Patents by Inventor Zhi Liu

Zhi Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240116771
    Abstract: The present disclosure relates to the technical field of oxygen carrier, discloses a medium-entropy perovskite oxygen carrier and its preparation method and application thereof, the synthesis procedure includes preparing an aqueous solution from metallic nitrate serving as a raw material, performing a coprecipitation reaction with at least one of aqueous ammonia solution, a sodium hydroxide aqueous solution or a sodium carbonate aqueous solution as a precipitant at a pH value of 9.5 to 10.5; obtaining the La3CoMnAlO9 powers after stirring, standing, washing, drying and calcining. The preparation method is simple, synthetic conditions are easy to control, and batch production could be achieved.
    Type: Application
    Filed: May 26, 2023
    Publication date: April 11, 2024
    Inventors: Jinlong Gong, Xianhua Zhang, Chunlei Pei, Zhi-Jian Zhao, Xian Yao, Yifan Liu
  • Publication number: 20240121829
    Abstract: Disclosed are methods and apparatuses for small data transmission in random access. One embodiment of the subject application provides a method performed by a user equipment, including determining an association among a first random access channel (RACH) occasion (RO), a preamble, and a second RO, and receiving an random access response (RAR) in an Msg2 at least according to the second RO in response to transmitting the preamble in the first RO.
    Type: Application
    Filed: December 8, 2020
    Publication date: April 11, 2024
    Applicant: Lenovo (Beijing) Limited
    Inventors: Yuantao Zhang, Hongmei Liu, Zhi Yan, Yingying Li, Haiming Wang
  • Publication number: 20240108140
    Abstract: Disclosed is a folding seat which comprises a chair pocket, a first supporting assembly, and a second supporting assembly, the chair pocket is sheathed on the first supporting assembly and the second supporting assembly. The first supporting assembly comprises a supporting rod and a supporting base, the supporting rod is hinged in the supporting base and rotates in a preset range. The second supporting assembly and the first supporting assembly have the same structure and arranged opposite to each other detachably. By arranging the first supporting assembly and the second supporting assembly detachably to support the chair pocket, the folding seat can be fixed. By dissembling the first supporting assembly and the second supporting assembly, then rotating and adjusting the supporting rods in the first supporting assembly and the second supporting assembly, the folding seat can be folded and stored.
    Type: Application
    Filed: February 22, 2023
    Publication date: April 4, 2024
    Inventors: Ding HE, Zhi LIU
  • Publication number: 20240113209
    Abstract: The present application discloses a low voltage triggering silicon controlled rectifier which includes: an N well and a P well forming a PN junction, a first P+ region formed in the N well and connected to an anode, and a first N+ region formed in the P well and connected to a cathode. A second P+ region is formed in the N well at the PN junction and diffuses into the P well. A second N+ region is formed in the P well at the PN junction and diffuses into the N well. A first gate structure connected to the anode is formed at the surface of the N well between the first and second P+ regions; and a second gate structure connected to the cathode is formed at the surface of the P well between the first and second N+ regions.
    Type: Application
    Filed: May 24, 2023
    Publication date: April 4, 2024
    Inventors: Zhi Tian, Tao Liu, Feng Ji
  • Publication number: 20240113131
    Abstract: An array substrate (100) and a display device. The array substrate (100) includes a bonding area (102). The array substrate (100) includes a substrate (10), a first conductive layer (20) on the substrate (10), a first insulating layer (30) on one side of the first conductive layer (20) away from the substrate (10), and a second conductive layer (40) on one side of the first insulating layer (30) away from the substrate (10). The bonding area (102) is provided with bonding pins (201), and the bonding pin (201) includes a first conductive portion (21) and a second conductive portion (41) located on the side of the first conductive portion (21) away from the substrate (10), the first conductive portion (21) is located in the first conductive layer (20), the second conductive portion (41) is located in the second conductive layer (40), and the first conductive portion (21) is in direct contact with the second conductive portion (41).
