Patents by Inventor Zheng You Liu

Zheng You Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PACKAGE STRUCTURE
    Publication number: 20240096781
    Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.
    Type: Application
    Filed: March 20, 2023
    Publication date: March 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Ti Lu, Hao-Yi Tsai, Chia-Hung Liu, Yu-Hsiang Hu, Hsiu-Jen Lin, Tzuan-Horng Liu, Chih-Hao Chang, Bo-Jiun Lin, Shih-Wei Chen, Hung-Chun Cho, Pei-Rong Ni, Hsin-Wei Huang, Zheng-Gang Tsai, Tai-You Liu, Po-Chang Shih, Yu-Ting Huang
  • Composite materials with negative elastic constants
    Patent number: 6576333
    Abstract: This invention provides a composite material having a matrix of structural material containing embedded zones of soft elastic material and zones of solid relatively high density material within the soft elastic material. By selecting a particular resonance frequency for the subunits of soft elastic material and solid high density material, frequencies just lower than the resonance frequencies will be unable to propagate through the material and be strongly reflected or absorbed. Such material may be used in the manufacture of filters or shields against particular target frequencies. Subunits having a variety of resonance frequencies may provide a broader range of frequencies that the material may shield.
    Type: Grant
    Filed: April 3, 1998
    Date of Patent: June 10, 2003
    Assignee: The Hong Kong University of Science & Technology
    Inventors: Ping Sheng, Rongfu Xiao, Weijia Wen, Zheng You Liu
  • COMPOSITE MATERIALS WITH NEGATIVE ELASTIC CONSTANTS
    Publication number: 20020114928
    Abstract: This invention provides a composite material having a matrix of structural material containing embedded zones of soft elastic material and zones of solid relatively high density material within the soft elastic material. By selecting a particular resonance frequency for the subunits of soft elastic material and solid high density material, frequencies just lower than the resonance frequencies will be unable to propagate through the material and be strongly reflected or absorbed. Such material may be used in the manufacture of filters or shields against particular target frequencies. Subunits having a variety of resonance frequencies may provide a broader range of frequencies that the material may shield.
    Type: Application
    Filed: April 3, 1998
    Publication date: August 22, 2002
    Inventors: PING SHENG, RONGFU XIAO, WEIJIA WEN, ZHENG YOU LIU