Patents by Inventor ZHENSHAN WANG

ZHENSHAN WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240150871
    Abstract: The disclosure relates an Al—Mg series aluminum alloy sheet, a preparation method and use thereof. The preparation method includes: step S1, melting and casting the alloy raw materials in sequence to obtain an aluminum alloy ingot; step S2, subjecting the aluminum alloy ingot to a two-stage homogenization treatment so as to obtain a homogenized aluminum alloy ingot; and step S3, subjecting the homogenized aluminum alloy ingot to hot rolling, primary cold rolling, intermediate annealing, final cold rolling, and finished product annealing in sequence to obtain the aluminum alloy sheet.
    Type: Application
    Filed: September 28, 2023
    Publication date: May 9, 2024
    Inventors: Xiaodong MAO, Yingdong LI, Pizhi ZHAO, Jingwei ZHAO, Guoqiang HU, Zhenshan LIU, Ningjie GU, Guojun WANG, Xiaoyu SONG
  • Patent number: 10585846
    Abstract: A multi-direction connectable electronic module includes a circuit board, including a top surface, a bottom surface, and at least one side; and a plurality of connectors connected to the circuit board, each including a lateral magnetic connector, a shell, a longitudinal inter-locking part, and a lateral inter-locking part. The lateral inter-locking part is configured to connect with a first electronic building block along the lateral direction. The longitudinal inter-locking part is configured to stack with a second electronic building block along the longitudinal direction. The lateral magnetic connector is configured to magnetically connect with the first electronic building block. A plurality of through holes are formed on the shell. A lateral pin connector disposed on the at least one side of the circuit board includes a plurality of pins located at positions corresponding to the plurality of through holes, and is configured to electrically connect the first electronic building block.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: March 10, 2020
    Assignees: MICRODUINO INC., MEIKE TECHNOLOGY (BEIJING) LTD.
    Inventors: Zhenshan Wang, Kejia Pan, Bin Feng, Xi Li
  • Publication number: 20190042530
    Abstract: A multi-direction connectable electronic module includes a circuit board, including a top surface, a bottom surface, and at least one side; and a plurality of connectors connected to the circuit board, each including a lateral magnetic connector, a shell, a longitudinal inter-locking part, and a lateral inter-locking part. The lateral inter-locking part is configured to connect with a first electronic building block along the lateral direction. The longitudinal inter-locking part is configured to stack with a second electronic building block along the longitudinal direction. The lateral magnetic connector is configured to magnetically connect with the first electronic building block. A plurality of through holes are formed on the shell. A lateral pin connector disposed on the at least one side of the circuit board includes a plurality of pins located at positions corresponding to the plurality of through holes, and is configured to electrically connect the first electronic building block.
    Type: Application
    Filed: June 28, 2018
    Publication date: February 7, 2019
    Inventors: Zhenshan WANG, Kejia PAN, Bin FENG, Xi LI
  • Publication number: 20180247568
    Abstract: Apparatus and method for smart sand table demonstration are provided. The demonstration apparatus includes: a sand table base, a sensor device, a demonstration device and a controller. The sensor device is placed on the sand table base which is also used as a demonstration carrier for the demonstration device. The sensor device includes a sensor module and a first wireless communication module, for monitoring a status of the sensor module and transmit the status information to the controller through a wireless connection. The controller determines demonstration information based at least one of smart demonstration project information and the status information, and transmits the demonstration information to the demonstration device. The demonstration device analyzes the received demonstration information and performs demonstration actions.
    Type: Application
    Filed: February 26, 2018
    Publication date: August 30, 2018
    Inventors: Zhenshan WANG, Hao CHEN, Xi LI, Kejia PAN, Bin FENG
  • Publication number: 20180192454
    Abstract: A networking core device, a wireless networking method and an intelligent network system, based on an electronic module are provided. The networking core device includes a function-module processor configured to identify and control at least one functional electronic module electrically connected to the networking core device; an in-group networking member configured to establish a wireless connection between the networking core device and at least one other networking core device based on a first communication protocol; and a controller configured to establish a connection between the networking core device and an intelligent terminal based on a second communication protocol, and receive and process a control signal of the intelligent terminal.
    Type: Application
    Filed: January 2, 2018
    Publication date: July 5, 2018
    Inventors: Kejia PAN, Yang SHEN, Zhenshan WANG, Bin FENG
  • Patent number: 9980405
    Abstract: The present disclosure provides an electrical module and a modular building system including electrical modules. The electrical module includes a housing member including N pin portions and a connecting portion that connects the N pin portions, where N is greater than 1; N conduction members unconnected with each other; and N magnetic members. Each pin portion is a plate having a through-hole towards its thickness direction, and corresponds to one conduction member and one magnetic member. Each conduction member includes: a first part electrically connected with a lead of an electrical component; and a second part electrically connected with the corresponding magnetic member. Each magnetic member fills the through-hole of the corresponding pin portion, and establishes magnetic connection with a magnetic member of another electrical module in thickness direction to allow the two electrical modules to contact and rotate against each other using a contacting point as a rotation pivot.
    Type: Grant
    Filed: March 10, 2016
    Date of Patent: May 22, 2018
    Assignees: Microduino Inc., Meike Technology (Beijing) Ltd.