    Type: Application
    Filed: May 31, 2021
    Publication date: April 4, 2024
    Inventors: Jie LEI, Zouming XU, Jian TIAN, Chunjian LIU, Xintao WU, Jie WANG, Jianying ZHANG, Yajun MA, Zhi ZHANG, Zhentao LI, Li YIN
  • Publication number: 20240102701
    Abstract: Disclosed is a sub-Kelvin temperature zone refrigeration mechanism. The sub-Kelvin temperature zone refrigeration mechanism includes a pulse tube refrigeration unit, first pre-cooling heat exchangers, a throttling refrigeration unit, second pre-cooling heat exchangers, an adsorption refrigeration unit, a third pre-cooling heat exchanger and a dilution refrigeration unit. The pulse tube refrigeration unit includes a pulse tube refrigeration part. The throttling refrigeration unit includes a throttling refrigeration part, and the throttling refrigeration part is connected with the adsorption refrigeration unit through the second pre-cooling heat exchangers so as to pre-cool the adsorption refrigeration unit. The adsorption refrigeration unit includes an adsorption refrigeration part, and the adsorption refrigeration part is connected with the dilution refrigeration unit through the third pre-cooling heat exchanger.
    Type: Application
    Filed: December 21, 2022
    Publication date: March 28, 2024
    Applicant: Shanghai Institute of Technical Physics Chinese Academy of Sciences
    Inventors: Shaoshuai Liu, Yinong Wu, Xiaoshan Pan, Zhenhua Jiang, Lei Ding, Xinquan Sha, Jiantang Song, Zhichao Chen, Baoyu Yang, Zhi Lu, Zheng Huang
  • Publication number: 20240099994
    Abstract: Provided are sustained-release pharmaceutical compositions including a ketamine pamoate salt and a pharmaceutically acceptable carrier thereof. The compositions include aqueous suspension, solution and matrix delivery system, which can provide sustained release for anesthesia, analgesia or treatment of central nervous system and anti-inflammatory diseases.
    Type: Application
    Filed: December 18, 2020
    Publication date: March 28, 2024
    Applicant: ALAR PHARMACEUTICALS INC.
    Inventors: Tong-Ho Lin, Yung-Shun Wen, Chai-Hsien Chen, Ying-Ting Liu, Rui-Zhi Hou, Zhi-Rong Wu
  • Publication number: 20240105521
    Abstract: A method for forming a semiconductor device structure is provided. The method includes providing a substrate having a base, a first fin, and a second fin over the base. The method includes forming a first trench in the base and between the first fin and the second fin. The method includes forming an isolation layer over the base and in the first trench. The first fin and the second fin are partially in the isolation layer. The method includes forming a first gate stack over the first fin and the isolation layer. The method includes forming a second gate stack over the second fin and the isolation layer. The method includes removing a bottom portion of the base. The isolation layer passes through the base after the bottom portion of the base is removed.
    Type: Application
    Filed: February 9, 2023
    Publication date: March 28, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Da-Zhi ZHANG, Chung-Pin HUANG, Po-Nien CHEN, Hsiao-Han LIU, Jhon-Jhy LIAW, Chih-Yung LIN
  • Publication number: 20240102955
    Abstract: A non-invasive time domain reflection probe calibration method includes: using different volume ratio of ethanol and deionized water mixed solution to calculate a test target's medium weight coefficient and waveguide length of the non-invasive time domain reflection probes; using different concentrations of NaCl solutions to calibrate a waveguide geometric dimensioning of the non-invasive time domain reflection probes; preparing compacted soil samples with known different moisture contents and densities, and calibrating a correlation parameter of compacted soil samples' dielectric constant and conductivity with moisture content and density. The method not only determines the sensitivity of the test target medium of the non-invasive time domain reflection probes, but also obtains the waveguide length and geometric dimensioning of the probe, and realizes an accurate test of moisture content and density of the soil.
    Type: Application
    Filed: July 28, 2023
    Publication date: March 28, 2024
    Applicants: China Jikan Research Institute Of Engineering Investigations And Design, Co.,Ltd, Xi'an Jiaotong University
    Inventors: Jie CAO, Yonglin YANG, Zaixin WAN, Peng GAO, Qingyi MU, Dongjing WANG, Yuanqiang ZHOU, Zhi LIU, Long ZHANG, Hui LI, Jian CHEN, Teng YANG, Lei RAN, Jiao LIN, Xiao DONG, Shuai LIU, Weiwei ZHAO
  • Publication number: 20240105849
    Abstract: A method for forming a semiconductor structure is provided. The method for forming the semiconductor structure includes forming a fin structure over a substrate in a first direction, forming a first gate stack, a second gate stack and a third gate stack across the fin structure, removing the first gate stack to form a trench, depositing a cutting structure in the trench, and forming a first contact plug between the cutting structure and the second gate stack and a second contact plug between the second gate stack and the third gate stack. The fin structure is cut into two segments by the trench. A first dimension of the first contact plug in the first direction is greater than a second dimension of the second contact plug in the first direction.
