Patents by Inventor Zhi-Kai Chen

Zhi-Kai Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240168529
    Abstract: An electronic device includes an M.2 connector, a protection circuit, and a processor. The processor is configured to determine whether a module inserted into the M.2 connector is a 4G module or a 5G module. In response to that the processor determines the inserted module is the 4G module, the processor causes the protection circuit to execute a protection process. In response to that the processor determines the inserted module is the 5G module, the processor causes the protection circuit not to execute the protection process. In the protection process, the protection circuit blocks an electrical connection between a first pin of the M.2 connector and a first power supply and blocks an electrical connection between a second pin of the M.2 connector and a reset signal. A method for making two communication modules be compatible in a single M.2 connector and a computer-implemented method thereof are also provided.
    Type: Application
    Filed: February 10, 2023
    Publication date: May 23, 2024
    Inventors: Zhi-Kai ZHANG, Yu-Ting CHEN
  • Patent number: 9128717
    Abstract: Various embodiments of the present invention provide systems and methods for a data processing system with thermal control. For example, a data processing system with thermal control is disclosed that includes a number of data processors and a scheduler, which is operable to determine the power consumption of the data processors and to switch the data processing system from a first mode to a second mode and from the second mode to a third mode. The data processing system consumes less power in the third mode than in the first mode. The second mode prepares the data processing system to enter the third mode.
    Type: Grant
    Filed: April 13, 2012
    Date of Patent: September 8, 2015
    Assignee: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
    Inventors: Zhi Kai Chen, Lei Wang, Yang Han, Shaohua Yang
  • Patent number: 8631300
    Abstract: The present inventions are related to systems and methods for data processing, and more particularly to systems and methods for power governance in a data processing system.
    Type: Grant
    Filed: December 12, 2011
    Date of Patent: January 14, 2014
    Assignee: LSI Corporation
    Inventors: Yang Han, Shaohua Yang, Zhi Kai Chen, Lei Wang, Changyou Xu
  • Publication number: 20130232360
    Abstract: Various embodiments of the present invention provide systems and methods for a data processing system with thermal control. For example, a data processing system with thermal control is disclosed that includes a number of data processors and a scheduler, which is operable to determine the power consumption of the data processors and to switch the data processing system from a first mode to a second mode and from the second mode to a third mode. The data processing system consumes less power in the third mode than in the first mode. The second mode prepares the data processing system to enter the third mode.
    Type: Application
    Filed: April 13, 2012
    Publication date: September 5, 2013
    Applicant: LSI Corporation
    Inventors: Zhi Kai Chen, Lei Wang, Yang Han, Shaohua Yang
  • Publication number: 20130151923
    Abstract: The present inventions are related to systems and methods for data processing, and more particularly to systems and methods for power governance in a data processing system.
    Type: Application
    Filed: December 12, 2011
    Publication date: June 13, 2013
    Inventors: Yang Han, Shaohua Yang, Zhi Kai Chen, Lei Wang, Changyou Xu
  • Publication number: 20090190303
    Abstract: A gap adjusting jig for heat dissipation is suitable to hold at least a heat source of a plate-shaped module. The gap adjusting jig for heat dissipation includes a first heat dissipation plate and a second heat dissipation plate and at least a gap adjusting element. A gap is formed between the first and second heat dissipation plates. The heat source is suitable to be provided in the gap and lean against the first and second heat dissipation plates. The gap adjusting element is connected between the first and second heat dissipation plates. The gap adjusting element is suitable to adjust the gap between the first and second heat dissipation plates to enable the first and second heat dissipation plates to hold the heat source.
    Type: Application
    Filed: June 3, 2008
    Publication date: July 30, 2009
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Hung-Chun Chu, Chun-Teng Chiu, Zhi-Kai Chen, Chien-Han Kao
  • Publication number: 20070254511
    Abstract: An electronic device comprising a circuit board, a first connector, at least a signal wire and an adapter is provided. The first connector is disposed on the circuit board. The signal wire has a second connector. The adapter is used for connecting the first and the second connectors. The adapter includes a base and multiple guiding signs. The base has a first connecting portion and a second connecting portion. The first connecting portion is suitable for connecting with the first connector while the second connecting portion is suitable for connecting with the second connector. In addition, the guiding signs are located on the surface of the base. The electronic device is easy for assembly through the adapter.
    Type: Application
    Filed: April 25, 2007
    Publication date: November 1, 2007
    Applicant: ASUSTEK COMPUTER INC.
    Inventors: Zhi-Kai Chen, Te-Chuan Kuo