Patents by Inventor Zhi Zhong
Zhi Zhong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11990979Abstract: A base station for communication with a terminal station having a plurality of terminal station antennas. The base station has a plurality of directional antennas, each of the plurality of directional antennas in communication with satellites in view. The base station also has a processing device (e.g., eNodeB) to transmit each of the multiple base-station antenna signals via each of the plurality of directional antennas to satellites and/or the beams of the same satellite seen by the terminal station for retransmission to the plurality of terminal station antennas.Type: GrantFiled: November 28, 2022Date of Patent: May 21, 2024Assignee: AST & Science, LLCInventors: Huiwen Yao, Abel Avellan, Sriram Jayasimha, Zhi Zhong Yu
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Publication number: 20240147134Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.Type: ApplicationFiled: December 18, 2023Publication date: May 2, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
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Publication number: 20240141086Abstract: This disclosure relates to a curable composition comprising (a) at least one light polymerizable liquid; (b) at least one epoxy precursor dissolved in component (a); and (c) at least one photoinitiator; wherein the curable composition exhibits no more than 15% increase in viscosity at 25° C. after 7 days at room temperature.Type: ApplicationFiled: February 11, 2022Publication date: May 2, 2024Inventors: Fan ZHANG, Chong Xi WANG, Zhi Zhong CAI
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Publication number: 20240137681Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.Type: ApplicationFiled: December 19, 2023Publication date: April 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
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Publication number: 20240137684Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.Type: ApplicationFiled: December 15, 2023Publication date: April 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
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Publication number: 20240137682Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.Type: ApplicationFiled: December 18, 2023Publication date: April 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
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Publication number: 20240137683Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.Type: ApplicationFiled: December 18, 2023Publication date: April 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
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Publication number: 20240137687Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.Type: ApplicationFiled: December 18, 2023Publication date: April 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
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Publication number: 20240137693Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.Type: ApplicationFiled: December 15, 2023Publication date: April 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
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Publication number: 20240137690Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.Type: ApplicationFiled: December 15, 2023Publication date: April 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
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Publication number: 20240137689Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.Type: ApplicationFiled: December 15, 2023Publication date: April 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
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Publication number: 20240137692Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.Type: ApplicationFiled: December 15, 2023Publication date: April 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
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Patent number: 11956648Abstract: The present invention relates to commissioning in the presence of multiple networks. A network node, which is expected to join a second network, joins a first network and enters a second state from a first state once it has joined the first network. Once it has received from the first network a message to leave it, it enters a third state from the second state. The network node entered the third state becomes responsive with respect to the first network and/or the second network by receiving a dedicated message to join network or is unresponsive with respect to the first network. Then, it enters the first state from the third state once the network node has received the dedicated message from a coordinator of the first network after closing the first network and/or from a coordinator of the second network, or upon expiry of a timer.Type: GrantFiled: June 18, 2019Date of Patent: April 9, 2024Assignee: SIGNIFY HOLDING B.V.Inventors: Zhi Zhong Zz Zhang, Dun Fa Df Chen, Hao Que
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Patent number: D1022011Type: GrantFiled: February 20, 2022Date of Patent: April 9, 2024Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Zeteng Yan, Lei Zhong, Zhi Cai, Sunjie Huang, Haofeng Zhang, Xin Fu, Zhiqing Liu
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Patent number: D1022016Type: GrantFiled: February 20, 2022Date of Patent: April 9, 2024Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Zeteng Yan, Lei Zhong, Zhi Cai, Sunjie Huang, Haofeng Zhang, Xin Fu, Zhiqing Liu
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Patent number: D1022017Type: GrantFiled: February 20, 2022Date of Patent: April 9, 2024Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Sunjie Huang, Lei Zhong, Zhi Cai, Zeteng Yan, Haofeng Zhang, Xin Fu, Zhiqing Liu
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Patent number: D1022018Type: GrantFiled: February 20, 2022Date of Patent: April 9, 2024Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Zhi Cai, Lei Zhong, Zeteng Yan, Sunjie Huang, Haofeng Zhang, Xin Fu, Zhiqing Liu
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Patent number: D1022019Type: GrantFiled: February 20, 2022Date of Patent: April 9, 2024Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Lei Zhong, Zhi Cai, Zeteng Yan, Sunjie Huang, Haofeng Zhang, Xin Fu, Zhiqing Liu
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Patent number: D1022020Type: GrantFiled: February 20, 2022Date of Patent: April 9, 2024Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Lei Zhong, Zhi Cai, Zeteng Yan, Sunjie Huang, Haofeng Zhang, Xin Fu, Zhiqing Liu
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Patent number: D1022023Type: GrantFiled: February 20, 2022Date of Patent: April 9, 2024Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Zeteng Yan, Lei Zhong, Zhi Cai, Sunjie Huang, Haofeng Zhang, Xin Fu, Zhiqing Liu