Patents by Inventor Zheng Peng Xiong

Zheng Peng Xiong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High thermal performance packaging for circuit dies
    Patent number: 7776648
    Abstract: A circuit die is disposed into a region defined by a mold. A molding material is then introduced into the region to encapsulate the circuit die. Prior to substantial curing of the molding material, at least a portion of the molding material is removed from over a surface of the circuit die, creating a recessed region in the encapsulating material. A heat spreader may then be disposed within the recessed region, as well as over the top surface of the encapsulating material. The heat spreader may have a downset that substantially aligns with the recessed region and reduces the distance between the heat spreader and the spacer for better heat dissipation.
    Type: Grant
    Filed: December 21, 2006
    Date of Patent: August 17, 2010
    Assignee: Agere Systems Inc.
    Inventors: Kok Hua Chua, Budi Njoman, Zheng Peng Xiong
  • High Thermal Performance Packaging for Circuit Dies
    Publication number: 20090001561
    Abstract: A circuit die is disposed into a region defined by a mold. A molding material is then introduced into the region to encapsulate the circuit die. Prior to substantial curing of the molding material, at least a portion of the molding material is removed from over a surface of the circuit die, creating a recessed region in the encapsulating material. A heat spreader may then be disposed within the recessed region, as well as over the top surface of the encapsulating material. The heat spreader may have a downset that substantially aligns with the recessed region and reduces the distance between the heat spreader and the spacer for better heat dissipation.
    Type: Application
    Filed: December 21, 2006
    Publication date: January 1, 2009
    Inventors: Kok Hua Chua, Budi Njoman, Zheng Peng Xiong