Abstract: A computer-implemented method according to one embodiment includes identifying a job creation request within a system; determining a current amount of available resources within the system; and conditionally deploying a reusable group of containers for the job, based on the current amount of available resources for the system.

Abstract: A memory management method for a memory storage device is provided. The memory management method includes: detecting effective information of at least one operation event performed by the memory storage device in a first mode; and adjusting a threshold value according to the effective information. The threshold value is configured to determine whether to instruct the memory storage device to enter the first mode.

Abstract: A semiconductor device testing system, with a platform for supporting a semiconductor substrate, a light emitting system directed toward the platform, a controller, coupled to the light emitting system and adapted to selectively alter an operational parameter of the light emitting system, and a tester configured to characterize an electrical parameter of an electrical device formed in or over the semiconductor substrate while the electrical device is illuminated by one or more wavelengths of light emitted by the light emitting system under direction of the controller.

Abstract: A computerized simulation validating method for a full-scale distribution network single phase-to-ground fault test is implemented by simulating a full-scale test system with external quantities being controlled to be conformant and validating the full-scale distribution network single phase-to-ground fault test based on a conformance check result between the internal quantities of the field testing and the internal quantities of the simulation testing. The simulation validating method for a full-scale distribution network single phase-to-ground fault test improves normalization and conformance of the full-scale distribution network ground fault test. The computerized simulation validating system, apparatus, and medium for a full-scale distribution network single phase-to-ground fault test also achieve the benefits noted above.

Abstract: A method of fabricating an integrated circuit includes etching trenches in a first surface of a semiconductor layer. A trench dielectric layer is formed over the first surface and over bottoms and sidewalls of the trenches and a doped polysilicon layer is formed over the trench dielectric layer and within the trenches. The doped polysilicon layer is patterned to form a polysilicon bridge that connects to the polysilicon within the filled trenches and a blanket implant of a first dopant is directed to the polysilicon bridge and to the first surface. The blanket implant forms a contact region extending from the first surface into the semiconductor layer.

Abstract: A fluid and power provision apparatus is provided. The apparatus includes a power provision device and a pump assembly. The pump assembly includes a motor, a transmission system, a piston assembly, and a collar assembly. The piston assembly includes a piston sleeve, a piston, and a piston arm operably coupled to the piston and the transmission system to transmit energy from the motor to articulate the piston within the piston sleeve. The collar assembly forms a collar plenum, a first flowpath, and a second flowpath. The piston sleeve extends at least in part into the collar plenum. The first flowpath extends in fluid communication from the collar plenum to a fluid supply outlet. The second flowpath extends in fluid communication from an interior of the apparatus to the first flowpath.

Abstract: Methods, systems, and computer-readable storage media for providing a first instance of a database system within the cloud computing environment, determining that scale out of the database system is to be executed, and in response, providing a second instance of the database system within the cloud computing environment, the first instance and the second instance collectively defining a cluster, establish a remote direct memory access (RDMA) connection between the first instance and the second instance, copying data stored within the first instance to a data store of the second instance over the RDMA connection, and configuring the first instance to replicate a first transaction log to the second instance over the RDMA connection, and receiving, by each of the first instance and the second instance, requests from one or more client devices.

Abstract: Described herein are techniques are provided for enabling a security orchestration, automation, and response (SOAR) service to automatically manage apps used to interface with an integrated security operations service and other related devices and services. Further described herein is a SOAR app generator service or application used to automate the creation of apps for a SOAR service based on application programming interfaces (API) specifications for related devices or services, as well as visual playbook editor interfaces for a SOAR service that enable the configuration of complex action input parameters including arrays and objects.

Abstract: A camera module of reduced size includes a baseplate, an image sensor on the baseplate, a mounting bracket with a through hole, and a circuit board. An inner wall of the through hole extends towards a central axis of the through hole to form a platform, a side of the mounting bracket adjacent to the platform extends outward to form a connecting portion. A multilayer coil, a capacitor, and a resistor are formed on the mounting bracket by laser direct structuring, the multilayer coil is of encircling coils arranged from inside to outside on the mounting bracket and surrounds the through hole. The circuit board is connected with the mounting bracket through the connecting portion. A method for manufacturing a lens module is also disclosed.

Abstract: A method of fabricating an integrated circuit includes etching trenches in a first surface of a semiconductor layer. A trench dielectric layer is formed over the first surface and over bottoms and sidewalls of the trenches and a doped polysilicon layer is formed over the trench dielectric layer and within the trenches. The doped polysilicon layer is patterned to form a polysilicon bridge that connects to the polysilicon within the filled trenches and a blanket implant of a first dopant is directed to the polysilicon bridge and to the first surface. The blanket implant forms a contact region extending from the first surface into the semiconductor layer.

Abstract: Methods, systems, and computer-readable storage media for providing a first instance of a database system within the cloud computing environment, determining that scale out of the database system is to be executed, and in response, providing a second instance of the database system within the cloud computing environment, the first instance and the second instance collectively defining a cluster, establish a remote direct memory access (RDMA) connection between the first instance and the second instance, copying data stored within the first instance to a data store of the second instance over the RDMA connection, and configuring the first instance to replicate a first transaction log to the second instance over the RDMA connection, and receiving, by each of the first instance and the second instance, requests from one or more client devices.

