Abstract: A method for processing a takt at a station includes: obtaining takt data of each station within a preset time period, and determining a takt boxplot of each station according to the takt data; obtaining a material blocking time, a material shortage time and a failure time in each takt, determining an effective takt of each station based on the takt data, the material blocking time, the material shortage time and the failure time, and determining an effective takt mode; obtaining planning takt data of each station, generating a station takt wall station based on the takt boxplot, the effective takt mode and the planning takt data; determining a takt fluctuation status and a bottleneck of each station according to the station takt wall. A system for processing a takt at a station, an apparatus, and a storage medium are also disclosed.

Abstract: The invention is a heat exchanger transferring heat from a small heat source to a moving fluid. The inherent limitation of such a system is that most of the heat transfer to the fluid occurs only in the immediate vicinity of the heat input even though a large surface area heat transfer structure such as fins or small fluid passages is used to enhance the heat transfer within the heat exchanger. The invention adds a heat pipe inside the heat exchanger enclosure and in contact with the heat transfer structure. The heat pipe spreads the incoming heat over a larger part of the surface area of the heat transfer structure and improves the heat transfer to the cooling fluid by furnishing multiple heat transfer locations without adding extra thermal resistance between the heat source and the fluid flow.

Abstract: A modular cooling system (10) is provided for use in an electronics enclosure (12) mounting a plurality of heat generating electronic components (14). The cooling system (10) includes a cooling liquid supply manifold (16), a cooling liquid return manifold (18), and a plurality of cooling modules (20) that are selectively mountable into the electronic enclosure (12). The cooling system (10) also includes a wall (64) fixed in the enclosure to separate the electronic components (14) from the manifolds (16,18) to shield the electronic components (14) from any of the cooling liquid (52) should it leak from the system (10).

Abstract: A modular cooling system (10) is provided for use in an electronics enclosure (12) mounting a plurality of heat generating electronic components (14). The cooling system (10) includes a cooling liquid supply manifold (16), a cooling liquid return manifold (18), and a plurality of cooling modules (20) that are selectively mountable into the electronic enclosure (12). The cooling system (10) also includes a wall (64) fixed in the enclosure to separate the electronic components (14) from the manifolds (16,18) to shield the electronic components (14) from any of the cooling liquid (52) should it leak from the system (10).