Abstract: A smoke detector with an anti-insect function includes a substrate, an optical detection module, a top cover, a base and a perforated plate. The substrate has a ring shape region surrounding a central detection region, and a first block structure of the central detection region is protruded from the substrate and higher than an upper surface of the ring shape region. The optical detection module is disposed inside the central detection region. The top cover has a lateral wall. The base is disposed on the substrate and connected to the top cover to cover the optical detection module. The base has a second block structure partly overlapped with the lateral wall to form a guiding channel. The perforated plate is disposed between the lateral wall and the second block structure to prevent an insect from moving into the top cover through the guiding channel.

Abstract: Provided are FinFET devices and methods of forming the same. A dummy gate having gate spacers on opposing sidewalls thereof is formed over a substrate. A dielectric layer is formed around the dummy gate. An upper portion of the dummy gate is removed and upper portions of the gate spacers are removed, so as to form a first opening in the dielectric layer. A lower portion of the dummy gate is removed to form a second opening below the first opening. A metal layer is formed in the first and second openings. The metal layer is partially removed to form a metal gate.

Abstract: Examples of an integrated circuit with gate cut features and a method for forming the integrated circuit are provided herein. In some examples, a workpiece is received that includes a substrate and a plurality of fins extending from the substrate. A first layer is formed on a side surface of each of the plurality of fins such that a trench bounded by the first layer extends between the plurality of fins. A cut feature is formed in the trench. A first gate structure is formed on a first fin of the plurality of fins, and a second gate structure is formed on a second fin of the plurality of fins such that the cut feature is disposed between the first gate structure and the second gate structure.

Abstract: A method includes forming a gate stack, which includes a gate dielectric and a metal gate electrode over the gate dielectric. An inter-layer dielectric is formed on opposite sides of the gate stack. The gate stack and the inter-layer dielectric are planarized. The method further includes forming an inhibitor film on the gate stack, with at least a portion of the inter-layer dielectric exposed, selectively depositing a dielectric hard mask on the inter-layer dielectric, with the inhibitor film preventing the dielectric hard mask from being formed thereon, and etching to remove a portion of the gate stack, with the dielectric hard mask acting as a portion of a corresponding etching mask.

Abstract: An image projector in a case, having a light engine, a circuit board, a heat sink assembly, and a fan assembly, has one or more heat sinks and heat pipes shaped to gather heat from all heat-generating components within the projector and a single air passage to receive the heated air combined from all components, allowing the employment of a single fan module in sucking cool air from the exterior and exhausting heated air through the single air passage.

Abstract: An image projector in a case, having a light engine, a circuit board, a heat sink assembly, and a fan assembly, has one or more heat sinks and heat pipes shaped to gather heat from all heat-generating components within the projector and a single air passage to receive the heated air combined from all components, allowing the employment of a single fan module in sucking cool air from the exterior and exhausting heated air through the single air passage.

Abstract: An organic electroluminescent display panel comprises a substrate, at least one organic light-emitting area, at least one protecting layer, at least one isolation layer and at least one protrusion. In this case, the organic light-emitting area comprises a plurality of pixels and is disposed over the substrate. The protecting layer is disposed over the substrate and the organic light-emitting area. The isolation layer is disposed over the protecting layer.