceivers can be configured for different applications (e.g., different distances) and data rates. An optical coupler can combine the light for the different transceivers for input into the sourceless co-packaged optical-electrical chip via a polarization maintaining media (e.g., polarization maintaining few mode fiber and polarization maintaining single mode fiber), where another coupler operates in splitting mode to separate the different channels of light for the different transceivers according to different co-packaged configurations.

Abstract: A co-packaged optical-electrical chip can include an application-specific integrated circuit (ASIC) and a plurality of optical modules, such as optical transceivers. The ASIC and each of the optical modules can exchange electrical signaling via integrated electrical paths. The ASIC can include Ethernet switch, error correction, bit-to-symbol mapping/demapping, and digital signal processing circuits to pre-compensate and post-compensate channel impairments (e.g., inter-channel/intra-channel impairments) in electrical and optical domains. The co-packaged inter-chip interface can be scaled to handle different data rates using spectral efficient signaling formats (e.g., QAM-64, PAM-8) without adding additional data lines to a given design and without significantly increasing the power consumption of the design.

Abstract: A sourceless co-packaged optical-electrical chip can include a plurality of different optical transceivers, each of which can transmit to an external destination or internal components. Each of the transceivers can be configured for a different modulation format, such as different pulse amplitude, phase shift key, and quadrature amplitude modulation formats. Different light sources provide light for processing by the transceivers, where the light source and transceivers can be configured for different applications (e.g., different distances) and data rates. An optical coupler can combine the light for the different transceivers for input into the sourceless co-packaged optical-electrical chip via a polarization maintaining media (e.g., polarization maintaining few mode fiber and polarization maintaining single mode fiber), where another coupler operates in splitting mode to separate the different channels of light for the different transceivers according to different co-packaged configurations.

Abstract: An optical transmitter can generate probabilistically shaped quadrature amplitude modulation (PS-QAM) signaling for transmission over a fiber to a destination without optical amplification. The single fiber can transmit the PS-QAM signaling using dense wavelength division multiplexing having a relatively large number of channels that are closely spaced. A coherent receiver can receive the PS-QAM signaling for decoding without implementing chromatic dispersion compensation.

Abstract: A method includes applying, to a modulated digital signal, a forward error correction (FEC) including a low-density parity-check (LDPC) to produce a coded digital signal. Nyquist shaping is applied to the coded digital signal to generate a filtered digital signal. A representation of the filtered digital signal is transmitted in an optical communication channel via a dense wavelength division multiplexing (DWDM) scheme.

Abstract: A ternary phase shift keying transmitter and receiver can efficiently communicate using ternary encoded data that avoids indistinguishable transition curves for each of the three modulated states in the ternary encoded data. The transmitter is interoperable and can function with different types of receivers including direct detection-based receivers and coherent detection-based receivers.

Abstract: A ternary phase shift keying transmitter and receiver can efficiently communicate using ternary encoded data that avoids indistinguishable transition curves for each of the three modulated states in the ternary encoded data. The transmitter is interoperable and can function with different types of receivers including direct detection-based receivers and coherent detection-based receivers.

Abstract: A co-packaged optical-electrical chip can include an application-specific integrated circuit (ASIC) and a plurality of optical modules, such as optical transceivers. The ASIC and each of the optical modules can exchange electrical signaling via integrated electrical paths. The ASIC can include Ethernet switch, error correction, bit-to-symbol mapping/demapping, and digital signal processing circuits to pre-compensate and post-compensate channel impairments (e.g., inter-channel/intra-channel impairments) in electrical and optical domains. The co-packaged inter-chip interface can be scaled to handle different data rates using spectral efficient signaling formats (e.g., QAM-64, PAM-8) without adding additional data lines to a given design and without significantly increasing the power consumption of the design.

Abstract: A method includes applying, to a modulated digital signal, a forward error correction (FEC) including a low-density parity-check (LDPC) to produce a coded digital signal. Nyquist shaping is applied to the coded digital signal to generate a filtered digital signal. A representation of the filtered digital signal is transmitted in an optical communication channel via a dense wavelength division multiplexing (DWDM) scheme.

Abstract: A sourceless co-packaged optical-electrical chip can include a plurality of different optical transceivers, each of which can transmit to an external destination or internal components. Each of the transceivers can be configured for a different modulation format, such as different pulse amplitude, phase shift key, and quadrature amplitude modulation formats. Different light sources provide light for processing by the transceivers, where the light source and transceivers can be configured for different applications (e.g., different distances) and data rates. An optical coupler can combine the light for the different transceivers for input into the sourceless co-packaged optical-electrical chip via a polarization maintaining media (e.g., polarization maintaining few mode fiber and polarization maintaining single mode fiber), where another coupler operates in splitting mode to separate the different channels of light for the different transceivers according to different co-packaged configurations.

Abstract: A method includes modulating a digital signal via pulse amplitude modulation (PAM) and applying Nyquist shaping to the digital signal to generate a filtered digital signal. The method also includes converting the filtered digital signal into an analog signal and transmitting the analog signal in an optical communication channel via a dense wavelength division multiplexing (DWDM) scheme.

Abstract: A ternary phase shift keying transmitter and receiver can efficiently communicate using ternary encoded data that avoids indistinguishable transition curves for each of the three modulated states in the ternary encoded data. The transmitter is interoperable and can function with different types of receivers including direct detection-based receivers and coherent detection-based receivers.

Abstract: A co-packaged optical-electrical chip can include an application-specific integrated circuit (ASIC) and a plurality of optical modules, such as optical transceivers. The ASIC and each of the optical modules can exchange electrical signaling via integrated electrical paths. The ASIC can include Ethernet switch, error correction, bit-to-symbol mapping/demapping, and digital signal processing circuits to pre-compensate and post-compensate channel impairments (e.g., inter-channel/intra-channel impairments) in electrical and optical domains. The co-packaged inter-chip interface can be scaled to handle different data rates using spectral efficient signaling formats (e.g., QAM-64, PAM-8) without adding additional data lines to a given design and without significantly increasing the power consumption of the design.