Patents by Inventor Zheng Yu LIN

Zheng Yu LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11289446
    Abstract: According to a first aspect of the present invention, there is provided a bond apparatus for bonding a wire to a bonding surface, comprising: a bond head body movably retained by a mounting portion; a first actuator; and a second actuator, wherein the bond head body has a tool portion configured to receive a bonding tool for receiving and bonding the wire and an actuator portion coupled with the first actuator and the second actuator, the first actuator and the second actuator being operative to act on the actuator portion for moving the bond head body with respect to the mounting portion to move the bonding tool with respect to the bonding surface.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: March 29, 2022
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Keng Yew Song, Yue Zhang, Xiao Liang Chen, Zheng Yu Lin
  • Publication number: 20190304947
    Abstract: According to a first aspect of the present invention, there is provided a bond apparatus for bonding a wire to a bonding surface, comprising: a bond head body movably retained by a mounting portion; a first actuator; and a second actuator, wherein the bond head body has a tool portion configured to receive a bonding tool for receiving and bonding the wire and an actuator portion coupled with the first actuator and the second actuator, the first actuator and the second actuator being operative to act on the actuator portion for moving the bond head body with respect to the mounting portion to move the bonding tool with respect to the bonding surface.
    Type: Application
    Filed: March 28, 2018
    Publication date: October 3, 2019
    Inventors: Keng Yew SONG, Yue ZHANG, Xiao Liang CHEN, Zheng Yu LIN
  • Patent number: 9446524
    Abstract: A wire clamp includes a clamp body; a pair of arms coupled to the clamp body; and a piezoelectric actuator having a longitudinal axis extending between a first end and a second end, the actuator being coupled to the pair of arms at the first end and to the clamp body at the second end. The second end of the actuator is coupled to the clamp body by a preload mechanism for applying a preload force along the longitudinal axis, and the preload mechanism comprises at least one wedge having an inclined surface which is slidable over a mating inclined surface.
    Type: Grant
    Filed: November 14, 2013
    Date of Patent: September 20, 2016
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Yue Zhang, Chong Hao Chen, Zheng Yu Lin
  • Publication number: 20150128405
    Abstract: Disclosed is a wire clamp, comprising: a clamp body; a pair of arms coupled to the clamp body; and a piezoelectric actuator having a longitudinal axis extending between a first end and a second end, the actuator being coupled to the pair of arms at the first end and to the clamp body at the second end. The second end of the actuator is coupled to the clamp body by a preload mechanism for applying a preload force along the longitudinal axis, and the preload mechanism comprises at least one wedge having an inclined surface which is slidable over a mating inclined surface. Also disclosed is a method of applying a preload force to a piezoelectric actuator of a wire clamp, as well as a jig for applying a preload force to a piezoelectric actuator of a wire clamp.
    Type: Application
    Filed: November 14, 2013
    Publication date: May 14, 2015
    Inventors: Yue ZHANG, Chong Hao CHEN, Zheng Yu LIN