Abstract: The present disclosure relates generally to a method to break and assemble solar cells to make solar panel. The present disclosure provides a method to produce solar pieces from solar cell, as well as assemble them together. The present disclosure device is unique when compared with other known devices and solutions because the present disclosure provides a high speed method to break scribed cells into pieces. A method of forming a string of solar cells includes providing a scribe line on a solar cell and placing a first ribbon on the solar cell. The method then includes placing the solar cell on a supporter and then breaking the solar cell into a plurality of solar cell pieces. The method then has the step of placing a second ribbon on the solar cell pieces and soldering the first and second ribbons and the solar cell pieces and then assembling the solar cell pieces into a string of solar cells.

Abstract: An apparatus and method relates to managing and controlling a photovoltaic system, especially for the safety, maintenance, alert of theft, and connection failure of the system. It is more specially for cases during the night time when the panel is not generating electricity. The present disclosure provides: an AC panel, an inverter; a communication circuit in a panel inverter to send and receive signals, a control circuit, a communicator and a power line communication method between communicator and panel inverters. The communicator detects an identification of each panel to identify the panels and collect data from each panel. The communicator is connected to the Internet through a web gateway. The apparatus also has a web based managing system to collect data from the communicator, as well as transmit signals to the communicator.

Abstract: The present disclosure relates generally to a method to break and assemble solar cells to make solar panel. The present disclosure provides a method to produce solar pieces from solar cell, as well as assemble them together. The present disclosure device is unique when compared with other known devices and solutions because the present disclosure provides a high speed method to break scribed cells into pieces. A method of forming a string of solar cells includes providing a scribe line on a solar cell and placing a first ribbon on the solar cell. The method then includes placing the solar cell on a supporter and then breaking the solar cell into a plurality of solar cell pieces. The method then has the step of placing a second ribbon on the solar cell pieces and soldering the first and second ribbons and the solar cell pieces and then assembling the solar cell pieces into a string of solar cells.

Abstract: A device to generate electricity from solar rays is provided. A photovoltaic solar cell unit comprises a first cover and a second cover. The second cover is generally parallel to the first cover and the second cover is spaced from the first cover. The first and the second cover have a longitudinal axis. The photovoltaic solar cell unit also includes a solar cell disposed between the first cover and the second cover with the solar cell being disposed at a predetermined angle relative to the longitudinal axis.

Abstract: A method and device of fabricating a photovoltaic strip. The method includes providing a photovoltaic cell having a front surface and a back surface and forming a first grid pattern on the front surface and second grid pattern on the back surface. The first grid pattern includes a first plurality of strip columns in parallel in a first direction and a plurality of grid lines in parallel in a second direction perpendicularly crossing the first plurality of strip columns. The second grid pattern includes a plurality of blocks separated by a plurality of streets parallel in the second direction and a second plurality of strip columns parallel in the first direction. The method further includes dicing the photovoltaic cell along the plurality of streets into a plurality of photovoltaic strips. Each of the plurality of photovoltaic strips includes at least one of the plurality of grid lines.

Abstract: A test methodology for testing a memory device with a RSR feature is disclosed. For example, a method for testing a memory device having at least one memory cell group, at least one redundant memory cell group, and a defect detect register is disclosed. In one embodiment, the method applies at least one memory test to the at least one memory cell group; and applies a defect detect register test to the defect detect register.

Abstract: The configuration of a faulty line segment in a switch matrix of a programmable logic device is identified using read-back capture. Each original programmable interconnection point (“PIP”) in the line segment is tested by generating routes from a first logic port through the original line segment and PIP, through all PIPs, adjacent to the original PIP to the opposite logic port. Routes through all PIPs adjacent to the PIPs in the line segment from the first logic port to the second logic port, and from the second logic port to the first logic port, are tested to isolate the fault in the line segment.

Abstract: The embodiments of the present invention enable a new metal diagnosis pattern based on a production test pattern to quickly identify open and short circuits of metal lines which cannot be probed, such as the long lines of a programmable logic device, and to further isolates the fault location for physical failure analysis. According to one aspect of the invention, a circuit locally drives a plurality of metal long line segments to determine whether a defect in a line is a short circuit, or further to identify the location of an open circuit.

Abstract: Described are methods and circuits for identifying defective device layers and localizing defects. Production PLD tests extract statistically significant data relating failed interconnect resources to the associated conductive metal layer. Failure data thus collected is then analyzed periodically to identify layer-specific problems. Test circuits in accordance with some embodiments employ interconnect resources heavily weighted in favor of specific conductive layers to provide improved layer-specific failure data. Some such test circuits are designed to identify open defects, while others are designed to identify short defects.

Abstract: Methods for monitoring and improving the fabrication process of integrated circuits using configurable devices are described. In one aspect, the method includes instantiating a test pattern on one or more configurable devices fabricated using the fabrication process, identifying an underperforming region of the configurable devices, and determining if the underperforming region is layout sensitive. At least one of the fabrication process and the layout of the configurable device can then be adjusted based on the determination. In some embodiments, the configurable device may be a programmable logic device, such as a field programmable logic array.