    Inventors: Jian Hu, Kejia Pan, Zhenshan Wang, Xi Li, Bin Feng
  • Patent number: 9801300
    Abstract: The present disclosure provides an electrical module and a modular electrical building system including electrical modules. The electrical module includes a printed circuit board (PCB), a housing member, one or more magnets, and one or more inter-locking parts. The PCB has a top surface, a bottom surface, and opposite sides between the top surface and the bottom surface. The housing member is attached to each side of two opposite sides of the PCB and includes an opening in a bottom surface. The magnets are arranged within the housing member and are capably of magnetically attaching the electrical module to another electrical module. Each inter-locking part is configured to pass through the housing member on each side of the PCB. Each inter-locking part has a protrusion extending from a top surface of the housing member and is exposed to the opening in the bottom surface of the housing member.
    Type: Grant
    Filed: May 26, 2015
    Date of Patent: October 24, 2017
    Assignees: MICRODUINO INC., MEIKE TECHNOLOGY (BEIJING) LTD.
    Inventors: Zhenshan Wang, Kejia Pan, Bin Feng
  • Publication number: 20170150631
    Abstract: The present disclosure provides an electrical module and a modular building system including electrical modules. The electrical module includes a housing member including N pin portions and a connecting portion that connects the N pin portions, where N is greater than 1; N conduction members unconnected with each other; and N magnetic members. Each pin portion is a plate having a through-hole towards its thickness direction, and corresponds to one conduction member and one magnetic member. Each conduction member includes: a first part electrically connected with a lead of an electrical component; and a second part electrically connected with the corresponding magnetic member. Each magnetic member fills the through-hole of the corresponding pin portion, and establishes magnetic connection with a magnetic member of another electrical module in thickness direction to allow the two electrical modules to contact and rotate against each other using a contacting point as a rotation pivot.
    Type: Application
    Filed: March 10, 2016
    Publication date: May 25, 2017
    Inventors: JIAN HU, KEJIA PAN, ZHENSHAN WANG, XI LI, BIN FENG
  • Publication number: 20160249478
    Abstract: The present disclosure provides an electrical module and a modular electrical building system including electrical modules. The electrical module includes a printed circuit board (PCB), a housing member, one or more magnets, and one or more inter-locking parts. The PCB has a top surface, a bottom surface, and opposite sides between the top surface and the bottom surface. The housing member is attached to each side of two opposite sides of the PCB and includes an opening in a bottom surface. The magnets are arranged within the housing member and are capably of magnetically attaching the electrical module to another electrical module. Each inter-locking part is configured to pass through the housing member on each side of the PCB. Each inter-locking part has a protrusion extending from a top surface of the housing member and is exposed to the opening in the bottom surface of the housing member.
    Type: Application
    Filed: May 26, 2015
    Publication date: August 25, 2016
    Inventors: ZHENSHAN WANG, KEJIA PAN, BIN FENG
  • Patent number: D807440
    Type: Grant
    Filed: October 14, 2016
    Date of Patent: January 9, 2018
    Assignees: MICRODUINO INC., MEIKE TECHNOLOGY (BEIJING) LTD.
    Inventors: Jian Hu, Kejia Pan, Zhenshan Wang, Xi Li, Taiming Suo, Bin Feng
  • Patent number: D807968
    Type: Grant
    Filed: October 14, 2016
    Date of Patent: January 16, 2018
    Assignees: MICRODUINO INC., MEIKE TECHNOLOGY (BEIJING) LTD.
    Inventors: Jian Hu, Kejia Pan, Zhenshan Wang, Xi Li, Taiming Suo, Bin Feng
  • Patent number: D807969
    Type: Grant
    Filed: October 14, 2016
    Date of Patent: January 16, 2018
    Assignees: MICRODUINO INC., MEIKE TECHNOLOGY (BEIJING) LTD.
    Inventors: Jian Hu, Kejia Pan, Zhenshan Wang, Xi Li, Taiming Suo, Bin Feng
  • Patent number: D817412
    Type: Grant
    Filed: October 14, 2016
    Date of Patent: May 8, 2018
    Assignees: MICRODUINO INC., MEIKE TECHNOLOGY (BEIJING) LTD.
    Inventors: Jian Hu, Kejia Pan, Zhenshan Wang, Xi Li, Taiming Suo, Bin Feng
  • Patent number: D838680
    Type: Grant
    Filed: August 19, 2015
    Date of Patent: January 22, 2019
    Assignees: MICRODUINO INC., MEIKE TECHNOLOGY (BEIJING) LTD.
    Inventors: Zhenshan Wang, Kejia Pan, Bin Feng
  • Patent number: D851612
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: June 18, 2019
    Assignees: MICRODUINO INC., MEIKE TECHNOLOGY (BEIJING) LTD.
    Inventors: Zhenshan Wang, Jian Hu, Kejia Pan, Xi Li, Bin Feng
  • Patent number: D865689
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: November 5, 2019
    Assignee: MICRODUINO INC.
    Inventors: Zhenshan Wang, Kejia Pan, Bin Feng
  • Patent number: D866469
    Type: Grant
    Filed: April 8, 2016
    Date of Patent: November 12, 2019
    Assignees: MICRODUINO INC., MEIKE TECHNOLOGY (BEIJING) LTD.
    Inventors: Jian Hu, Kejia Pan, Zhenshan Wang, Xi Li, Bin Feng
  • Patent number: D879729
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: March 31, 2020
    Assignees: Microduino Inc., Meike Technology (Beijing) Ltd.
    Inventors: Zhenshan Wang, Jian Hu, Kejia Pan, Xi Li, Bin Feng