Abstract: Embodiments include semiconductor packages and a method of forming the semiconductor packages. A semiconductor package includes a package substrate with a top surface, a corner portion, and a plurality of solder balls on the top surface of the package substrate. The semiconductor package also includes a pattern on the corner portion of the package substrate. The pattern may have a width substantially equal to a width of the solder balls. The pattern may also include a continuous line having solder materials. The semiconductor package may include a plurality of conductive pads on the package substrate. The conductive pads may be coupled to the pattern. The pattern may have a z-height that is substantially equal to a z-height of the solder balls, and have one or more outer edges, where the outer edges of the pattern are sidewalls. The sidewalls of the pattern may be substantially vertical or tapered sidewalls.

Abstract: The present disclosure relates to an optical panel, and more particularly, to a stack-up structure of an optical panel and the manufacturing method thereof, wherein the stack-up structure comprises: a first laminating element, which has a first laminating face; and a first protective layer, which is formed on the first laminating face of the first laminating element for flattening the first laminating face. The present disclosure allows a protective layer to be coated on a surface of a laminate to overcome unevenness problem on the surface of the laminating element, thereby avoiding generation of bubbles and enhancing the yield of products.

Abstract: The present disclosure relates to an optical panel, and more particularly, to a stack-up structure of an optical panel and the manufacturing method thereof, wherein the stack-up structure comprises: a first laminating element, which has a first laminating face; and a first protective layer, which is formed on the first laminating face of the first laminating element for flattening the first laminating face. The present disclosure allows a protective layer to be coated on a surface of a laminate to overcome unevenness problem on the surface of the laminating element, thereby avoiding generation of bubbles and enhancing the yield of products.