    Type: Application
    Filed: February 10, 2023
    Publication date: March 28, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Da-Zhi ZHANG, Chun-An LU, Chung-Yu CHIANG, Po-Nien CHEN, Hsiao-Han LIU, Jhon-Jhy LIAW, Chih-Yung LIN
  • Patent number: 11943749
    Abstract: Method and apparatus for data transmission are disclosed. One method of a network equipment includes scrambling and modulating coded bits to generate data; mapping the data into a first resource block and a second resource block, both of which forms a resource block, wherein the first resource block is from a symbol with an indicated index to a symbol with an end index of the resource block, the second resource block is from a symbol with a start index to a symbol with the indicated index minus one of the resource block; and transmitting the data in the resource blocks.
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: March 26, 2024
    Assignee: Lenovo (Beijing) Limited
    Inventors: Zhi Yan, Hongmei Liu, Haipeng Lei, Yingying Li, Haiming Wang
  • Patent number: 11940148
    Abstract: The present disclosure is related to a dual ring gas burner wherein the outer ring includes multipoint injection with bottom breathing and the inner ring works with top breathing. Two flame rings are included along with burner ports on the caps. As a result, better heating distribution is achieved along with greater ease in cleaning and combined simmer functions with high ratings by having the outer ring gas flow not interfering with the inner ring.
    Type: Grant
    Filed: October 28, 2021
    Date of Patent: March 26, 2024
    Assignee: Electrolux Appliances Aktiebolag
    Inventors: Zhi Tan, Huan Liu, Andre Garcia, Michael Dennis Padgett
  • Patent number: 11939644
    Abstract: A method for regenerating different types of copper-containing aluminum alloys using aluminum alloy scrap from aeronautical industry includes detecting a chemical composition of said aluminum alloy scrap and optionally adding a suitable amount of a metal or alloy additive according to a composition requirement of a target aluminum-copper alloy, thereby obtaining a mixture of aluminum alloy scrap and metal or alloy additive; vacuum smelting the mixture of aluminum alloy scrap and metal or alloy additive in a vacuum furnace, wherein impurities are removed and an aluminum alloy solution is formed; filtering the aluminum alloy solution using a filter to obtain a melt comprising a target aluminum alloy composition; and casting the target aluminum alloy composition from said melt.
    Type: Grant
    Filed: July 25, 2019
    Date of Patent: March 26, 2024
    Assignee: The Boeing Company
    Inventors: Zhi Sun, Chunwei Liu, Xuan Wei, Hongbin Cao, Pengcheng Yan
  • Patent number: D1022011
    Type: Grant
    Filed: February 20, 2022
    Date of Patent: April 9, 2024
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Zeteng Yan, Lei Zhong, Zhi Cai, Sunjie Huang, Haofeng Zhang, Xin Fu, Zhiqing Liu
  • Patent number: D1022016
    Type: Grant
    Filed: February 20, 2022
    Date of Patent: April 9, 2024
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Zeteng Yan, Lei Zhong, Zhi Cai, Sunjie Huang, Haofeng Zhang, Xin Fu, Zhiqing Liu
  • Patent number: D1022017
    Type: Grant
    Filed: February 20, 2022
    Date of Patent: April 9, 2024
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Sunjie Huang, Lei Zhong, Zhi Cai, Zeteng Yan, Haofeng Zhang, Xin Fu, Zhiqing Liu
  • Patent number: D1022018
    Type: Grant
    Filed: February 20, 2022
    Date of Patent: April 9, 2024
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Zhi Cai, Lei Zhong, Zeteng Yan, Sunjie Huang, Haofeng Zhang, Xin Fu, Zhiqing Liu
  • Patent number: D1022019
    Type: Grant
    Filed: February 20, 2022
    Date of Patent: April 9, 2024
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Lei Zhong, Zhi Cai, Zeteng Yan, Sunjie Huang, Haofeng Zhang, Xin Fu, Zhiqing Liu
  • Patent number: D1022020
    Type: Grant
    Filed: February 20, 2022
    Date of Patent: April 9, 2024
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Lei Zhong, Zhi Cai, Zeteng Yan, Sunjie Huang, Haofeng Zhang, Xin Fu, Zhiqing Liu
  • Patent number: D1022023
    Type: Grant
    Filed: February 20, 2022
    Date of Patent: April 9, 2024
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Zeteng Yan, Lei Zhong, Zhi Cai, Sunjie Huang, Haofeng Zhang, Xin Fu, Zhiqing Liu