Patents by Inventor Zhi Zhou

Zhi Zhou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240147134
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 18, 2023
    Publication date: May 2, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137693
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137683
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137681
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 19, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137684
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137682
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137689
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137690
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137687
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137692
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Patent number: 11965833
    Abstract: A detection device includes a frame, a transport mechanism, detection mechanisms, and a grasping mechanism. The transport mechanism includes a feeding line, a first flow line, and a second flow line arranged in parallel on the frame. The detection mechanisms are arranged on the frame and located on two sides of the transport mechanism. The grasping mechanism is arranged on the frame and used to transport workpieces on the feeding line to the detection mechanisms, transport qualified workpieces to the first flow line, and transport unqualified workpieces to the second flow line.
    Type: Grant
    Filed: November 26, 2020
    Date of Patent: April 23, 2024
    Assignees: HONGFUJIN PRECISION ELECTRONICS (ZHENGZHOU) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Jing-Zhi Hou, Lin-Hui Cheng, Yan-Chao Ma, Jin-Cai Zhou, Zi-Long Ma, Neng-Neng Zhang, Yi Chen, Chen-Xi Tang, Meng Lu, Peng Zhou, Ling-Hui Zhang, Lu-Hui Fan, Shi-Gang Xu, Cheng-Yi Chao, Liang-Yi Lu
  • Publication number: 20240127231
    Abstract: Embodiments of this application provide methods and apparatuses for offline payment authorization. In an implementation, a method comprising: obtaining wallet account information, a current account balance, and current credit information of a target electronic wallet account in response to determining that a current state of the target electronic wallet account satisfies a predetermined certificate delivery condition, determining an offline payment limit based on the current account balance and the current credit information, signing summary information by using a private key of a server to obtain an electronic wallet signature, generating a user certificate based on the summary information and the electronic wallet signature, and sending the user certificate to a terminal device associated with the target electronic wallet account for an offline account corresponding to the target electronic wallet account to make offline payment within the offline payment limit based on the user certificate.
    Type: Application
    Filed: December 27, 2023
    Publication date: April 18, 2024
    Applicant: ALIPAY (HANGZHOU) INFORMATION TECHNOLOGY CO., LTD.
    Inventors: Dengwei Xu, Bingying Zhu, Zhi Xin, Xiaofei Wan, Lei Zhou
  • Patent number: 11958942
    Abstract: The present disclosure provides a method for recycling urea-formaldehyde (UF) from a wood-based panel. In the present disclosure, the UF is depolymerized by an ultrasonic treatment, and depolymerized UF can be reused for UF manufacture and wood-based panel production. The recycled and treated UF can be repeatedly used in wood-based panel manufacture without affecting performances of the wood-based panel. UF-glued wood-based panels can be recycled, and a recycled wood-based panel raw material can replace at least 50% of a non-recycled wood-based raw material for particle board production without affecting performances of the wood-based panel.
    Type: Grant
    Filed: April 10, 2023
    Date of Patent: April 16, 2024
    Assignee: Southwest Forestry University
    Inventors: Hui Wan, An Mao, Hong Lei, Xiaojian Zhou, Zhi Li, Long Yang, Linkun Xie, Guanben Du
  • Patent number: 11962250
    Abstract: Provided is a hybrid modular multilevel converter (HMMC) based on a neutral point clamped (NPC) topology and having an ABC N-phase structure. The HMMC includes N pairs of identical upper and lower arms, each upper and lower arm being composed of X submodules and Y sets of switches. The switches within each set are cascaded and connected in series, each of the submodules is formed of full-bridge silicon (Si) insulated-gate bipolar transistor (IGBT) converters, and at least one of the set of switches is formed of IGBTs of opposite polarities.
    Type: Grant
    Filed: July 1, 2022
    Date of Patent: April 16, 2024
    Assignee: GE Energy Power Conversion Technology Limited
    Inventor: Zhi Zhou
  • Patent number: 11962251
    Abstract: Provided is a hybrid modular multilevel converter (HMMC) based on a neutral point pilot (NPP) topology and having an ABC N-phase structure. The HMMC includes N pairs of identical upper and lower arms, each upper and lower arm being composed of X submodules and Y sets of switches. The switches within each set are cascaded and connected in series, each of the submodules is formed of full-bridge silicon (Si) insulated-gate bipolar transistor (IGBT) converters, and at least one of the set of switches is formed of IGBTs of opposite polarities.