Abstract: Method and apparatus are disclosed for analyzing defect data produced in testing a semiconductor chip from a logic design. In various embodiments, input for processing is a first inspection data set that identifies a first set of physical locations that are associated with defects detected during fabrication of the chip. Also input is a second test data set that includes one or more identifiers associated with failing circuitry in the chip. A second set of physical locations is determined from the one or more identifiers of failing circuitry, hierarchical relationships between blocks of the design, and placement information associated with the blocks. Each of the one or more identifiers is associated with at least one of the blocks. Correspondences are identified between physical locations in the first inspection data set and the second set of physical locations.

Abstract: Disclosed are methods for utilizing programmable logic devices that contain at least one localized defect. Such devices are tested to determine their suitability for implementing selected designs that may not require the resources impacted by the defect. If the FPGA is found to be unsuitable for one design, additional designs may be tested. The test methods in some embodiments employ test circuits derived from a user's design to verify PLD resources required for the design. The test circuits allow PLD vendors to verify the suitability of a PLD for a given user's design without requiring the PLD vendor to understand the user's design.

Abstract: Disclosed are methods for utilizing programmable logic devices that contain at least one localized defect. Such devices are tested to determine their suitability for implementing selected designs that may not require the resources impacted by the defect. If the FPGA is found to be unsuitable for one design, additional designs may be tested. The test methods in some embodiments employ test circuits derived from a user's design to verify PLD resources required for the design. The test circuits allow PLD vendors to verify the suitability of a PLD for a given user's design without requiring the PLD vendor to understand the user's design.

Abstract: Disclosed are methods for utilizing programmable logic devices that contain at least one localized defect. Such devices are tested to determine their suitability for implementing selected designs that may not require the resources impacted by the defect. If the FPGA is found to be unsuitable for one design, additional designs may be tested. The test methods in some embodiments employ test circuits derived from a user's design to verify PLD resources required for the design. The test circuits allow PLD vendors to verify the suitability of a PLD for a given user's design without requiring the PLD vendor to understand the user's design.

Abstract: Described are methods and circuits for identifying defective device layers and localizing defects. Production PLD tests extract statistically significant data relating failed interconnect resources to the associated conductive metal layer. Failure data thus collected is then analyzed periodically to identify layer-specific problems. Test circuits in accordance with some embodiments employ interconnect resources heavily weighted in favor of specific conductive layers to provide improved layer-specific failure data. Some such test circuits are designed to identify open defects, while others are designed to identify short defects.

Abstract: FPGAs that contain at least one localized defect may be used to implement some designs if the localized defect is not used in the designs. To determine if the FPGA is suitable to implement a design, the design is loaded into the FPGA. The FPGA is tested to determine whether it can execute the design accurately even with the localized defect. The FPGA will be marked as suitable for that design if it passes the test. If the FPGA is found to be unsuitable for one design, additional designs may be tested. Thus, a FPGA manufacturer can sell FPGAs that are normally discarded. As a result, the price of these FPGAs could be set significantly low.

Abstract: A new testing method uses a field programmable gate array to emulate faults, instead of using a separate computer to simulate faults. In one embodiment, a few (e.g., two or three) known good FPGAs are selected. A fault is introduced into the design of a FPGA configuration. The configuration is loaded into the FPGAs. A test vector is applied and the result is evaluated. If the result is different from that of a fault-free configuration, the fault is caught. One application of this method is to evaluate fault coverage. A fault model that can be used in the present invention is disclosed.

Abstract: FPGAs that contain at least one localized defect may be used to implement some designs if the localized defect is not used in the designs. To determine if the FPGA is suitable to implement a design, the design is loaded into the FPGA. The FPGA is tested to determine whether it can execute the design accurately even with the localized defect. The FPGA will be marked as suitable for that design if it passes the test. If the FPGA is found to be unsuitable for one design, additional designs may be tested. Thus, a FPGA manufacturer can sell FPGAs that are normally discarded. As a result, the price of these FPGAs could be set significantly low.

Abstract: A reticle that is modified to prevent bridging of the masking material (e.g., chrome) between portions of the lithographic mask pattern during an integrated circuit fabrication process. According to a first aspect, the modification involves electrically connecting the various portions of the lithographic mask pattern that balance charges generated in the portions during fabrication processes. In one embodiment, sub-resolution wires that extend between the lithographic mask pattern portions facilitate electrical conduction between the mask pattern portions, thereby equalizing dissimilar charges. In another embodiment, a transparent conductive film is formed over the lithographic mask pattern to facilitate conduction. In accordance with a second aspect, the modification involves separating the various portions of the lithographic mask pattern into relatively small segments by providing sub-resolution gaps between the various portions, thereby minimizing the amount of charge that is generated on each portion.

Abstract: An apparatus and method for detecting defect sizes in polysilicon and source-drain semiconductor devices and methods for making the same. Implemented is a double bridge test structure that includes a resistor path of first semiconductor material, such as doped silicon comprising a plurality of strip segments and with interconnection segments. A plurality of strips of second semiconductor material having a substantially lower resistivity are connected to form parallel circuit interconnections with the corresponding strip segments. The test structure is formed by masking techniques wherein a prescribed mask region enables portions of the silicon resistor or deposited polysilicon to be selectively silicided to form silicide and polycide, respectively. One embodiment for testing for defects in a polysilicon layer uses polycide as the low-resistivity strips, enabling the testing of open and short-circuit defects.