Abstract: One or more computer processors encode a plurality of time sequenced global position system (GPS) datapoints onto a grided dimensional area; determine a general trajectory between each time sequenced GPS datapoint in the plurality of encoded time sequenced GPS datapoints and a subsequent encoded time sequenced GPS datapoint; cluster the encoded time sequenced GPS datapoints based on a respective determined trajectory with a plurality of encoded historical GPS datapoints; calculate an azimuth for each encoded time sequenced GPS datapoint in the plurality of time sequenced GPS datapoints utilizing a plurality of adjacent historical GPS datapoints contained within a respective cluster; generate a plurality of interpolated GPS datapoints utilizing calculated azimuths, determined general trajectories, and historical GPS datapoints; and aggregate the generated interpolated GPS datapoints with the plurality of time sequenced GPS datapoints into an interpolated route, wherein each GPS datapoint in the interpolated ro

Abstract: Methods, systems, and computer-readable storage media for receiving a query request including authorization data and a query, the authorization data indicating a privilege level index, determining a set of row ranges based on the privilege level index and a row range table, the set of row ranges including one or more row ranges having a privilege level associated therewith in the row range table, providing an initial results set including one or more records of a data table that are determined to be responsive, determining a final results set including at least one record of the initial results set, the at least one record being included in the final results set in response to determining that the at least one record is included in a row range of the set of row ranges, and outputting the final results set as at least a portion of a query result.

Abstract: Disclosure provides an adapter board and a method for making the adapter board, which includes providing a mold in which a plurality of first fixing plates and second fixing plates are provided, providing a plurality of wires sequentially passed through the plurality of first fixing plates and the second fixing plate, injecting a non-conductive material into the cavity to form a body, and cutting the body along both sides of the first fixing plates and the second fixing plates to obtain a plurality of board bodies. The first fixing plates are provided with a plurality of first fixing holes, and the second fixing plates are provided with a plurality of second fixing holes. The board body includes a first surface and a second surface. A plurality of first connection pads are formed on the first surface, and a plurality of second connection pads are formed on the second surface.

Abstract: A polishing apparatus includes a polishing device, a polishing fixing device, and a controller. The polishing fixing device includes a rotating mechanism, a sensor, a movement compensation assembly, a first moving assembly and a second moving assembly. The sensor in the polishing fixing device senses pressure applied to the workpiece during polishing, the movement compensation assembly can drive the rotating mechanism to move in compensation, so as to keep the polishing pressure within a certain range for uniformity in polishing, improving the polishing quality and production efficiency of the workpiece.

Abstract: One or more computer processors encode a plurality of time sequenced global position system (GPS) datapoints onto a grided dimensional area; determine a general trajectory between each time sequenced GPS datapoint in the plurality of encoded time sequenced GPS datapoints and a subsequent encoded time sequenced GPS datapoint; cluster the encoded time sequenced GPS datapoints based on a respective determined trajectory with a plurality of encoded historical GPS datapoints; calculate an azimuth for each encoded time sequenced GPS datapoint in the plurality of time sequenced GPS datapoints utilizing a plurality of adjacent historical GPS datapoints contained within a respective cluster; generate a plurality of interpolated GPS datapoints utilizing calculated azimuths, determined general trajectories, and historical GPS datapoints; and aggregate the generated interpolated GPS datapoints with the plurality of time sequenced GPS datapoints into an interpolated route, wherein each GPS datapoint in the interpolated ro

Abstract: In a described example, a method of forming a capacitor includes forming a doped polysilicon layer over a semiconductor substrate. The method also includes forming a dielectric layer on the doped polysilicon layer. The method also includes forming an undoped polysilicon layer on the dielectric layer.

Abstract: A method of fabricating an integrated circuit includes etching trenches in a first surface of a semiconductor layer. A trench dielectric layer is formed over the first surface and over bottoms and sidewalls of the trenches and a doped polysilicon layer is formed over the trench dielectric layer and within the trenches. The doped polysilicon layer is patterned to form a polysilicon bridge that connects to the polysilicon within the filled trenches and a blanket implant of a first dopant is directed to the polysilicon bridge and to the first surface. The blanket implant forms a contact region extending from the first surface into the semiconductor layer.

Abstract: A connecting structure includes an insulation base, first pads, and second pads. The insulation base includes a first surface, a second surface, and a lateral surface connecting therebetween. First grooves are defined on the first surface, second grooves are defined on the second surface, third grooves are defined on the lateral surface. Each third groove connects one first groove and one second groove. The first pads are deposited in the first grooves. The second pads are deposited in the second grooves. Wiring portions are deposited in the third grooves, each wiring portion connects one first pad and one second pad. A conductive ink layer is coated on the first and the second pads. A protective ink layer is coated on the wiring portions and the insulating base except for the first and the second pads. The first and the second grooves are stepped grooves.

Abstract: A method for connecting stacked circuit boards includes: a connecting structure is provided, the connecting structure is a bendable and flexible circuit board; a first circuit board and a plurality of supporting posts are provided, each of the supporting posts is dispersedly fixed to a side surface of the first circuit board; a second circuit board is provided, and two peripheral portions of the connecting structure are respectively fixed to the first circuit board and the second circuit board, the peripheral portions of the connecting structure are respectively near two opposite ends of the connecting structure; the connecting structure is bent to flip the second circuit board super-positioned above the first circuit board, and the second circuit board is connected to a free end of each of the supporting posts.