    Type: Grant
    Filed: July 1, 2022
    Date of Patent: April 16, 2024
    Assignee: GE Energy Power Conversion Technology Limited
    Inventor: Zhi Zhou
  • Publication number: 20240109955
    Abstract: Disclosed are antigen binding polypeptides and antigen binding polypeptide complexes (e.g., antibodies and antigen binding fragments thereof) having certain structural and/or functional features. Also disclosed are polynucleotides and vectors encoding such polypeptides and polypeptide complexes; host cells, pharmaceutical compositions and kits containing such polypeptides and polypeptide complexes; and methods of using such polypeptides and polypeptide complexes.
    Type: Application
    Filed: June 30, 2023
    Publication date: April 4, 2024
    Inventors: Juan LI, Chi-Jen WEI, Ronnie R. WEI, Zhi-Yong YANG, John R. MASCOLA, Gary J. NABEL, John MISASI, Amarendra PEGU, Lingshu WANG, Tongqing ZHOU, Misook CHOE, Olamide K. OLONINIYI, Bingchun ZHAO, Yi ZHANG, Eun Sung YANG, Man CHEN, Kwanyee LEUNG, Wei SHI, Nancy J. SULLIVAN, Peter D. KWONG, Richard A. KOUP, Barney S. GRAHAM, Peng HE
  • Patent number: 11944749
    Abstract: A ventilation treatment device and a ventilation-control method are provided. During use, when a headband contacts a headrest, a first valve assembly contacts a second valve assembly to open first air holes and second air holes, thereby communicating a first chamber with a second chamber, such that air from an air source into the first chamber enters the second chamber and further enters a respiratory chamber of a patient connecting apparatus for inhalation by a patient; and when the headband is separated from the headrest, the first valve assembly and the second value assembly are separated to close the first air holes and the second air holes, thereby preventing the air in the first chamber and the second chamber from flowing out through the first air holes and the second air holes, respectively.
    Type: Grant
    Filed: December 31, 2020
    Date of Patent: April 2, 2024
    Assignee: BMC MEDICAL CO., LTD.
    Inventors: Zhi Zhuang, Mingzhao Zhou, Erliang Li
  • Publication number: 20240102955
    Abstract: A non-invasive time domain reflection probe calibration method includes: using different volume ratio of ethanol and deionized water mixed solution to calculate a test target's medium weight coefficient and waveguide length of the non-invasive time domain reflection probes; using different concentrations of NaCl solutions to calibrate a waveguide geometric dimensioning of the non-invasive time domain reflection probes; preparing compacted soil samples with known different moisture contents and densities, and calibrating a correlation parameter of compacted soil samples' dielectric constant and conductivity with moisture content and density. The method not only determines the sensitivity of the test target medium of the non-invasive time domain reflection probes, but also obtains the waveguide length and geometric dimensioning of the probe, and realizes an accurate test of moisture content and density of the soil.
    Type: Application
    Filed: July 28, 2023
    Publication date: March 28, 2024
    Applicants: China Jikan Research Institute Of Engineering Investigations And Design, Co.,Ltd, Xi'an Jiaotong University
    Inventors: Jie CAO, Yonglin YANG, Zaixin WAN, Peng GAO, Qingyi MU, Dongjing WANG, Yuanqiang ZHOU, Zhi LIU, Long ZHANG, Hui LI, Jian CHEN, Teng YANG, Lei RAN, Jiao LIN, Xiao DONG, Shuai LIU, Weiwei ZHAO
  • Publication number: 20240097991
    Abstract: A method and a device for generating simulation data, a computer device and a storage medium are provided. The method includes: receiving user input through a user interface, where the user input includes a data type parameter, a value parameter, a generation time parameter and a target interface parameter of data to be generated; searching for a pre-stored data template file corresponding to the data type parameter; generating a data packet queue based on the value parameter by using the data template file; and sending each data packet in the data packet queue to a target interface corresponding to the target interface parameter based on a sending moment specified by the generation time parameter. With this method, the cost of the test system can be reduced and the flexibility of available test data can be improved.
    Type: Application
    Filed: September 15, 2023
    Publication date: March 21, 2024
    Inventor: Zhi Zhou
  • Patent number: D1021808
    Type: Grant
    Filed: August 9, 2021
    Date of Patent: April 9, 2024
    Inventors: Ke Lou, Zhenbin Zhou, Kaijun Zhou, Zhi Mou Wu