Patents by Inventor Zhigao Deng

Zhigao Deng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTRONIC DEVICE INCLUDING POWER SUPPLYING APPARATUS, AND COMPUTING SYSTEM
    Publication number: 20240045486
    Abstract: This application provides an electronic device includes the power supplier and a plurality of circuit boards. The power supplier is located below the plurality of circuit boards, each circuit board is connected to the power supplier to obtain power from the power supplier.
    Type: Application
    Filed: October 19, 2023
    Publication date: February 8, 2024
    Inventors: Zhigao DENG, Zao LIU
  • Backplane and backplane communication system
    Patent number: 8570764
    Abstract: The embodiments of the present invention disclose a backplane and backplane system. The backplane includes at least two service slots with the same function and an exchange slot. Among the pins of different service slots with the same function respectively connected to the exchange slot, at least two pins are arranged to resemble a stepped form. When arranged in this manner, the distribution and orientation of the connection lines connecting the pins of the service slots with the same function to the exchange slot may be adjusted, and wiring density within a single wiring layer may be increased, which therefore enables the connection lines between the service slots and the exchange slot to be staggered from each other in less wiring layers or even one wiring layer, and as a result, decreases the number of the wiring layers to be used, and reduces the costs of the backplane.
    Type: Grant
    Filed: September 16, 2011
    Date of Patent: October 29, 2013
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Hui Wang, Zhigao Deng, Tao Yu, Qian Deng, Hua Xu, Meihan Cao
  • BACKPLANE AND BACKPLANE COMMUNICATION SYSTEM
    Publication number: 20120002378
    Abstract: The embodiments of the present invention disclose a backplane and backplane system. The backplane includes at least two service slots with the same function and an exchange slot. Among the pins of different service slots with the same function respectively connected to the exchange slot, at least two pins are arranged to resemble a stepped form. When arranged in this manner, the distribution and orientation of the connection lines connecting the pins of the service slots with the same function to the exchange slot may be adjusted, and wiring density within a single wiring layer may be increased, which therefore enables the connection lines between the service slots and the exchange slot to be staggered from each other in less wiring layers or even one wiring layer, and as a result, decreases the number of the wiring layers to be used, and reduces the costs of the backplane.
    Type: Application
    Filed: September 16, 2011
    Publication date: January 5, 2012
    Applicant: Huawei Technologies Co., Ltd.
    Inventors: Hui Wang, Zhigao Deng, Tao Yu, Qian Deng, Hua Xu, Meihan Cao